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1. 发明授权

US09922921B2 Tape wiring substrate, semiconductor package, and display apparatus including semiconductor package 有权
公开(公告)号：US09922921B2
公开(公告)日：2018-03-20
申请号：US14637385
申请日：2015-03-03
申请人： Jae-min Jung , Na-rae Shin
发明人： Jae-min Jung , Na-rae Shin
IPC分类号： H05K7/00 , H05K1/18 , H01L23/498 , H05K1/00 , H01L23/48 , H01L23/49 , H01L23/00
CPC分类号： H01L23/49838 , H01L23/49811 , H01L23/4985 , H01L23/564 , H01L2224/16225 , H05K1/189 , H05K2201/09781 , H05K2201/10128 , H05K2201/10681
摘要： A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

2. 发明授权

US07893550B2 Semiconductor package comprising alignment members 有权
标题翻译：半导体封装包括对准构件
公开(公告)号：US07893550B2
公开(公告)日：2011-02-22
申请号：US12750915
申请日：2010-03-31
申请人： Na-rae Shin , Dong-han Kim
发明人： Na-rae Shin , Dong-han Kim
IPC分类号： H01L23/544
CPC分类号： H01L23/4985 , H01L23/544 , H01L24/50 , H01L24/86 , H01L2223/5442 , H01L2223/54426 , H01L2223/5448 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014
摘要： A semiconductor package comprising alignment members is provided. The semiconductor package includes a semiconductor die, first connection terminals disposed on a first surface of the semiconductor die, and a tape substrate including a substrate portion, and second connection terminals disposed on the substrate portion and disposed corresponding to the first connection terminals. The semiconductor package further includes a first alignment member disposed on the first surface of the semiconductor die, and a second alignment member disposed on the substrate portion of the tape substrate and disposed corresponding to the first alignment member.
摘要翻译：提供了包括对准构件的半导体封装。半导体封装包括半导体管芯，设置在半导体管芯的第一表面上的第一连接端子和包括基板部分的带基板，以及设置在基板部分上并对应于第一连接端子设置的第二连接端子。半导体封装还包括设置在半导体管芯的第一表面上的第一对准部件和设置在带基板的基板部分上并对应于第一对准部件设置的第二对准部件。

3. 发明授权

US07560805B2 Semiconductor package and method of manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US07560805B2
公开(公告)日：2009-07-14
申请号：US11812307
申请日：2007-06-18
申请人： Young-sang Cho , Na-rae Shin
发明人： Young-sang Cho , Na-rae Shin
IPC分类号： H01L23/02
CPC分类号： H01L29/0657 , H01L23/3185 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10157
摘要： A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.
摘要翻译：封装可以包括安装在薄膜基板上的半导体芯片。其制造方法可以涉及提供半导体芯片。半导体芯片可以包括凹陷和凸起。可以提供包括通孔的薄膜基底。半导体芯片可以插入到薄膜基板的通孔中。可以在膜基板上形成电路布线以接触半导体芯片的凸点。

4. 发明授权

US07508680B2 Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate 有权
标题翻译：可调电感滤波器，包括滤波器的带分配基板和包括带分配基板的显示面板组件
公开(公告)号：US07508680B2
公开(公告)日：2009-03-24
申请号：US11779324
申请日：2007-07-18
申请人： Hee-seok Lee , Yun-seok Choi , Eun-seok Song , Young-sang Cho , Na-rae Shin
发明人： Hee-seok Lee , Yun-seok Choi , Eun-seok Song , Young-sang Cho , Na-rae Shin
IPC分类号： H05K1/16 , H01F27/28 , H01L23/48
CPC分类号： H01F21/12 , H01F41/045 , H05K1/147 , H05K1/165
摘要： An adjustable-inductance (AI) filter, a tape distribution substrate including the filter, and a display panel assembly including the tape distribution substrate are provided. The adjustable-inductance (AI) filter includes a filter distribution line including first and second end portions each having a first line width, at least one repair pattern having a second line width and disposed between the first and second end portions, and at least one unit filter bank connected in parallel to the at least one repair pattern, respectively.
摘要翻译：提供可调电感（AI）滤波器，包括滤波器的带分配基板以及包括带分布基板的显示面板组件。可调电感（AI）滤波器包括滤波器分配线，滤波器分配线包括每个具有第一线宽度的第一和第二端部，具有第二线宽并且设置在第一和第二端部之间的至少一个修复图案，以及至少一个单元滤波器组分别与所述至少一个修复模式并联连接。

5. 发明申请

US20090246914A1 Semiconductor package and method of manufacturing the same 审中-公开
公开(公告)号：US20090246914A1
公开(公告)日：2009-10-01
申请号：US12457277
申请日：2009-06-05
申请人： Young-sang Cho , Na-rae Shin
发明人： Young-sang Cho , Na-rae Shin
IPC分类号： H01L21/50
CPC分类号： H01L29/0657 , H01L23/3185 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10157
摘要： A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.

