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1. 发明申请

US20090129018A1 HEAT DISSIPATION DEVICE ASSEMBLY WITH A FAN DUCT HAVING GUIDING MEMBERS FOR GUIDING A SCREWDRIVER TO ASSEMBLE THE HEAT DISSIPATION DEVICE ASSEMBLY TO A PRINTED CIRCUIT BOARD 失效
标题翻译：具有导向构件的风扇盖的散热装置组件用于引导螺丝刀组装散热装置组件到印刷电路板
公开(公告)号：US20090129018A1
公开(公告)日：2009-05-21
申请号：US11940937
申请日：2007-11-15
申请人： SHI-WEN ZHOU , JUN CAO , JIE-CHENG DENG
发明人： SHI-WEN ZHOU , JUN CAO , JIE-CHENG DENG
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
摘要翻译：一种用于从安装在印刷电路板上的多个电子部件散热的散热装置组件，包括接触电子部件之一的散热片（10），一对安装在热源外侧的风扇（20）水槽和固定在风扇上的风扇导管（30）。多个引导构件（322,346）从风扇通道向内形成以位于风扇通道的内部。引导构件用于引导螺丝刀（40）以精确地配合预先组装到散热器的螺钉（50）。因此，可以通过螺丝刀快速方便地固定螺钉，以将散热装置组件安装在印刷电路板上。

2. 发明申请

US20090040729A1 HEAT SINK ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20090040729A1
公开(公告)日：2009-02-12
申请号：US11837458
申请日：2007-08-10
申请人： JIE-CHENG DENG , JUN CAO , SHI-WEN ZHOU
发明人： JIE-CHENG DENG , JUN CAO , SHI-WEN ZHOU
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.
摘要翻译：散热器组件包括散热器和容纳在散热器中的夹子组件。夹子组件包括夹子和通过一对支撑件枢转地连接到夹子的可移动紧固件。每个支撑件限定了从其中心偏离的枢轴孔和在枢转孔上方的保持槽。夹子包括容纳在散热器中的主体和从主体延伸并枢转地容纳在支撑件的保持槽中的两个臂。可动紧固件在支撑件的枢轴孔中枢转地延伸。可移动的紧固件相对于散热器移动并引起支撑件的旋转，使得从夹子的主体到散热器的底部的距离改变，由此夹子组件可以提供作用在散热器。

3. 发明申请

US20090040718A1 HEAT DISSIPATING ASSEMBLY HAVING A FAN DUCT 失效
标题翻译：散热装置散热片
公开(公告)号：US20090040718A1
公开(公告)日：2009-02-12
申请号：US11836718
申请日：2007-08-09
申请人： PENG LIU , JUN CAO , SHI-WEN ZHOU
发明人： PENG LIU , JUN CAO , SHI-WEN ZHOU
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base (10) contacting the CPU, a heat sink (20) mounted on the base, a pair of fans (30) attached on a front side of the heat sink, and a fan duct (40) secured to the fans. The fan duct has a first inlet (440) through which a part of airflow flows into the fan duct, a second inlet (460) through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet (480) for allowing the airflow generated by the fans to blow to the heat sink.
摘要翻译：用于从CPU和VRM中散热的散热组件同时包括接触CPU的基座（10），安装在基座上的散热器（20），安装在热源正面上的一对风扇（30）水槽和固定到风扇的风扇导管（40）。风扇管道具有第一入口（440），气流的一部分通过该第一入口流入风扇管道;第二入口（460），流过风扇管道的气流的另一部分穿过第二入口。气流的另一部分也流经VRM，因此可以对VRM进行冷却。风扇导管还具有用于允许由风扇产生的气流吹向散热器的出口（480）。

