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1. 发明专利

BRPI0721481B1 processo e dispositivo para tratamento de resíduo biogênico 未知
公开(公告)号：BRPI0721481B1
公开(公告)日：2018-01-30
申请号：BRPI0721481
申请日：2007-03-20
申请人： JUN YANG
发明人： JOJI TAKASE , JUN YANG
IPC分类号： B01J3/00 , B09B3/00 , B09B5/00
摘要： processo e dispositivo para tratamento de despejo biogênico. a presente invenção mostra um processo e um dispositivo para tratamento de des- pejo biogênico, e o dito processo é como se segue: primeiramente, o despejo biogênico é uniformemente misturado com vapor de água, de modo que a temperatura atinja 130-190 e a pressão atinja 1,5-1,9 mpa após mistura, e este estado é mantido por 1-25 minutos; então, a pressão da mistura do dito despejo biogênico e vapor de água seja reduzida para pressão normal de modo a conduzir baixa molecularização do despejo biogênico para obter uma mistura molecularizada inferior; finalmente, a mistura molecularizada inferior é separada de modo a obter os produtos finais. o dito dispositivo inclui vaso de reação, dispositivo de agitação, dispositivo de entrada de vapor, regulador de redução de pressão e dispositivo de separação.

2. 发明申请

US20070247792A1 COMPUTER SCREEN 失效
标题翻译：显示屏
公开(公告)号：US20070247792A1
公开(公告)日：2007-10-25
申请号：US11308677
申请日：2006-04-20
申请人： JUN YANG
发明人： JUN YANG
IPC分类号： G06F1/16
CPC分类号： G06F1/1622 , G06F1/1616 , G06F1/1624 , G06F1/1649 , Y10S248/92
摘要： A computer screen for a personal computer according to the present invention includes a main screen, one or more retractable sub-displays, and one or more retractable arms. The main screen has a main display and a docking space disposed behind the main display. The retractable sub-displays are adapted to be pushed in into and pulled out from the docking space of the main screen. The retractable arms, disposed in the docking space of the main display, are for holding the retractable sub-displays, for pulling in the retractable sub-displays into the docking space, for pushing out the retractable sub-displays from the docking space. The retractable arms are adapted to be tilted and twisted to accommodate the sight line of the viewers behind the main display.
摘要翻译：根据本发明的用于个人计算机的计算机屏幕包括主屏幕，一个或多个可缩回子显示器以及一个或多个可缩回臂。主屏幕具有主显示器和设置在主显示器后面的对接空间。可伸缩子显示器适于被推入和从主屏幕的对接空间中拉出。设置在主显示器的对接空间中的可伸缩臂用于保持可伸缩子显示器，用于将伸缩子显示器拉入对接空间，用于从对接空间推出可伸缩副显示器。可伸缩臂适于倾斜和扭转以适应主显示器后面的观看者的视线。

3. 发明申请

US20100012809A1 ELECTRONIC DEVICE WITH MULTI-ANGLE POSITIONING SUPPORT 失效
标题翻译：具有多角定位支持的电子设备
公开(公告)号：US20100012809A1
公开(公告)日：2010-01-21
申请号：US12421655
申请日：2009-04-10
申请人： YONG-QING ZENG , GAO-HUI TANG , CHIANG-KUO TANG , JUN YANG
发明人： YONG-QING ZENG , GAO-HUI TANG , CHIANG-KUO TANG , JUN YANG
IPC分类号： F16M13/00
CPC分类号： F16M13/005 , F16M11/10 , F16M11/105 , F16M2200/024 , F16M2200/08
摘要： An electronic device comprises a back cover and a support. The back cover defines a first contact area. The support is pivoted to the back cover by a pivot shaft, defines a second contact area contacting the first contact area. A plurality of positioning holes are defined in and disposed on the second contact area around the pivot shaft. The electronic device further comprises at least one retractable spring balls projected from the first contact area of the back cover. The spring balls are configured for cooperating with the positioning holes of the support. The support can stay at a variety of positions.
摘要翻译：电子设备包括后盖和支撑件。后盖限定第一接触区域。支撑件通过枢转轴枢转到后盖，限定了与第一接触区域接触的第二接触区域。多个定位孔限定在枢转轴周围的第二接触区域中并设置在其上。电子设备还包括从后盖的第一接触区域突出的至少一个伸缩弹簧球。弹簧球构造成与支撑件的定位孔配合。支持可以停留在各种职位。