6. 发明申请

US20080006941A1 Semiconductor package and method of manufacturing the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20080006941A1
公开(公告)日：2008-01-10
申请号：US11812307
申请日：2007-06-18
申请人： Young-sang Cho , Na-rae Shin
发明人： Young-sang Cho , Na-rae Shin
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L29/0657 , H01L23/3185 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10157
摘要： A package may include a semiconductor chip mounted on a film substrate. A method of manufacturing the same may involve providing a semiconductor chip. The semiconductor chip may include recesses and bumps. A film substrate including a through hole may be provided. The semiconductor chip may be inserted into the through hole of the film substrate. Circuit wires may be formed on the film substrate to contact the bumps of the semiconductor chip.
摘要翻译：封装可以包括安装在薄膜基板上的半导体芯片。其制造方法可以涉及提供半导体芯片。半导体芯片可以包括凹陷和凸起。可以提供包括通孔的薄膜基底。半导体芯片可以插入到薄膜基板的通孔中。可以在膜基板上形成电路布线以接触半导体芯片的凸点。

7. 发明授权

US08106425B2 Interconnection substrate, semiconductor chip package including the same, and display system including the same 有权
标题翻译：互连基板，包括其的半导体芯片封装以及包括其的显示系统
公开(公告)号：US08106425B2
公开(公告)日：2012-01-31
申请号：US11819628
申请日：2007-06-28
申请人： Yun-seok Choi , Na-rae Shin , Hee-seok Lee
发明人： Yun-seok Choi , Na-rae Shin , Hee-seok Lee
IPC分类号： H01L23/52
CPC分类号： H05K1/165 , H01L2924/0002 , H05K1/0216 , H05K1/0233 , H05K1/0237 , H05K2201/09236 , H05K2201/09263 , H01L2924/00
摘要： Example embodiments relate to an interconnection substrate and a semiconductor chip package and a display system including the same. The interconnection substrate may include a base film, a signal line provided on the base film, a power line provided on the base film as a line pattern including a plurality of bent portions, and a ground line provided on the base film in parallel with the power line. The interconnection substrate may further include a semiconductor chip provided on the base film, wherein the power, ground, and/or signal lines are electrically connected to the semiconductor chip to form a semiconductor chip package. A display system may include the above semiconductor chip package, a screen displaying an image, and a PCB generating a signal. The semiconductor chip may be connected between the PCB and the screen and relay the generated signal from the PCB to the screen. Use of the power, ground, and/or signal lines having a plurality of bent portions may reduce electromagnetic interference (EMI) within the display system.
摘要翻译：示例性实施例涉及互连衬底和半导体芯片封装以及包括其的显示系统。互连基板可以包括基膜，设置在基膜上的信号线，设置在基膜上的电源线作为包括多个弯曲部的线图案，以及设置在基膜上的与线平行的接地线电源线。互连基板还可以包括设置在基膜上的半导体芯片，其中电源，接地和/或信号线电连接到半导体芯片以形成半导体芯片封装。显示系统可以包括上述半导体芯片封装，显示图像的屏幕和产生信号的PCB。半导体芯片可以连接在PCB和屏幕之间，并将产生的信号从PCB继电器传递到屏幕。使用具有多个弯曲部分的电源，接地和/或信号线可以减少显示系统内的电磁干扰（EMI）。

8. 发明申请

US20080023844A1 Interconnection substrate, semiconductor chip package including the same, and display system including the same 有权
标题翻译：互连基板，包括其的半导体芯片封装以及包括其的显示系统
公开(公告)号：US20080023844A1
公开(公告)日：2008-01-31
申请号：US11819628
申请日：2007-06-28
申请人： Yun-seok Choi , Na-rae Shin , Hee-seok Lee
发明人： Yun-seok Choi , Na-rae Shin , Hee-seok Lee
IPC分类号： H01L23/52
CPC分类号： H05K1/165 , H01L2924/0002 , H05K1/0216 , H05K1/0233 , H05K1/0237 , H05K2201/09236 , H05K2201/09263 , H01L2924/00
摘要： Example embodiments relate to an interconnection substrate and a semiconductor chip package and a display system including the same. The interconnection substrate may include a base film, a signal line provided on the base film, a power line provided on the base film as a line pattern including a plurality of bent portions, and a ground line provided on the base film in parallel with the power line. The interconnection substrate may further include a semiconductor chip provided on the base film, wherein the power, ground, and/or signal lines are electrically connected to the semiconductor chip to form a semiconductor chip package. A display system may include the above semiconductor chip package, a screen displaying an image, and a PCB generating a signal. The semiconductor chip may be connected between the PCB and the screen and relay the generated signal from the PCB to the screen. Use of the power, ground, and/or signal lines having a plurality of bent portions may reduce electromagnetic interference (EMI) within the display system.
摘要翻译：示例性实施例涉及互连衬底和半导体芯片封装以及包括其的显示系统。互连基板可以包括基膜，设置在基膜上的信号线，设置在基膜上的电源线作为包括多个弯曲部的线图案，以及设置在基膜上的与线平行的接地线电源线。互连基板还可以包括设置在基膜上的半导体芯片，其中电源，接地和/或信号线电连接到半导体芯片以形成半导体芯片封装。显示系统可以包括上述半导体芯片封装，显示图像的屏幕和产生信号的PCB。半导体芯片可以连接在PCB和屏幕之间，并将产生的信号从PCB继电器传递到屏幕。使用具有多个弯曲部分的电源，接地和/或信号线可以减少显示系统内的电磁干扰（EMI）。

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