专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09412423B2 Memory modules including plural memory devices arranged in rows and module resistor units 有权
标题翻译：存储器模块，包括排列成行和模块电阻器单元的多个存储器件
公开(公告)号：US09412423B2
公开(公告)日：2016-08-09
申请号：US13827797
申请日：2013-03-14
申请人： Jae-Jun Lee , Do-Hyung Kim , Yong-Jin Kim , Bo-Ra Kim , Jeong-Hoon Baek , Kwang-Seop Kim , Da-Ae Heo
发明人： Jae-Jun Lee , Do-Hyung Kim , Yong-Jin Kim , Bo-Ra Kim , Jeong-Hoon Baek , Kwang-Seop Kim , Da-Ae Heo
IPC分类号： G11C7/00 , G11C5/04
CPC分类号： H03K19/0005 , G11C5/04 , G11C7/00
摘要： A memory module includes a command/address (CA) register, memory devices, and a module resistor unit mounted on a circuit board. The centrally disposed CA register drive the memory devices one or more internal CA signal(s) to arrangements of memory devices using multiple CA transmission lines, wherein the multiple internal CA transmission lines are commonly terminated in the module resistor unit.
摘要翻译：存储器模块包括命令/地址（CA）寄存器，存储器件和安装在电路板上的模块电阻器单元。集中设置的CA寄存器使用多个CA传输线将存储器件一个或多个内部CA信号驱动到存储器件的布置，其中多个内部CA传输线通常在模块电阻器单元中端接。

2. 发明申请

US20130242680A1 MEMORY MODULES 有权
标题翻译：内存模块
公开(公告)号：US20130242680A1
公开(公告)日：2013-09-19
申请号：US13827797
申请日：2013-03-14
申请人： JAE-JUN LEE , Do-Hyung Kim , Yong-Jin Kim , Bo-Ra Kim , Jeong-Hoon Baek , Kwang-Seop Kim , Da-Ae Heo
发明人： JAE-JUN LEE , Do-Hyung Kim , Yong-Jin Kim , Bo-Ra Kim , Jeong-Hoon Baek , Kwang-Seop Kim , Da-Ae Heo
IPC分类号： G11C7/00
CPC分类号： H03K19/0005 , G11C5/04 , G11C7/00
摘要： A memory module includes a command/address (CA) register, memory devices, and a module resistor unit mounted on a circuit board. The centrally disposed CA register drive the memory devices one or more internal CA signal(s) to arrangements of memory devices using multiple CA transmission lines, wherein the multiple internal CA transmission lines are commonly terminated in the module resistor unit.
摘要翻译：存储器模块包括命令/地址（CA）寄存器，存储器件和安装在电路板上的模块电阻器单元。集中设置的CA寄存器使用多个CA传输线将存储器件一个或多个内部CA信号驱动到存储器件的布置，其中多个内部CA传输线通常在模块电阻器单元中端接。

3. 发明申请

US20060207788A1 Memory module and signal line arrangement method thereof 有权
标题翻译：存储模块及其信号线排列方法
公开(公告)号：US20060207788A1
公开(公告)日：2006-09-21
申请号：US11357500
申请日：2006-02-17
申请人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
发明人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
IPC分类号： H05K7/06
CPC分类号： H05K1/181 , G11C5/025 , G11C5/04 , H05K1/112 , H05K2201/10159 , H05K2201/10545 , Y02P70/611 , Y10T29/49128 , Y10T29/49155
摘要： In a memory module and a signal line arrangement method thereof, the memory module comprises: memory chips mounted on both sides of the module in a mirrored configuration; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sides in contact with same signal applying balls of the memory chips in the mirrored configuration, the PCB including a via at a location proximal to the same signal applying contact pad of one side of the PCB among the same signal applying contact pads arranged on both sides in the mirrored configuration, the via connecting an other side of the PCB to the one side of the PCB, and a contact junction connected to the same signal applying contact pad of the other side of the PCB, the contact junction being connected to the via of the other side of the PCB, and the via of the one side of the PCB being connected to the same signal applying contact pad of the one side of the PCB, the contact junction connected to a signal terminal from the other side of the PCB.
摘要翻译：在存储器模块及其信号线布置方法中，存储器模块包括：以镜像配置安装在模块两侧的存储器芯片; 以及具有相同信号的印刷电路板（PCB），其施加布置在两侧的接触焊盘，以与镜像配置中的存储器芯片的相同信号施加球接触，PCB包括位于相邻信号施加接触垫在布置在镜面配置两侧的相同信号施加接触垫中的PCB的一侧，通孔将PCB的另一侧连接到PCB的一侧，以及连接到相同信号的接触点施加接触 PCB的另一侧的焊盘，接触点连接到PCB的另一侧的通孔，并且PCB的一侧的通孔连接到施加与该PCB的一侧的接触焊盘相同的信号 PCB，接触点从PCB的另一侧连接到信号端子。

