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1. 发明申请

US20080196927A1 Working panel for multilayer printed circuit board 审中-公开
标题翻译：多层印刷电路板工作面板
公开(公告)号：US20080196927A1
公开(公告)日：2008-08-21
申请号：US12004421
申请日：2007-12-21
申请人： Jae Joon Lee , Han Kim , Il Soung Yoon , Seung Hyun Cho
发明人： Jae Joon Lee , Han Kim , Il Soung Yoon , Seung Hyun Cho
IPC分类号： H05K1/00
CPC分类号： H05K3/0097 , H05K1/0271 , H05K3/0052 , H05K3/4644 , H05K2201/068 , H05K2201/09136 , H05K2203/1572
摘要： Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in the opposite order with respect to each other, are appropriately disposed, by which the working panel can resist warpage due to thermal stress applied during the substrate fabrication process, thus imparting industrially useful effects that promise improvements in the standardization, productivity and yield of products.
摘要翻译：公开了一种用于多层印刷电路板的工作面板。用于多层印刷电路板的工作面板被构造成使得具有电路层和绝缘层的第一和第二条带以相对于彼此相反的顺序层叠在芯的上侧和下侧上适当设置，通过该工作面板可以抵抗由于在基板制造工艺期间施加的热应力而产生的翘曲，从而赋予产品的标准化，生产率和产量提高的工业上有用的效果。

2. 发明申请

US20070286693A1 Drill bit for PCB 审中-公开
标题翻译：钻头用于PCB
公开(公告)号：US20070286693A1
公开(公告)日：2007-12-13
申请号：US11727629
申请日：2007-03-27
申请人： Seung Hyun Cho , Han Kim , Sun Joong Ryu , Il Soung Yoon
发明人： Seung Hyun Cho , Han Kim , Sun Joong Ryu , Il Soung Yoon
IPC分类号： B23D77/00
CPC分类号： B23B51/02 , B23B41/14 , B23B51/08 , B23B2228/36 , B23D77/00 , B23D77/12 , H05K3/0047 , H05K2203/1476 , Y10T408/909
摘要： Disclosed is a drill bit for making a hole through stacked PCBs includes a drill part formed with drilling edges on an outer surface thereof and brought into contact with the PCBs, that is, a workpiece in which to make the hole; a reamer part formed on the rear end of the drill part and having at least one reaming edge for finishing the surface of the hole; and a shank part formed on the rear end of the reamer part and mounted to a machine tool.
摘要翻译：公开了一种用于通过堆叠的PCB制造孔的钻头，其包括在其外表面上形成有钻孔边缘并与PCB接触的钻头部分，即在其中制造孔的工件; 钻孔部分，其形成在钻头部分的后端，并且具有至少一个用于完成孔表面的铰孔边缘; 以及形成在扩孔器部分的后端上并安装到机床上的柄部分。

3. 发明申请

US20110182684A1 MICRO DRILL AND METHOD OF FABRICATING THE SAME 有权
标题翻译：微型钻孔及其制造方法
公开(公告)号：US20110182684A1
公开(公告)日：2011-07-28
申请号：US13003293
申请日：2009-06-23
申请人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
发明人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
IPC分类号： B23B51/00 , B21K5/04
CPC分类号： B22F7/062 , B22F2005/001 , B22F2998/00 , B23B51/02 , B23B2251/426 , B23P15/32 , C22C38/08 , Y10T408/03 , Y10T408/78 , Y10T408/907 , Y10T408/9097 , B22F2207/20 , B22F5/06 , B22F5/10
摘要： A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.
摘要翻译：一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件粉末紧凑。

4. 发明授权

US08834077B2 Micro drill and method of fabricating the same 有权
标题翻译：微型钻头及其制造方法
公开(公告)号：US08834077B2
公开(公告)日：2014-09-16
申请号：US13003293
申请日：2009-06-23
申请人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
发明人： Tae Sik Yoon , Soon Jin Cho , Seung Hyun Cho , Jae Joon Lee
IPC分类号： B23B51/02 , B23P15/32 , C22C38/08 , B22F7/06 , B22F5/00
CPC分类号： B22F7/062 , B22F2005/001 , B22F2998/00 , B23B51/02 , B23B2251/426 , B23P15/32 , C22C38/08 , Y10T408/03 , Y10T408/78 , Y10T408/907 , Y10T408/9097 , B22F2207/20 , B22F5/06 , B22F5/10
摘要： A method of fabricating a micro drill, which includes a drill part for machining a hole and a shank part fixed to a motor, the drill part and the shank part being made of different materials. The method includes the steps of forming a drill part-forming powder compact having a recess in one end thereof, and forming a shank part-forming powder compact having a protrusion, the protrusion intended to be fitted into the recess of the drill part-forming powder compact, forming an assembly of the drill part-forming powder compact and the shank part-forming powder compact, with the protrusion fitted into the recess, and simultaneously sintering the assembly of the drill part-forming powder compact and the shank part-forming powder compact.
摘要翻译：一种微钻的制造方法，其特征在于，包括用于加工孔的钻头部和固定于马达的柄部，所述钻头部和所述柄部由不同的材料构成。该方法包括以下步骤：在其一端形成具有凹部的钻头成形粉末压块，并且形成具有突出部的柄部形成用粉末压块，所述突起旨在嵌入到钻头成形用凹部粉末压块，形成钻头成形粉末压块和柄部分成型粉末压块的组件，突起嵌入凹槽中，同时烧结钻头成形粉末压块和柄部分成型的组件粉末紧凑。

