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1. 发明授权

US07834661B2 Ultra-low-power level shifter, voltage transform circuit and RFID tag including the same 有权
标题翻译：超低功率电平转换器，电压变换电路和包括其的RFID标签
公开(公告)号：US07834661B2
公开(公告)日：2010-11-16
申请号：US12210634
申请日：2008-09-15
申请人： Ja-Nam Ku , Cheong-Worl Kim , Young-Hoon Min , Dong-Hyun Lee , Il-Jong Song
发明人： Ja-Nam Ku , Cheong-Worl Kim , Young-Hoon Min , Dong-Hyun Lee , Il-Jong Song
IPC分类号： H03K19/0175
CPC分类号： H03K19/018571
摘要： A level shifter increase a voltage level of an output signal with relatively lower power consumption by adopting current-starved configuration. The level shifter includes an input unit and a driving unit. The input unit includes a current-starved inverter configured to generate a control signal in response to an input signal and a bias voltage. The input unit is powered by a first power supply voltage. The driving unit generates an output signal in response to the control signal. The output signal has a voltage level higher than the input signal, and the driving unit is powered by a second power supply voltage higher than the first power supply voltage.
摘要翻译：电平移位器通过采用电流欠压配置，以相对较低的功耗增加输出信号的电压电平。电平移位器包括输入单元和驱动单元。输入单元包括被配置为响应于输入信号和偏置电压产生控制信号的电流饥饿逆变器。输入单元由第一电源电压供电。驱动单元根据控制信号生成输出信号。输出信号具有高于输入信号的电压电平，并且驱动单元由比第一电源电压高的第二电源电压供电。

2. 发明授权

US07113671B2 Optical coupling device, fabricating method thereof, optical coupling device assembly, and lensed fiber using the optical coupling device 有权
标题翻译：光耦合器件，其制造方法，光耦合器件组件和使用光耦合器件的透镜光纤
公开(公告)号：US07113671B2
公开(公告)日：2006-09-26
申请号：US10742960
申请日：2003-12-22
申请人： Potapov Sergey , Ja-Nam Ku , Sung-Chul Kim , Il-Jong Song , Dong-Hoon Chang , Seong-Mo Hwang , Eung-Yeoul Yoon
发明人： Potapov Sergey , Ja-Nam Ku , Sung-Chul Kim , Il-Jong Song , Dong-Hoon Chang , Seong-Mo Hwang , Eung-Yeoul Yoon
IPC分类号： G02B6/32
CPC分类号： G02B6/4206
摘要： An optical coupling device for coupling light to a core of an optical waveguide device. The optical coupling device is connected to the core of the optical waveguide device at a first end and convex at a second end opposite the first. The optical coupling device includes a waveguide connecting the first and second ends of the optical coupling device, for light transmission, and a cladding surrounding the waveguide.
摘要翻译：一种用于将光耦合到光波导器件的芯的光耦合器件。光耦合器件在第一端连接到光波导器件的芯并且在与第一端相对的第二端处凸起。光耦合装置包括连接光耦合装置的第一端和第二端用于透光的波导和围绕波导的包层。

3. 发明申请

US20100182369A1 METHOD OF AND APPARATUS FOR DETECTING DEFECTIVE NOZZLE OF PRTINER HEAD 审中-公开
标题翻译：用于检测前列腺头缺损喷嘴的方法和装置
公开(公告)号：US20100182369A1
公开(公告)日：2010-07-22
申请号：US12632169
申请日：2009-12-07
申请人： Tatsuhiro Otsuka , Ja-Nam Ku
发明人： Tatsuhiro Otsuka , Ja-Nam Ku
IPC分类号： B41J29/38
CPC分类号： B41J29/393 , B41J2/0451 , B41J2/04541 , B41J2/04561 , B41J2/04586 , B41J2/2142
摘要： Disclosed are a method and an apparatus for detecting a defective nozzle of an inkjet print head. The method may include detecting a light transmitted through ink ejected from a nozzle of a print head, generating a signal associated with the detected light, amplifying the signal, and determining whether the nozzle is defective based on the amplified signal.
摘要翻译：公开了一种用于检测喷墨打印头的缺陷喷嘴的方法和装置。该方法可以包括检测从打印头的喷嘴喷射的墨水透射的光，产生与检测到的光相关联的信号，放大信号，以及基于放大的信号确定喷嘴是否有缺陷。

4. 发明申请

US20060011705A1 Compression bonding method 审中-公开
标题翻译：压接法
公开(公告)号：US20060011705A1
公开(公告)日：2006-01-19
申请号：US10532965
申请日：2003-05-22
申请人： Ja-Nam Ku , Potapov Sergey
发明人： Ja-Nam Ku , Potapov Sergey
IPC分类号： B23K20/10
CPC分类号： B23K20/023
摘要： A compression bonding method includes patterning a metal bonding film in predetermined shapes on a substrate; and disposing a bonded element above the metal bonding film and applying heat to the substrate and pressure to the bonded element, thereby bonding the bonded element to the substrate having the metal bonding film. Since the compression bonding method allows bonded elements having various shapes and sizes to be bonded to a substrate at a low temperature and pressure, manufacturing is simplified, and the compression bonding method can be applied to various sealing and packaging processes.
摘要翻译：压接方法包括在基板上图案化预定形状的金属接合膜; 并且在金属接合膜上设置接合元件，向基板施加热量并对接合元件施加压力，从而将接合元件粘合到具有金属接合膜的基板上。由于压接方法允许具有各种形状和尺寸的接合元件在低温和低压下粘合到基底上，所以制造简化，并且压接方法可以应用于各种密封和包装过程。

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