4. 发明授权

US07390973B2 Memory module and signal line arrangement method thereof 有权
标题翻译：存储模块及其信号线排列方法
公开(公告)号：US07390973B2
公开(公告)日：2008-06-24
申请号：US11357500
申请日：2006-02-17
申请人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
发明人： Chil-Nam Yoon , Kwang-Seop Kim , Do-Hyung Kim , Jae-Jun Lee , Ki-Hyun Ko
IPC分类号： H05K1/16
CPC分类号： H05K1/181 , G11C5/025 , G11C5/04 , H05K1/112 , H05K2201/10159 , H05K2201/10545 , Y02P70/611 , Y10T29/49128 , Y10T29/49155
摘要： The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit board (PCB) having same signal applying contact pads arranged on both sodes which same signal applying balls of the memory chips contact in the mirror form, wherein a via is formed at a location close to the same signal applying contact pad of one side among the same signal applying contact pads arranged on both sides in the mirror form, the via connecting the other side to the signal line of one side, and a signal transmitted from the other side is connected to a contact junction, the contact junction is connected to the same signal applying contact pad of the other side, the contact junction is connected to the via of the other side, and the via of one side is connected to the same signal applying contact pad of one side.
摘要翻译：本发明公开了一种存储模块及其信号线排列方法。存储器模块包括以镜子形式安装在两侧的存储器芯片; 以及具有相同信号的印刷电路板（PCB），其施加布置在两个信号线上的接触焊盘，所述存储器芯片的相同信号施加球以镜子形式接触，其中通孔形成在接近相同信号的位置处，施加接触焊盘在相同的信号中，以镜面形式设置在两侧的接触焊盘的一侧，将另一侧连接到一侧的信号线的通孔，并且从另一侧传输的信号连接到接触接点，接触接点连接到另一侧的相同信号施加接触焊盘，接触点连接到另一侧的通孔，并且一侧的通孔连接到施加一侧接触焊盘的相同信号。

5. 发明授权

US07715200B2 Stacked semiconductor module, method of fabricating the same, and electronic system using the same 有权
标题翻译：叠层半导体模块及其制造方法以及使用其的电子系统
公开(公告)号：US07715200B2
公开(公告)日：2010-05-11
申请号：US12232990
申请日：2008-09-26
申请人： Jung-Chan Cho , Yang-Je Lee , Hyun-Seok Choi , Yong-Hyun Kim , Jung-Hyeon Kim , Hyo-Jae Bang , Do-Hyung Kim , Kyoung-Sun Kim , Young-Ho Lee , Jae-Sang Baik , Yong-Jin Kim
发明人： Jung-Chan Cho , Yang-Je Lee , Hyun-Seok Choi , Yong-Hyun Kim , Jung-Hyeon Kim , Hyo-Jae Bang , Do-Hyung Kim , Kyoung-Sun Kim , Young-Ho Lee , Jae-Sang Baik , Yong-Jin Kim
IPC分类号： H05K1/00
CPC分类号： H05K1/147 , H05K1/117 , H05K1/189 , H05K3/323 , H05K3/361 , H05K3/4691 , H05K2201/042 , H05K2201/056 , H05K2201/09445 , H05K2201/0949 , H05K2201/10159 , H05K2203/1572
摘要： A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
摘要翻译：提供堆叠半导体模块，其制造方法和使用该模块的电子系统。提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。第二突片可以使用导电粘合剂与第三突片组合。第三突片可以电连接到相应的第二突片。

