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1. 发明授权

US06432151B1 Preparing method of silica slurry for wafer polishing 失效
标题翻译：二氧化硅浆料的制备方法用于晶片抛光
公开(公告)号：US06432151B1
公开(公告)日：2002-08-13
申请号：US09644018
申请日：2000-08-22
申请人： Jae Hyun So , Min Ho Oh , Sun Hyuck Bae , Seung Man Yang , Do Hyun Kim
发明人： Jae Hyun So , Min Ho Oh , Sun Hyuck Bae , Seung Man Yang , Do Hyun Kim
IPC分类号： C09K314
CPC分类号： C09K3/1463 , C01B33/126 , C09G1/02
摘要： Disclosed herein is a method of preparing silica slurry for wafer polishing. This method includes pre-treating relatively inexpensive and commercially available fumed or colloidal silica particles as a seed by a settling, a crushing using a ball mill and a paint shaker, and a sonication to produce an aqueous dispersion of the silica particles. The pre-treated silica particles are then combined with tetraethylorothosilicate as a precursor, an alcohol solvent and a base, and grown to a desired size by hydrolysis and polycondensation of the precursor, tetraethylorothosilicate. Then, the alcohol solvent, in which the silica particles are grown, are displaced with water by a vacuum distillation. The resulting aqueous dispersion of the grown silica dispersion is hydrothermally treated in an autoclave. Thus, this method allows the economical preparation of the spherical silica particles having a highly uniform size and a very high purity.
摘要翻译：本文公开了一种制备用于晶片抛光的二氧化硅浆料的方法。该方法包括通过沉降，使用球磨机和油漆搅拌器进行粉碎，超声处理来预处理比较廉价且市售的热解法或胶态二氧化硅颗粒作为种子，以产生二氧化硅颗粒的水分散体。然后将经预处理的二氧化硅颗粒与作为前体的四乙基偏硅酸盐，醇溶剂和碱组合，并通过前体四乙基硅酸酯的水解和缩聚生长至所需尺寸。然后，通过真空蒸馏，用水代替生成二氧化硅颗粒的醇溶剂。将生成的二氧化硅分散体的所得水分散体在高压釜中进行水热处理。因此，该方法允许经济地制备具有高度均匀尺寸和非常高纯度的球形二氧化硅颗粒。

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