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1. 发明申请

US20120241797A1 LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光二极管，其制造方法，发光二极管模块及其制造方法
公开(公告)号：US20120241797A1
公开(公告)日：2012-09-27
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/50
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

2. 发明授权

US08878216B2 Light emitting diode module and method for manufacturing the same 有权
标题翻译：发光二极管模块及其制造方法
公开(公告)号：US08878216B2
公开(公告)日：2014-11-04
申请号：US13558015
申请日：2012-07-25
申请人： Jae Sung You
发明人： Jae Sung You
IPC分类号： H01L33/00 , H01L21/76 , H01L21/00 , H01L33/48 , H01L33/54
CPC分类号： H01L33/486 , H01L33/54 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A light emitting diode (LED) module includes a substrate, an LED disposed on the substrate, a phosphor layer disposed on the LED, and a lens disposed on the substrate. The substrate has a recess defined therein. The lens is fastened to the substrate through the recess. A manufacturing method for the LED includes forming the recess in the substrate, mounting the LED on the substrate, forming the phosphor layer on the LED, and forming the lens directly on the substrate such that the lens is fastened to the substrate through the recess.
摘要翻译：发光二极管（LED）模块包括基板，设置在基板上的LED，设置在LED上的荧光体层和设置在基板上的透镜。衬底具有限定在其中的凹部。透镜通过凹槽固定到基底。 LED的制造方法包括在基板上形成凹部，将LED安装在基板上，在LED上形成荧光体层，直接在基板上形成透镜，使得透镜通过凹部固定于基板。

3. 发明授权

US08927305B2 Method of manufacturing light emitting device 有权
标题翻译：制造发光器件的方法
公开(公告)号：US08927305B2
公开(公告)日：2015-01-06
申请号：US13562019
申请日：2012-07-30
申请人： Jong Sup Song , Jae Sung You , Tae Gyu Kim
发明人： Jong Sup Song , Jae Sung You , Tae Gyu Kim
IPC分类号： H01L21/00 , H01L33/52 , H01L33/50
CPC分类号： H01L33/52 , H01L33/505 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
摘要： There is provided a method of manufacturing a light emitting device, the method including: mounting a plurality of light emitting devices on an adhesive layer; arranging upper surfaces of the plurality of light emitting devices to be disposed horizontally using a pressing member; forming a wavelength conversion part covering the plurality of light emitting devices on the adhesive layer by applying a resin including at least one phosphor material; planarizing an upper surface of the wavelength conversion part using the pressing member; and separating the adhesive layer from the plurality of light emitting devices.
摘要翻译：提供一种制造发光器件的方法，该方法包括：将多个发光器件安装在粘合剂层上; 使用按压构件将多个发光装置的上表面布置成水平布置; 通过施加包括至少一种荧光体材料的树脂来形成覆盖所述粘合剂层上的所述多个发光器件的波长转换部分; 使用所述按压部件对所述波长转换部的上表面进行平面化; 以及从所述多个发光器件分离所述粘合剂层。

4. 发明授权

US08841693B2 Light emitting device package and manufacturing method thereof 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US08841693B2
公开(公告)日：2014-09-23
申请号：US13427575
申请日：2012-03-22
申请人： Jae Sung You , Young Hee Song
发明人： Jae Sung You , Young Hee Song
IPC分类号： H01L33/00 , H01L33/50 , H01L23/00 , H01L33/64 , H01L33/62 , H01L33/48
CPC分类号： H01L33/505 , H01L24/32 , H01L33/486 , H01L33/504 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/15787 , H01L2933/0033 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： There is provided a light emitting device package including: a substrate having a cavity formed therein; a heat sink provided on a bottom surface of the cavity to be adjacent to an inner wall of the cavity; a light emitting device mounted on the heat sink; and a phosphor layer provided within the cavity and covering the heat sink and the light emitting device.
摘要翻译：提供了一种发光器件封装，包括：其中形成有腔的衬底; 散热器，设置在所述空腔的底表面上以与所述空腔的内壁相邻; 安装在散热器上的发光器件; 以及设置在所述腔内并覆盖所述散热器和所述发光器件的荧光体层。

5. 发明授权

US08785953B2 Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof 有权
标题翻译：发光二极管及其制造方法，发光二极管模块及其制造方法
公开(公告)号：US08785953B2
公开(公告)日：2014-07-22
申请号：US13428726
申请日：2012-03-23
申请人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
发明人： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
摘要翻译：提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

6. 发明申请

US20120168798A1 LED PACKAGE 审中-公开
标题翻译： LED封装
公开(公告)号：US20120168798A1
公开(公告)日：2012-07-05
申请号：US13226090
申请日：2011-09-06
申请人： Cheon Ho Park , Jae Sung You
发明人： Cheon Ho Park , Jae Sung You
IPC分类号： H01L33/58
CPC分类号： H01L33/58
摘要： A light emitting device (LED) package is disclosed. The light emitting device package includes a light emitting device, a substrate on which the light emitting device is mounted in plural; and a lens mounted on the substrate so as to cover and seal the light emitting device and having an accommodating groove formed in a lower surface thereof contacting the substrate, the accommodating groove accommodating the light emitting device, and a concave portion formed in an upper surface thereof in such a manner as to be disposed at a position corresponding to the light emitting device, wherein the concave portion has a radius of curvature on an optical axis of the lens and is formed to be depressed from the upper surface to the lower surface.
摘要翻译：公开了一种发光器件（LED）封装。发光器件封装包括发光器件，多个安装有发光器件的衬底; 以及安装在基板上的透镜，以覆盖和密封发光器件，并且具有形成在其与接触基板的下表面中的容纳槽，容纳发光器件的容纳槽和形成在上表面中的凹部其设置在与发光装置相对应的位置，其中凹部具有在透镜的光轴上的曲率半径，并且形成为从上表面到下表面压下。