6. 发明申请

US20090129041A1 Stacked semiconductor module, method of fabricating the same, and electronic system using the same 有权
标题翻译：叠层半导体模块及其制造方法以及使用其的电子系统
公开(公告)号：US20090129041A1
公开(公告)日：2009-05-21
申请号：US12232990
申请日：2008-09-26
申请人： Jung-Chan Cho , Yang-Je Lee , Hyun-Seok Choi , Yong-Hyun Kim , Jung-Hyeon Kim , Hyo-Jae Bang , Do-Hyung Kim , Kyoung-Sun Kim , Young-Ho Lee , Jae-Sang Baik , Yong-Jin Kim
发明人： Jung-Chan Cho , Yang-Je Lee , Hyun-Seok Choi , Yong-Hyun Kim , Jung-Hyeon Kim , Hyo-Jae Bang , Do-Hyung Kim , Kyoung-Sun Kim , Young-Ho Lee , Jae-Sang Baik , Yong-Jin Kim
IPC分类号： H05K1/14 , H05K1/00 , H05K7/10
CPC分类号： H05K1/147 , H05K1/117 , H05K1/189 , H05K3/323 , H05K3/361 , H05K3/4691 , H05K2201/042 , H05K2201/056 , H05K2201/09445 , H05K2201/0949 , H05K2201/10159 , H05K2203/1572
摘要： A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
摘要翻译：提供堆叠半导体模块，其制造方法和使用该模块的电子系统。提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。第二突片可以使用导电粘合剂与第三突片组合。第三突片可以电连接到相应的第二突片。

7. 发明授权

US09154895B2 Apparatus of generating multi-channel sound signal 有权
标题翻译：产生多声道声音信号的装置
公开(公告)号：US09154895B2
公开(公告)日：2015-10-06
申请号：US12805121
申请日：2010-07-13
申请人： Chang Yong Son , Do-Hyung Kim , Kang Eun Lee
发明人： Chang Yong Son , Do-Hyung Kim , Kang Eun Lee
IPC分类号： H04S3/00
CPC分类号： H04S3/008
摘要： An apparatus of generating a multi-channel sound signal is provided. The apparatus may include a sound separator to determine a number (N) of sound signals based on at least one of a mixing characteristic and a spatial characteristic of a multi-channel sound signal when receiving the multi-channel sound signal, and to separate the multi-channel sound signal into N sound signals, the sound signals being generated such that the multi-channel sound signal is separated, and a sound synthesizer to synthesize N sound signals to be M sound signals.
摘要翻译：提供一种产生多声道声音信号的装置。该装置可以包括声音分离器，用于当接收多声道声音信号时，基于多声道声音信号的混合特性和空间特性中的至少一个来确定声音信号的数量（N），并且将将多声道声音信号转换为N个声音信号，生成声音信号，使得多声道声音信号被分离，并且声音合成器将N个声音信号合成为M个声音信号。

8. 发明授权

US08610510B2 Limiter circuit and voltage controlled oscillator including the same 有权
标题翻译：限幅器电路和压控振荡器包括相同的
公开(公告)号：US08610510B2
公开(公告)日：2013-12-17
申请号：US13348783
申请日：2012-01-12
申请人： Do-Hyung Kim , Ji-Hyun Kim
发明人： Do-Hyung Kim , Ji-Hyun Kim
IPC分类号： H03K3/03
CPC分类号： H03K3/017 , H03K3/021 , H03L7/0998
摘要： A limiter circuit in a voltage controlled oscillator (VCO) includes a first control circuit, a second control circuit and a driving circuit having a pull-up transistor and a pull-down transistor. The first control circuit generates a first driving control signal for controlling the pull-up transistor based on an AC input signal and a first DC bias voltage. The second control circuit generates a second driving control signal for controlling the pull-down transistor based on the AC input signal and a second DC bias voltage. The driving circuit generates an output signal based on the first driving control signal and the second driving control signal. The output signal swings between a first voltage at the pull-up transistor and a second voltage at the pull-down transistor.
摘要翻译：压控振荡器（VCO）中的限幅电路包括第一控制电路，第二控制电路和具有上拉晶体管和下拉晶体管的驱动电路。第一控制电路基于AC输入信号和第一DC偏置电压产生用于控制上拉晶体管的第一驱动控制信号。第二控制电路产生用于基于AC输入信号和第二DC偏置电压来控制下拉晶体管的第二驱动控制信号。驱动电路基于第一驱动控制信号和第二驱动控制信号生成输出信号。输出信号在上拉晶体管的第一电压和下拉晶体管的第二电压之间摆动。

