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1. 发明申请

US20110163064A1 CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME 失效
标题翻译：用于制造印刷电路板的承载件，其制造方法和使用其制造印刷电路板的方法
公开(公告)号：US20110163064A1
公开(公告)日：2011-07-07
申请号：US12716193
申请日：2010-03-02
申请人： Jae Joon LEE , Jin Yong Ahn , Suk Hyeon Cho , Ki Hwan Kim , Seok Kyu Lee
发明人： Jae Joon LEE , Jin Yong Ahn , Suk Hyeon Cho , Ki Hwan Kim , Seok Kyu Lee
IPC分类号： C23F1/00 , B32B15/00 , B32B37/00 , B32B38/10
CPC分类号： H05K3/007 , B32B3/10 , B32B3/14 , B32B3/18 , B32B7/04 , B32B15/00 , B32B15/043 , B32B15/08 , B32B15/20 , B32B27/08 , B32B2457/08 , H05K3/0097 , H05K3/205 , H05K2201/0355 , Y10T156/10 , Y10T156/1052 , Y10T428/12 , Y10T428/12229 , Y10T428/12264 , Y10T428/12271 , Y10T428/161 , Y10T428/19 , Y10T428/192 , Y10T428/239 , Y10T428/24917
摘要： Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
摘要翻译：公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体，包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

2. 发明授权

US08563141B2 Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same 失效
标题翻译：用于制造印刷电路板的载体，其制造方法和使用其制造印刷电路板的方法
公开(公告)号：US08563141B2
公开(公告)日：2013-10-22
申请号：US12716193
申请日：2010-03-02
申请人： Jae Joon Lee , Jin Yong Ahn , Suk Hyeon Cho , Ki Hwan Kim , Seok Kyu Lee
发明人： Jae Joon Lee , Jin Yong Ahn , Suk Hyeon Cho , Ki Hwan Kim , Seok Kyu Lee
IPC分类号： B21C1/00
CPC分类号： H05K3/007 , B32B3/10 , B32B3/14 , B32B3/18 , B32B7/04 , B32B15/00 , B32B15/043 , B32B15/08 , B32B15/20 , B32B27/08 , B32B2457/08 , H05K3/0097 , H05K3/205 , H05K2201/0355 , Y10T156/10 , Y10T156/1052 , Y10T428/12 , Y10T428/12229 , Y10T428/12264 , Y10T428/12271 , Y10T428/161 , Y10T428/19 , Y10T428/192 , Y10T428/239 , Y10T428/24917
摘要： Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
摘要翻译：公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体，包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

3. 发明申请

US20110048786A1 PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有BUMP的印刷电路板及其制造方法
公开(公告)号：US20110048786A1
公开(公告)日：2011-03-03
申请号：US12870137
申请日：2010-08-27
申请人： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
发明人： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/4015 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2201/10242 , H05K2203/0338 , Y10T29/49155
摘要： Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
摘要翻译：这里公开了具有凹凸的印刷电路板及其制造方法。具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

4. 发明授权

US08435376B2 Carrier for manufacturing substrate and method of manufacturing substrate using the same 失效
标题翻译：用于制造基板的载体和使用其的制造基板的方法
公开(公告)号：US08435376B2
公开(公告)日：2013-05-07
申请号：US12787300
申请日：2010-05-25
申请人： Jin Ho Kim , Jin Yong Ahn , Ki Hwan Kim , Byung Moon Kim , Seok Kyu Lee
发明人： Jin Ho Kim , Jin Yong Ahn , Ki Hwan Kim , Byung Moon Kim , Seok Kyu Lee
IPC分类号： B29C65/02 , B29C65/52 , B29C63/26 , B32B37/26 , B32B38/10
CPC分类号： H05K13/04 , B32B2457/08 , H05K3/0097 , H05K3/4682 , H05K2203/1536 , H05K2203/1572 , Y10T156/1043 , Y10T156/1142 , Y10T428/2804
摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.
摘要翻译：本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以更稳定地进行。