7. 发明授权

US08960932B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08960932B2
公开(公告)日：2015-02-24
申请号：US13436102
申请日：2012-03-30
申请人： Jae Sung You , Jong Sup Song
发明人： Jae Sung You , Jong Sup Song
IPC分类号： F21V9/16 , H01L33/50 , H01L25/075 , H01L33/54 , H01L33/58
CPC分类号： H01L25/0753 , G02B19/0014 , G02B19/0066 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes: a substrate having a bar shape; a plurality of light emitting elements separately mounted in a lengthwise direction of the substrate on an upper surface of the substrate; and a light-transmissive cover formed to be upwardly convex, having one or more localized concave portions, and installed on the substrate to cover at least two of the plurality of light emitting elements together.
摘要翻译：发光器件包括：具有条形的衬底; 多个发光元件，分别安装在基板的上表面上的基板的长度方向上; 以及形成为向上凸起的具有一个或多个局部凹部的透光性盖，并且安装在所述基板上以将所述多个发光元件中的至少两个覆盖在一起。

8. 发明授权

US08896018B2 Vacuum tray and method of manufacturing light emitting device using the same 有权
标题翻译：真空托盘及使用其的制造发光装置的方法
公开(公告)号：US08896018B2
公开(公告)日：2014-11-25
申请号：US13483768
申请日：2012-05-30
申请人： Jong Sup Song , Tae Gyu Kim , Jae Sung You
发明人： Jong Sup Song , Tae Gyu Kim , Jae Sung You
IPC分类号： H01L33/00 , B25B11/00 , H01L33/50
CPC分类号： H01L33/505 , B25B11/005 , H01L2933/0041
摘要： There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.
摘要翻译：提供包括袋部的真空托盘; 从所述口袋部的底面向下方突出并具有安置在其中的发光装置的座部; 以及空腔部分，其从所述就座部分的边缘向下阶梯并且容纳有所述发光装置的电极端子。口袋部分可以包括具有矩阵结构的多个口袋部件，使得多个袋部件以列和列排列。

9. 发明授权

US08757833B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US08757833B2
公开(公告)日：2014-06-24
申请号：US13411094
申请日：2012-03-02
申请人： Jae Sung You
发明人： Jae Sung You
IPC分类号： F21V1/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2933/0058 , H01L2924/00014
摘要： There is provided a light emitting device package, including at least one light emitting device; a lead frame electrically connected to the light emitting device; a body part supporting the light emitting device and the lead frame and including a cavity opened so as to expose the light emitting device and the lead frame; a reflecting part fitted and fixed into the cavity so as to surround the light emitting device; and a sealing part filled in the reflecting part and sealing the light emitting device.
摘要翻译：提供了一种发光器件封装，包括至少一个发光器件; 电连接到所述发光器件的引线框架; 支撑所述发光装置和所述引线框架的主体部分，并且包括敞开以使所述发光装置和所述引线框架露出的空腔; 反射部分，其被安装并固定到所述腔中以围绕所述发光器件; 以及填充在反射部中并密封发光器件的密封部。

10. 发明授权

US08740398B2 Camera flash module 有权
标题翻译：相机闪光灯模块
公开(公告)号：US08740398B2
公开(公告)日：2014-06-03
申请号：US13540127
申请日：2012-07-02
申请人： Jae Sung You
发明人： Jae Sung You
IPC分类号： G03B15/02 , F21V5/00
CPC分类号： G03B15/05 , G03B2215/0582 , G03B2215/0592
摘要： A camera flash module is provided. The camera flash module may include a lens having a single refractive surface and a reflector that adjusts a direction of a light emitted from the lens. Accordingly, maintaining of a distance between a light emitting device and the lens may not be needed and thus, the camera flash module may be readily manufactured and a productivity may be improved. An error rate caused by distortion in a tilt and an optical axis between the light emitting device and the lens may be reduced. The reflector may adjust a direction of a light emitted from the lens and thus, an emission pattern requested by a camera may be satisfied, and a velocity of light may be improved. The reflector may surround the lens and thus, may prevent the lens from being detached from a light emitting device package body when an external impact occurs.
摘要翻译：提供相机闪光灯模块。相机闪光灯模块可以包括具有单个折射表面的透镜和调节从透镜发射的光的方向的反射器。因此，可能不需要维持发光装置和透镜之间的距离，因此，可以容易地制造照相机闪光模块并且可以提高生产率。可以减少由发光器件和透镜之间的倾斜和光轴的失真引起的误差率。反射器可以调节从透镜发射的光的方向，从而可以满足由照相机请求的发射图案，并且可以提高光速。反射器可以围绕透镜，因此，当外部冲击发生时，可以防止透镜从发光器件封装体脱离。

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