5. 发明申请

US20100132982A1 Package substrate including solder resist layer having pattern parts and method of fabricating the same 审中-公开
标题翻译：封装衬底，包括具有图案部件的阻焊层及其制造方法
公开(公告)号：US20100132982A1
公开(公告)日：2010-06-03
申请号：US12379687
申请日：2009-02-26
申请人： Seung Hyun Cho , Je Gwang Yoo , Tae Eun Chang , Sang Soo Lee , Jung Woo Lee , Dae Young Lee , Jae Joon Lee
发明人： Seung Hyun Cho , Je Gwang Yoo , Tae Eun Chang , Sang Soo Lee , Jung Woo Lee , Dae Young Lee , Jae Joon Lee
IPC分类号： H05K1/00 , B05D5/12 , H01B13/00
CPC分类号： H05K1/0209 , H01L21/563 , H01L23/49827 , H01L23/49894 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K3/285 , H05K3/3436 , H05K3/3452 , H05K2201/0209 , H05K2201/09045 , H05K2201/0959 , H01L2924/00
摘要： Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.
摘要翻译：公开了一种包括具有图案部分的阻焊层及其制造方法的封装基板，其中，图案部分形成在阻焊层上，从而增加散热效率并使基板翘曲最小化。

6. 发明授权

US08531117B2 Lighting apparatus using PN junction light-emitting element 失效
标题翻译：使用PN结发光元件的照明装置
公开(公告)号：US08531117B2
公开(公告)日：2013-09-10
申请号：US13081621
申请日：2011-04-07
申请人： Seung Hyun Cho , Ji Wan Kim
发明人： Seung Hyun Cho , Ji Wan Kim
IPC分类号： H05B37/00 , H05B39/00 , H05B41/00
CPC分类号： H05B33/0809 , H05B33/083
摘要： The present disclosure discloses a lighting apparatus using a PN junction light-emitting element, the apparatus comprising: a power transmitting substrate; PN junction light-emitting elements mounted on the power transmitting substrate; circuit elements mounted on the power transmitting substrate and controlling power provided to the PN junction light-emitting elements; and a top cover covering the circuit elements and forward reflecting light emitted by the PN junction light-emitting elements.
摘要翻译：本公开公开了一种使用PN结发光元件的照明装置，该装置包括：电力传输基板; PN结发光元件安装在电力传输基板上; 电路元件安装在电力传输基板上并控制提供给PN结发光元件的功率; 以及覆盖电路元件的顶盖和由PN结发光元件发射的正反射光。

7. 发明授权

US07875340B2 Heat radiation substrate having metal core and method of manufacturing the same 有权
标题翻译：具有金属芯的散热基板及其制造方法
公开(公告)号：US07875340B2
公开(公告)日：2011-01-25
申请号：US12003490
申请日：2007-12-26
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
IPC分类号： H05K1/00
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
摘要翻译：本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。

8. 发明申请

US20100244591A1 Method and apparatus for monitoring wall thinning of a pipe using magnetostrictive transducers and variation of dispersion characteristics of broadband multimode shear horizontal (SH) waves 有权
标题翻译：使用磁致伸缩传感器监测管道壁变薄的方法和装置以及宽带多模剪切水平（SH）波的色散特性的变化
公开(公告)号：US20100244591A1
公开(公告)日：2010-09-30
申请号：US12462630
申请日：2009-08-06
申请人： Seung Hyun Cho , Hyu Sang Kwon , Bong Young Ahn , Seung Seok Lee
发明人： Seung Hyun Cho , Hyu Sang Kwon , Bong Young Ahn , Seung Seok Lee
IPC分类号： H01L41/12 , G01N29/04
CPC分类号： H01L41/125
摘要： Magnetostrictive transducers for monitoring wall thinning in a pipe, and an apparatus and method for monitoring wall thinning in a pipe using magnetostrictive transducers are provided. The magnetostrictive transducers generate broadband multimode shear horizontal (SH) waves, and allow the generated SH waves to travel along the pipe, thus correctly monitoring a status of the wall thinning of the pipe. The apparatus includes a transmitting transducer which is installed outside of a pipe and generates shear horizontal (SH) waves traveling along the pipe, a receiving transducer which is spaced apart from the transmitting transducer and measures the shear horizontal (SH) waves traveling along the pipe, and a controller for monitoring wall thinning of the pipe by exciting and measuring output signals of the transmitting and receiving transducers.
摘要翻译：提供用于监测管道中的壁变薄的磁致伸缩传感器，以及用于使用磁致伸缩换能器监测管道中的壁变薄的装置和方法。磁致伸缩传感器产生宽带多模剪切水平（SH）波，并允许产生的SH波沿着管道行进，从而正确地监测管壁的变薄状态。该装置包括一个安装在管道外部并产生沿着管道行进的剪切水平（SH）波的发射换能器，一个与发射传感器间隔开的接收换能器，并测量沿管道行进的剪切水平（SH）波以及控制器，用于通过激发和测量发射和接收换能器的输出信号来监测管壁的变薄。