4. 发明申请

US20080050196A1 FASTENER ASSEMBLY FOR ATTACHING A HEAT DISSIPATING DEVICE TO AN ELECTRONIC DEVICE 审中-公开
标题翻译：用于将散热装置连接到电子装置的紧固件组件
公开(公告)号：US20080050196A1
公开(公告)日：2008-02-28
申请号：US11616847
申请日：2006-12-27
申请人： JUN CAO , ZHAN WU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： JUN CAO , ZHAN WU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F16B39/00
CPC分类号： F16B5/065 , F16B5/0266
摘要： A fastener assembly for securing a heat dissipation device to a CPU mounted on a printed circuit board, includes a sleeve, a bolt, and a coil spring. The sleeve includes a hollow body, a top head and a pair of lower resilient flat extensions. The resilient flat extension has a barb projecting outwards therefrom and is deformable radially. The bolt includes a shaft, a joining part at an end thereof and a threaded part formed at an opposite end thereof. The shaft is received in the hollow body of the sleeve with the joining part fastened to the hollow body, whilst the threaded part projects out of the hollow body. The coil spring surrounds the sleeve and is held between the head of the sleeve and the barbs of the sleeve; the coil spring is deformable axially along a length of the sleeve.
摘要翻译：用于将散热装置固定到安装在印刷电路板上的CPU的紧固件组件包括套筒，螺栓和螺旋弹簧。套筒包括中空体，顶部头部和一对下部弹性扁平延伸部。弹性扁平延伸部具有从其向外突出并从径向变形的倒钩。螺栓包括轴，其端部处的接合部和形成在其相对端的螺纹部。轴被容纳在套筒的中空体中，其中连接部分紧固到中空体，而螺纹部分突出到中空体之外。螺旋弹簧围绕套筒并且保持在套筒的头部和套筒的倒钩之间; 螺旋弹簧沿着套筒的长度轴向变形。

5. 发明申请

US20090255648A1 PROTECTIVE DEVICE FOR PROTECTING THERMAL INTERFACE MATERIAL AND FASTENERS OF HEAT DISSIPATION DEVICE 有权
标题翻译：用于保护热界面材料的保护装置和散热装置的紧固件
公开(公告)号：US20090255648A1
公开(公告)日：2009-10-15
申请号：US12102016
申请日：2008-04-14
申请人： SHI-WEN ZHOU , JUN CAO , QING-SONG XU
发明人： SHI-WEN ZHOU , JUN CAO , QING-SONG XU
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , F28F2265/02 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
摘要翻译：散热装置组件包括用于从电子元件散发热量的散热装置和保护装置组件。所述散热装置包括具有贯穿其中的紧固件的基座，布置在所述基座的顶部上的多个翅片以及附接在所述基座的底部上的导热板。热界面材料散布在导热板的底表面上。保护装置组件包括附接到导热板的底部的第一盖和与第一盖分离并附接到基部的侧面的第二盖。当散热装置运输时，第一盖保护热界面材料免受污染，并且第二盖保护紧固件免于从基座掉落。

6. 发明申请

US20090242168A1 HEAT SINK ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热装置及其制造方法
公开(公告)号：US20090242168A1
公开(公告)日：2009-10-01
申请号：US12056298
申请日：2008-03-27
申请人： JUN CAO , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： JUN CAO , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
摘要翻译：散热器组件包括基座，翅片组和与基座和翅片组连接的热管。翅片组包括多个翅片。每个翅片在其下部限定凹部。热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。基座沿圆周方向嵌合在翅片的凹槽中。基座，翅片组和热管直接相互紧密连接。凹槽和底座具有相应的T形轮廓。每个翅片形成限定凹部的弯曲凸缘。弯曲的法兰与基座和热管的蒸发部分紧密接触。

7. 发明申请

US20100097763A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100097763A1
公开(公告)日：2010-04-22
申请号：US12436786
申请日：2009-05-07
申请人： SHI-WEN ZHOU , JUN CAO , QING-SONG XU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , JUN CAO , QING-SONG XU , CHUN-CHI CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F2215/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
摘要翻译：适于冷却安装在印刷线路板上的电子装置的散热装置包括热接触电子装置的散热器，包括多个散热片的散热片组件，将翅片组件和散热器互连的第一热管和多个插入翅片组件中的支撑柱。

8. 发明申请

US20090310304A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20090310304A1
公开(公告)日：2009-12-17
申请号：US12138439
申请日：2008-06-13
申请人： SHI-WEN ZHOU , JUN CAO , WEI-PING GONG
发明人： SHI-WEN ZHOU , JUN CAO , WEI-PING GONG
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.
摘要翻译：一种散热装置，包括第一散热器，位于第一散热器上的第二散热器，位于第二散热器上的第三散热器，以及通过弯曲平板状部件而形成的导热部件，第一，第二和第三散热器。导热构件包括与第一散热器接触的吸热部分，以及分别从吸热部分的两端向上延伸的第一和第二连接部分的上端向内延伸的第一和第二散热部分。第一散热部分夹在第一和第二散热片之间，第二散热部分夹在第二和第三散热片之间。第一和第二散热部分的宽度与第二散热器的宽度相同。

