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1. 发明申请

US20080036055A1 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 有权
标题翻译：半导体封装和使用具有引线锁的引线框的方法，以将引线固定到密封剂
公开(公告)号：US20080036055A1
公开(公告)日：2008-02-14
申请号：US11365246
申请日：2006-03-01
申请人： Jae Yee , Young Chung , Jae Lee , Terry Davis , Chung Han , Jae Ku , Jae Kwak , Sang Ryu
发明人： Jae Yee , Young Chung , Jae Lee , Terry Davis , Chung Han , Jae Ku , Jae Kwak , Sang Ryu
IPC分类号： H01L23/495 , H01L21/98
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49541 , H01L23/49548 , H01L23/49551 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.
摘要翻译：公开了一种用于制造半导体封装的引线框架。引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生制造半导体封装。还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装，和用于支撑引线和连接条的阻挡条。另外的封装实施例包括从引线向下延伸的暴露突起。在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

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