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    • 3. 发明授权
    • Method of cutting a wafer
    • 切割晶片的方法
    • US07863161B2
    • 2011-01-04
    • US12138646
    • 2008-06-13
    • Dae-Sang ChanJun-Young KoWha-Su SinJae-Yong Park
    • Dae-Sang ChanJun-Young KoWha-Su SinJae-Yong Park
    • H01L21/00
    • H01L21/78
    • In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.
    • 在切割晶片的方法中,支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里,拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜,以将拉伸带与半导体芯片分离。 因此,可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。
    • 5. 发明申请
    • METHOD OF CUTTING A WAFER
    • 切割方法
    • US20080311727A1
    • 2008-12-18
    • US12138646
    • 2008-06-13
    • Dae-Sang CHANJun-Young KoWha-Su SinJae-Yong Park
    • Dae-Sang CHANJun-Young KoWha-Su SinJae-Yong Park
    • H01L21/302
    • H01L21/78
    • In a method of cutting a wafer, a supporting member is attached to an upper surface of the wafer on which semiconductor chips are formed. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. The lower surface of the wafer may be plasma-etched to reduce a thickness of the wafer. A tensile tape may be attached to the lower surface of the wafer. Here, the tensile tape includes sequentially stacked tensile films having different tensile modules. The supporting member is then removed. The tensile tape is cooled to increase the tensile modules between the tensile films. The tensile tape is tensed until the tensile films are cut using the tensile modules difference to separate the tensile tape from the semiconductor chips. Thus, the lower surface of the wafer may be plasma-etched without using an etching mask.
    • 在切割晶片的方法中,支撑构件附接到其上形成有半导体芯片的晶片的上表面。 在晶片的下表面沿着晶片的划线通道形成开口。 可以等离子体蚀刻晶片的下表面以减小晶片的厚度。 拉伸带可以附接到晶片的下表面。 这里,拉伸带包括具有不同拉伸模块的顺序堆叠的拉伸膜。 然后移除支撑构件。 拉伸带被冷却以增加拉伸膜之间的拉伸模块。 将拉伸带拉紧直到使用拉伸模块差来切割拉伸膜,以将拉伸带与半导体芯片分离。 因此,可以不使用蚀刻掩模来等离子体蚀刻晶片的下表面。
    • 8. 发明授权
    • Dual panel-type organic electroluminescent display device and method of fabricating the same
    • 双面板型有机电致发光显示装置及其制造方法
    • US07339193B2
    • 2008-03-04
    • US11017777
    • 2004-12-22
    • Jae-Yong Park
    • Jae-Yong Park
    • H01L29/04
    • H01L27/3251H01L27/322H01L51/524H01L51/5259H01L51/5284
    • A dual panel-type organic electroluminescent display device includes first and second substrates facing and spaced apart from each other, an array element layer disposed along an inner surface of the first substrate, the array element including a thin film transistor, a connection pattern disposed on the array element layer and electrically connected to the thin film transistor, a color filter layer disposed along an inner surface of the second substrate, the color filter layer including red, green, and blue color filters, an overcoat layer disposed on the color filter layer, the overcoat layer including a hygroscopic material, an organic electroluminescent diode disposed on the overcoat layer and connected to the connection pattern, the organic electroluminescent diode including a first electrode, an organic light-emitting layer, and a second electrode sequentially formed on the overcoat layer, and the organic light-emitting layer emits substantially monochromatic light, and a seal pattern along peripheral portions between the first and second substrates.
    • 双面板型有机电致发光显示装置包括面对并彼此间隔开的第一和第二基板,沿着第一基板的内表面设置的阵列元件层,阵列元件包括薄膜晶体管,连接图案设置在 所述阵列元件层与所述薄膜晶体管电连接,沿着所述第二基板的内表面设置的滤色器层,所述滤色器层包括红色,绿色和蓝色滤色器,设置在所述滤色器层上的外涂层 所述外涂层包括吸湿材料,设置在外涂层上并连接到连接图案的有机电致发光二极管,所述有机电致发光二极管包括第一电极,有机发光层和顺序地形成在外涂层上的第二电极 并且有机发光层发射基本上单色的光和密封件 沿着第一和第二基板之间的周边部分。
    • 10. 发明授权
    • Dual panel type organic electroluminescent display device and method of fabricating the same
    • 双面板型有机电致发光显示装置及其制造方法
    • US07291972B2
    • 2007-11-06
    • US11020198
    • 2004-12-27
    • Jae-Yong Park
    • Jae-Yong Park
    • H05B33/00
    • H01L27/3251H01L51/524H01L51/5259H01L51/5284
    • An organic electroluminescent device includes first and second substrates spaced apart from each other, the first and second substrates including a first region and a second region, the second region outside the first region and including a concave portion, an array element on an inner surface of the first substrate, the array element including a switching element, an organic electroluminescent diode on an inner surface of the second substrate, a connection electrode electrically connecting the array element and the organic electroluminescent diode, the connection electrode between the first and second substrates, and a bar-type desiccant in the concave portion of the second region between the first and second substrates.
    • 有机电致发光器件包括彼此间隔开的第一和第二衬底,第一和第二衬底包括第一区域和第二区域,第二区域在第一区域外部并且包括凹部,在第一区域的内表面上的阵列元件 所述第一基板,所述阵列元件包括开关元件,所述第二基板的内表面上的有机电致发光二极管,连接所述阵列元件和所述有机电致发光二极管的连接电极,所述第一和第二基板之间的连接电极,以及 在第一和第二基板之间的第二区域的凹部中的棒状干燥剂。