9. 发明授权

US08569939B2 Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device 有权
标题翻译：具有热管的发光装置及制造用于发光装置的热管引线的方法
公开(公告)号：US08569939B2
公开(公告)日：2013-10-29
申请号：US11575292
申请日：2005-08-26
申请人： Do-Hyung Kim , Moon-Whan Shin , Woong-Joon Hwang , Chung-Hoon Lee
发明人： Do-Hyung Kim , Moon-Whan Shin , Woong-Joon Hwang , Chung-Hoon Lee
IPC分类号： H01J1/02 , H01J7/24 , H01J61/52 , H01K1/58
CPC分类号： H01L33/648 , F28D15/02 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/15724 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a luminous device with a heat pipe formed therein and a heat pipe lead for a luminous device. The present invention provides a luminous device including a heat pipe lead or electrode and a luminous chip mounted onto the heat pipe lead or electrode. The luminous device of the present invention further comprises a heat dissipation member, such as a heat radiating plate or thermoelectric device, installed at an end of the heat pipe lead or electrode. Therefore, through the heat pipe lead or electrode of the present invention, a higher heat dissipation effect greater can be obtained as compared with the conventional one. As a result, it is possible to reduce thermal stress on a luminous device and to prevent the occurrence of a phenomenon in which external impurities penetrate into the luminous device. In addition, the cooling efficiency and the light-emitting efficiency of a luminous chip can be maximized by further disposing a heat dissipation member outside the heat pipe.
摘要翻译：本发明涉及一种其中形成有热管的发光装置和用于发光装置的热管引线。本发明提供了一种发光装置，其包括热管引线或电极以及安装在热管引线或电极上的发光芯片。本发明的发光装置还包括安装在热管引线或电极的端部的诸如散热板或热电装置的散热构件。因此，通过本发明的热管引线或电极，与以往相比，能够得到较大的散热效果。结果，可以降低发光器件上的热应力，并且防止外部杂质渗透到发光器件中的现象的发生。此外，通过在散热管外部进一步布置散热构件，可以使发光芯片的冷却效率和发光效率最大化。

10. 发明授权

US08486643B2 Methods relating to mammalian raptor polypeptide 有权
标题翻译：涉及哺乳动物猛禽多肽的方法
公开(公告)号：US08486643B2
公开(公告)日：2013-07-16
申请号：US12900289
申请日：2010-10-07
申请人： David M. Sabatini , Do-Hyung Kim , Dos Sarbassov
发明人： David M. Sabatini , Do-Hyung Kim , Dos Sarbassov
IPC分类号： G01N33/53 , C07K14/435
CPC分类号： G01N33/5076 , C07K14/4702
摘要： The present invention relates to isolated raptor nucleic acid molecules of mammalian origin (e.g., human) and complements, portions and variants thereof. Another aspect of the invention are isolated raptor polypeptides of mammalian origin and portions thereof, and antibodies or antigen binding fragments thereof that specifically bind a raptor polypeptide. The present invention also relates to constructs and host cells comprising the nucleic acid molecules described herein. In addition, the present invention relates to uses of the nucleic acid and polypeptide molecules provided herein.
摘要翻译：本发明涉及哺乳动物来源的分离的猛禽核酸分子（例如人）及其互补物，部分和变体。本发明的另一方面是哺乳动物来源的分离的猛禽多肽及其部分，以及特异性结合猛禽多肽的抗体或其抗原结合片段。本发明还涉及包含本文所述的核酸分子的构建体和宿主细胞。此外，本发明涉及本文提供的核酸和多肽分子的用途。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式