5. 发明申请

US20110159282A1 CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME 失效
标题翻译：用于制造基板的承载件及其制造方法
公开(公告)号：US20110159282A1
公开(公告)日：2011-06-30
申请号：US12787300
申请日：2010-05-25
申请人： Jin Ho KIM , Jin Yong Ahn , Ki Hwan Kim , Byung Moon Kim , Seok Kyu Lee
发明人： Jin Ho KIM , Jin Yong Ahn , Ki Hwan Kim , Byung Moon Kim , Seok Kyu Lee
IPC分类号： B32B7/12 , B32B38/10 , B32B38/00 , B32B37/02
CPC分类号： H05K13/04 , B32B2457/08 , H05K3/0097 , H05K3/4682 , H05K2203/1536 , H05K2203/1572 , Y10T156/1043 , Y10T156/1142 , Y10T428/2804
摘要： Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.
摘要翻译：本文公开了一种用于制造基板的载体，包括：基板; 形成在基板的一侧或两侧的粘合剂层; 每个粘合剂层的一侧的辅助粘合剂层具有比每个粘合剂层更小的面积，并且具有比每个粘合剂层更低的粘附性; 以及金属层，其各自形成在每个辅助粘合剂层的一侧上，其边缘附着到粘合剂层，并且除了边缘之外的其它部分附着到辅助粘合剂层。载体的优点在于，金属层和辅助粘合剂层通过辅助粘合剂层的粘合性彼此附接，使得不需要使用真空吸附，结果是制造基材的工艺可以更稳定地进行。

6. 发明申请

US20100096171A1 Printed circuit board having round solder bump and method of manufacturing the same 审中-公开
标题翻译：具有圆形焊料凸块的印刷电路板及其制造方法
公开(公告)号：US20100096171A1
公开(公告)日：2010-04-22
申请号：US12320366
申请日：2009-01-23
申请人： Seok Kyu Lee , Jae Joon Lee , Ki Hwan Kim
发明人： Seok Kyu Lee , Jae Joon Lee , Ki Hwan Kim
IPC分类号： H05K1/09 , B32B38/10 , H05K1/11
CPC分类号： H05K3/3484 , H05K3/244 , H05K3/282 , H05K3/4007 , H05K3/4682 , H05K2201/09472 , H05K2201/09481 , H05K2203/0152 , H05K2203/0338 , H05K2203/043
摘要： Disclosed herein is a printed circuit board having round solder bumps and a method of manufacturing the same. The solder bump is configured to have a round connecting surface in contact with a pad, and thus have an increased contact area with respect to the pad, thus improving connection reliability. The solder bumps have uniform heights.
摘要翻译：这里公开了具有圆形焊料凸块的印刷电路板及其制造方法。焊料凸块被构造成具有与焊盘接触的圆形连接表面，因此相对于焊盘具有增加的接触面积，从而提高连接可靠性。焊料凸点具有均匀的高度。

7. 发明授权

US08634366B2 Method and apparatus for transmitting signals segmentation 失效
标题翻译：用于传输信号分割的方法和装置
公开(公告)号：US08634366B2
公开(公告)日：2014-01-21
申请号：US13139717
申请日：2009-11-10
申请人： Ki Hwan Kim , Jae Hoon Chung , Yeong Hyeon Kwon
发明人： Ki Hwan Kim , Jae Hoon Chung , Yeong Hyeon Kwon
IPC分类号： H04W4/00 , H04B7/216 , H04J3/24 , G08C25/02
CPC分类号： H04L1/0042 , H04B7/0426 , H04B7/0617 , H04L1/0057 , H04L1/0067 , H04L1/1812 , H04L27/2601
摘要： A method for transmitting a transport block includes segmenting the transport block into code blocks corresponding in number to a multiple of the number of layers to be used for the transmission of the transport block, attaching a Cyclic Redundancy Check (CRC) to the segmented code blocks, sequentially mapping the code blocks to which the CRC has been attached to at least one layer according to a predetermined mapping rule, and transmitting the code blocks.
摘要翻译：一种用于发送传输块的方法包括：将传输块分割为与要用于传输块的传输的层数的倍数相对应的码块，将循环冗余校验（CRC）附加到分段的码块根据预定的映射规则顺序地将已经附加了CRC的代码块映射到至少一个层，并且发送代码块。