9. 发明授权

US07580441B2 Athermal external cavity laser 有权
标题翻译：热外腔激光器
公开(公告)号：US07580441B2
公开(公告)日：2009-08-25
申请号：US11634792
申请日：2006-12-05
申请人： Jie Hyun Lee , Mahn Yong Park , Geon Jeong , Chul Young Kim , Seung Hyun Cho , Woo Ram Lee , Byoung Whi Kim
发明人： Jie Hyun Lee , Mahn Yong Park , Geon Jeong , Chul Young Kim , Seung Hyun Cho , Woo Ram Lee , Byoung Whi Kim
IPC分类号： H01S3/08
CPC分类号： H01S5/146 , G02B6/0218 , G02B6/0219 , G02B6/4206 , H01S5/02284 , H01S5/02288 , H01S5/0654 , H01S5/141 , H01S5/142
摘要： Provided is an athermal external cavity laser (ECL), whose output optical power and output wavelength can be kept regular irrespective of temperature changes without using additional temperature controlling components. The ECL comprises: a semiconductor amplifier; an optical fiber comprising a core in which a Bragg grating is formed and a cladding surrounding the core; and a thermosetting polymer that fixes the optical fiber to a ferrule and has a negative thermooptical coefficient, wherein the thickness of the cladding surrounding the core in which the Bragg grating is formed is smaller than the portion of the cladding surrounding the portion of the core where the Bragg grating is not formed, and the thermosetting polymer the negative thermooptical coefficient surrounds the cladding. The ECL does not need additional temperature controlling components and thus can be manufactured compact and at low cost, and thus can be used as a light source of a dense wavelength division multiplexing (DWDM) system in designing economical WDM passive optical networks (PON).
摘要翻译：提供了一种无热外腔激光器（ECL），其输出光功率和输出波长可以在不使用额外的温度控制部件的情况下保持规则，而不管温度变化。 ECL包括：半导体放大器; 包括其中形成布拉格光栅的芯和围绕所述芯的包层的光纤; 以及热固性聚合物，其将光纤固定到套圈并且具有负热光学系数，其中形成布拉格光栅的芯周围的包层的厚度小于围绕芯的部分的包层部分的厚度，不形成布拉格光栅，并且热固性聚合物的负热光学系数围绕包层。 ECL不需要额外的温度控制部件，因此可以制造成本小，成本低，因此可以用作密集波分复用（DWDM）系统的光源，用于设计经济的WDM无源光网络（PON）。

10. 发明授权

US07421164B2 Method for fabricating laser diode having optical fiber Bragg grating as front mirror of external resonator and laser diode fabricated thereby 失效
标题翻译：制造具有光纤布拉格光栅作为外部谐振器的前反射镜的激光二极管的方法和由此制造的激光二极管
公开(公告)号：US07421164B2
公开(公告)日：2008-09-02
申请号：US11296817
申请日：2005-12-07
申请人： Seung Hyun Cho , Woo Ram Lee , Jae Dong Park , Byoung Whi Kim
发明人： Seung Hyun Cho , Woo Ram Lee , Jae Dong Park , Byoung Whi Kim
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4239 , G02B6/4253 , G02B6/4255 , G02B6/4267 , G02B6/4268 , H01S5/02212 , H01S5/02284 , H01S5/146
摘要： A method for fabricating a laser includes preparing an optical fiber including the optical fiber Bragg grating formed at a region thereof, and a ferrule provided with a cylindrical free space penetrating both ends thereof; applying a first thermal epoxy resin to a partial region of the outer cylindrical surface of the other region of the optical fiber, at which the optical fiber Bragg grating is not formed; inserting the optical fiber into the ferrule so that the region of the optical fiber at which the optical fiber Bragg grating is formed and the region of the optical fiber to which the first thermal epoxy resin is applied are located in the cylindrical free space of the ferrule; fixing the optical fiber to the ferrule by curing the first thermal epoxy resin; and optically coupling one end of the optical fiber, fixed to the ferrule, and a light source.
摘要翻译：一种制造激光器的方法包括制备包括形成在其区域处的光纤布拉格光栅的光纤和设置有穿过其两端的圆柱形自由空间的套圈; 将第一热环氧树脂施加到未形成光纤布拉格光栅的光纤的另一区域的外圆柱表面的部分区域; 将光纤插入套圈中，使得形成光纤布拉格光栅的光纤的区域和施加第一热环氧树脂的光纤的区域位于套圈的圆柱形自由空间中 ; 通过固化第一热环氧树脂将光纤固定到套圈; 并且光学耦合固定到套圈的光纤的一端和光源。

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