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    • 4. 发明授权
    • Piezoresistive pressure sensor with sculpted diaphragm
    • 压电式压力传感器,带雕刻膜片
    • US6006607A
    • 1999-12-28
    • US144118
    • 1998-08-31
    • Janusz BryzekDavid W. BurnsSean S. CahillSteven S. NasiriJames B. Starr
    • Janusz BryzekDavid W. BurnsSean S. CahillSteven S. NasiriJames B. Starr
    • G01L9/00G01L9/06
    • G01L9/0042G01L9/0054
    • The present invention is a semiconductor pressure sensor. In one embodiment, the semiconductor pressure sensor includes a diaphragm having a first thickness and at least cone raised boss that is coupled to a first side of the diaphragm. The at least one raised boss increases the diaphragm thickness in the region occupied by the at least one raised boss to a second thickness. A plurality of piezoresistors are disposed on a second side of the diaphragm in regions of the first thickness. In another embodiment, a semiconductor pressure sensor diaphragm includes at least one raised boss disposed along a central axis on a first side of the diaphragm. At least two raised bridge regions are disposed along the central axis, interconnecting the at least one raised boss and a diaphragm edge. Each raised bridge region is narrower than the raised boss. A plurality of piezoresistors are disposed on the raised bridge regions of the diaphragm along the central axis.
    • 本发明是半导体压力传感器。 在一个实施例中,半导体压力传感器包括具有第一厚度和至少锥形凸起的隔膜,该凸起联接到隔膜的第一侧。 所述至少一个凸起凸台将所述至少一个凸起凸起所占据的区域中的隔膜厚度增加到第二厚度。 多个压电电阻器设置在第一厚度的区域中的隔膜的第二侧上。 在另一个实施例中,半导体压力传感器膜片包括至少一个凸起的凸起部分,其沿着中心轴线设置在隔膜的第一侧上。 至少两个凸起的桥接区域沿着中心轴线布置,将至少一个凸起的凸起和隔膜边缘互连。 每个凸起的桥梁区域比凸起的凸起更窄。 多个压电电阻器沿着中心轴设置在隔膜的凸起的桥接区域上。