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    • 3. 发明授权
    • Electrical circuits with very high conductivity and high fineness,
processes for fabricating them, and devices comprising them
    • 具有非常高的导电性和高细度的电路,制造它们的方法和包括它们的装置
    • US5846854A
    • 1998-12-08
    • US581620
    • 1996-01-18
    • Andre GiraudJacques Fremaux
    • Andre GiraudJacques Fremaux
    • G02F1/1343G02F1/155H01J17/49H05B3/20H05B3/84H05K1/00H05K1/03H05K1/09H05K3/10H05K3/12H01L21/84
    • H01J17/49G02F1/13439G02F1/155H05B3/84H05K3/1258H05K1/0289H05K1/0306H05K1/092H05K1/095H05K2201/09036H05K2201/10287H05K3/103H05K3/107
    • This circuit comprises an insulating substrate covered on at least part of its surface by a fine conducting layer (7) whose geometrical form corresponds to the layout chosen for the circuit; the said conducting layer having one or more very fine grooves (9) with a depth of more than 1 .mu.m engraved in the substrate; the groove or grooves (9) being completely filled by at least two superimposed components: the first, situated at the bottom of the groove, consisting of a highly conductive material, (conducting wire or conducting section, or a conducting substance produced by treatment of a liquid, powdery or pastelike precursor material previously positioned in the groove); the second, which seals the groove, being produced by treatment of a liquid powdery or pastelike precursor material (11), which may or may not be conducting; the treatments having imparted to the said precursor materials their solid consistency and their final properties; the conducting layer (7) being deposited in such a way that it is in contact with the conducting components(s) positioned in the groove before filling, at an intermediate stage, or after the sealing of the groove.
    • PCT No.PCT / FR94 / 00893 Sec。 371日期:1996年1月18日 102(e)日期1996年1月18日PCT提交1994年7月18日PCT公布。 出版物WO95 / 03684 日期1995年2月2日该电路包括通过精细导电层(7)在其表面的至少一部分上覆盖的绝缘基板,其几何形状对应于为电路选择的布局; 所述导电层具有在衬底中雕刻的具有大于1μm的深度的一个或多个非常细小的凹槽(9); 槽或凹槽(9)由至少两个重叠的部件完全填充:第一个位于凹槽的底部,由高导电材料(导线或导电部分,或通过处理 预先定位在凹槽中的液体,粉状或糊状的前体材料); 通过处理可能导致或可能不导电的液体粉状或糊状前体材料(11)产生密封凹槽的第二凹槽; 赋予所述前体材料其固体稠度及其最终性能的处理; 导电层(7)以这样的方式沉积,使得其在填充之前,中间阶段或在密封凹槽之后与位于凹槽中的导电组件接触。
    • 5. 发明授权
    • Apparatus and method for depositing a metal oxide coating on a glass
substrate
    • 用于在玻璃基板上沉积金属氧化物涂层的装置和方法
    • US4692180A
    • 1987-09-08
    • US853817
    • 1986-04-18
    • Jean-Marie VillainJacques Fremaux
    • Jean-Marie VillainJacques Fremaux
    • C03C17/23C03B18/16C03C17/00C03C17/245C23C20/08C03B18/20
    • C03B18/16C03C17/002
    • An improved apparatus for producing a glass ribbon and an improved method for subsequently coating said glass by pyrolytically depositing a metal oxide coating thereupon. The glass is produced in a molten metal float bath having a reducing atmosphere supplied at a slightly positive pressure which is comprised of a mixture of nitrogen and hydrogen gasses. The slightly positive pressure of the reducing atmosphere within at least one lock chamber of the float bath is reduced by venting at least one lock chamber to the outside atmosphere through apertures of reduced size each of which is located in a lateral exterior wall of at least one of said chambers which is separated from the float bath by at least one other of such chambers. Additionally, blower means may be provided to direct an inert antiflame gas, such as nitrogen, toward the base of an airtight curtain at the exit of the outermost lock chamber in order to reduce or totally quench the flames attributable to the burn-off of that portion of the reducing atmosphere which escapes therefrom.
    • 一种用于生产玻璃带的改进的设备和用于随后通过在其上热解沉积金属氧化物涂层随后涂覆所述玻璃的改进方法。 玻璃在具有由氮气和氢气的混合物构成的微小正压下供给的还原气氛的熔融金属浮浴中制造。 通过将至少一个锁定室通过减小尺寸的孔排出至少一个锁定室,从而减小浮动槽的至少一个锁定室内的还原气氛的微小的正压,每个孔都位于至少一个的外侧壁 所述腔室通过至少另一个这样的室与浮浴分离。 此外,可以提供鼓风机装置以将惰性气体气体(例如氮气)引导到最外面的锁定室的出口处的气密帘幕的底部,以便减少或完全消除由于该燃烧所引起的燃烧的火焰 部分从其逸出的还原气氛。