8. 发明授权

US08219877B2 Method and apparatus for transmitting uplink data in a wireless access system 有权
标题翻译：一种在无线接入系统中发送上行链路数据的方法和装置
公开(公告)号：US08219877B2
公开(公告)日：2012-07-10
申请号：US12191939
申请日：2008-08-14
申请人： Ki Hwan Kim , Young Seob Lee , Seung Hyun Kang , Jae Hoon Chung
发明人： Ki Hwan Kim , Young Seob Lee , Seung Hyun Kang , Jae Hoon Chung
IPC分类号： G06F11/00
CPC分类号： H04L1/0061 , G06F11/1004 , H03M13/091 , H04L1/0065 , H04L1/0083
摘要： A method of transmitting data in a wireless access system is disclosed. The method includes various processes of obtaining the number of code blocks in consideration of an error detection code which is to be attached to each code block, calculating the size of the code blocks, segmenting input data, and channel-coding the code blocks, thereby efficiently transmitting data.
摘要翻译：公开了一种在无线接入系统中发送数据的方法。该方法包括考虑要附加到每个代码块的错误检测代码，计算代码块的大小，分割输入数据和对代码块进行通道编码从而获得代码块的数量的各种处理，由此有效地传输数据。

9. 发明授权

US08208944B2 Dual mode terminal supporting location-based services and control method for the same 有权
标题翻译：双模终端支持基于位置的服务和控制方法相同
公开(公告)号：US08208944B2
公开(公告)日：2012-06-26
申请号：US12829336
申请日：2010-07-01
申请人： Ki Hwan Kim , Seong Jin Park , Woo Yol Kim
发明人： Ki Hwan Kim , Seong Jin Park , Woo Yol Kim
IPC分类号： H04W24/00
CPC分类号： H04W88/06 , G01S19/258 , H04W4/02
摘要： A dual mode terminal for providing location-based services is provided. The dual mode terminal includes a first area including a first wireless communication unit for communication with a first communication network and a first processor for processing signals transmitted and received to and from the first communication network, and a second area including a second wireless communication unit for communication with a second communication network and a second processor for processing signals transmitted and received to and from the second communication network. The first wireless communication unit includes a GPS receiver for receiving satellite GPS signals. The first processor includes a GPS engine for processing network location information received from the first communication network and the second communication network, and the second processor transfers network location information received from the second communication network to the first processor.
摘要翻译：提供了一种用于提供基于位置的服务的双模终端。双模终端包括：第一区域，包括用于与第一通信网络通信的第一无线通信单元和用于处理从第一通信网络发送和接收信号的第一处理器;以及第二区域，包括第二无线通信单元，用于与第二通信网络和第二处理器的通信，用于处理从第二通信网络发送和接收的信号。第一无线通信单元包括用于接收卫星GPS信号的GPS接收器。第一处理器包括用于处理从第一通信网络和第二通信网络接收的网络位置信息的GPS引擎，并且第二处理器将从第二通信网络接收的网络位置信息传送到第一处理器。

10. 发明申请

US20110318480A1 Method of manufacturing substrate using a carrier 失效
标题翻译：使用载体制造衬底的方法
公开(公告)号：US20110318480A1
公开(公告)日：2011-12-29
申请号：US13137631
申请日：2011-08-30
申请人： Ki Hwan Kim , Jin Yong An , Myung Sam Kang
发明人： Ki Hwan Kim , Jin Yong An , Myung Sam Kang
IPC分类号： H05K3/00
CPC分类号： H05K3/0097 , H05K3/0052 , H05K3/20 , H05K3/4644 , H05K3/4682 , H05K2203/0156 , H05K2203/1536
摘要： A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.
摘要翻译：使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

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