4. 发明申请

US20130075879A1 SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MAKING SAME 有权
标题翻译：半导体芯片封装及其制造方法
公开(公告)号：US20130075879A1
公开(公告)日：2013-03-28
申请号：US13286094
申请日：2011-10-31
申请人： JUN YANG
发明人： JUN YANG
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L24/97 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor chip package includes a substrate unit, a chip, metal members, a molding compound and a shielding layer. The chip is assembled on and electrically connected with the substrate unit. The substrate unit includes conductive seat portions surrounding the chip, and defines through holes respectively coated by conducting films to ground the corresponding seat portions. The metal members are assembled on the seat portions, surround the chip, and are grounded through the conducting films. The molding compound encapsulates the chip and the metal members, with part of each metal member exposed out of the molding compound. The shielding layer covers the molding compound and the parts of each metal member exposed out of the molding compound to shield the chip from electromagnetic radiation.
摘要翻译：半导体芯片封装包括基板单元，芯片，金属构件，模制化合物和屏蔽层。芯片组装在基板单元上并与基板单元电连接。衬底单元包括围绕芯片的导电座位部分，并且限定通过导电膜分别涂覆的通孔，以对应相应的座部分。金属构件组装在座部上，围绕芯片，并通过导电膜接地。模塑料封装了芯片和金属部件，每个金属部件的一部分露出模塑料。屏蔽层覆盖模制化合物，并且每个金属构件的部分暴露在模制化合物之外以屏蔽芯片免受电磁辐射。

5. 发明申请

US20120261692A1 LED PACKAGE STRUCTURE 有权
标题翻译： LED封装结构
公开(公告)号：US20120261692A1
公开(公告)日：2012-10-18
申请号：US13149940
申请日：2011-06-01
申请人： JUN YANG
发明人： JUN YANG
IPC分类号： H01L33/58
CPC分类号： H01L33/62 , H01L33/50 , H01L33/52 , H01L2224/131 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83851 , H01L2224/9211 , H01L2924/15153 , H01L2924/181 , H05K1/181 , H05K3/3431 , H05K2201/10106 , H05K2201/10969 , Y02P70/611 , H01L2924/00014 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A LED package structure includes a substrate, a LED chip and a colloid. The substrate includes a first surface and a second surface. An opening is shaped from the first surface toward the second surface. A phosphor layer is coated on the bottom surface with two opposite parts of the bottom surface respectively neighboring to two opposite side walls of the opening exposed. A metal layer is coated on the two exposed opposite parts of the bottom surface, the two opposite side walls and the first surface. The LED chip is received in the opening and configured on the phosphor layer. The LED chip includes a pair of conductive pads electrically connecting to the metal layer. The colloid is filled between the LED chip and the metal layer to attach the substrate to the LED chip.
摘要翻译： LED封装结构包括基板，LED芯片和胶体。基板包括第一表面和第二表面。开口从第一表面朝向第二表面成形。磷光体层被涂覆在底表面上，底表面的两个相对部分分别邻近露出的开口的两个相对的侧壁。金属层涂覆在底表面的两个暴露的相对部分上，两个相对的侧壁和第一表面上。 LED芯片被容纳在开口中并配置在荧光体层上。 LED芯片包括电连接到金属层的一对导电焊盘。胶体填充在LED芯片和金属层之间，以将基板连接到LED芯片。

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