9. 发明申请

US20120219149A1 ENCRYPTION AND DECRYPTION PROCESSING METHOD, SYSTEM AND COMPUTER-ACCESSIBLE MEDIUM FOR ACHIEVING SMS4 CRYPTOGRAPHIC PROCEDURE 有权
标题翻译：加密和分解处理方法，用于实现SMS4 CRYPTOGRAPHIC PROCEDURE的系统和计算机可访问介质
公开(公告)号：US20120219149A1
公开(公告)日：2012-08-30
申请号：US13465411
申请日：2012-05-07
申请人： JIAYIN LU , JUN CAO , XIANG YAN , ZHENHAI HUANG
发明人： JIAYIN LU , JUN CAO , XIANG YAN , ZHENHAI HUANG
IPC分类号： G06F21/24
CPC分类号： G09C1/00 , H04L9/0625 , H04L9/14 , H04L2209/125
摘要： An encryption and decryption processing system for achieving SMS4 cryptographic procedure can be provided. The system includes a repeating encryption and decryption data processing device comprising a first constant array storing unit, a first data registering unit and a first data converting unit. The first constant array storing unit stores a first constant array and send it to N-data converting sub-units of the first data converting unit. The first data registering unit registers data, deliver the registered data to a first data converting sub-unit. The N-data converting sub-units perform a data conversion processing, and transmit the obtained conversion data to a next data converting sub-unit for subsequent processing until the data conversion processing processes are completed, a particular number of the completed processed being equal to a value of a data depth.
摘要翻译：可以提供用于实现SMS4密码过程的加密和解密处理系统。该系统包括重复的加密和解密数据处理装置，包括第一常数阵列存储单元，第一数据登记单元和第一数据转换单元。第一常数阵列存储单元存储第一常数阵列并将其发送到第一数据转换单元的N数据转换子单元。第一数据登记单元登记数据，将注册的数据传送到第一数据转换子单元。 N数据转换子单元执行数据转换处理，并将所获得的转换数据发送到下一个数据转换子单元，用于后续处理，直到数据转换处理完成，完成处理的特定数量等于数据深度的值。

10. 发明申请

US20110316634A1 HIGH SPEED LOW POWER MULTIPLE STANDARD AND SUPPLY OUTPUT DRIVER 有权
标题翻译：高速多功能多功能标准和电源输出驱动器
公开(公告)号：US20110316634A1
公开(公告)日：2011-12-29
申请号：US12826645
申请日：2010-06-29
申请人： ANAND JITENDRA VASANI , JUN CAO , AFSHIN MOMTAZ
发明人： ANAND JITENDRA VASANI , JUN CAO , AFSHIN MOMTAZ
IPC分类号： H03F3/04
CPC分类号： H03F3/45183 , H03F1/0244 , H03F3/211 , H03F3/45475 , H03F2200/507 , H03F2200/511 , H03F2203/45686 , H03F2203/45702 , H03F2203/45714 , H03F2203/45726
摘要： A multi-mode driver and method therefore includes a plurality of amplifiers, an adjustable load block, and adjustable current supply circuitry that selectively adjusts current magnitudes supplied to at least one of the plurality of amplifiers. The multi-mode driver can operate in a KR mode with a higher voltage supply, an SR4 mode with the higher voltage supply, and an SFI mode with a lower voltage supply. To support these modes, the multi-mode driver selectively operates a plurality of amplifiers, adjusts current magnitudes supplied to the amplifiers, and selectively adjusts an adjustable load. Thus, the multi-mode driver is operable to selectively and efficiently produce high swing and low swing output signals and to efficiently operate with any one of a plurality of supplies. The driver includes selectable loads and parallel-coupled amplifier devices that are selected based on mode.
摘要翻译：因此，多模式驱动器和方法包括多个放大器，可调负载块和可调节电流供应电路，其选择性地调整提供给多个放大器中的至少一个的电流幅度。多模式驱动器可以在KR模式下运行，具有较高的电源电压，SR4模式和较高的电源电压，以及具有较低电压电源的SFI模式。为了支持这些模式，多模式驱动器选择性地操作多个放大器，调整提供给放大器的电流大小，并且选择性地调节可调负载。因此，多模式驱动器可操作以选择性地且有效地产生高摆幅和低摆幅输出信号，并且可以有效地利用多个供给中的任何一个进行操作。驱动器包括基于模式选择的可选择负载和并联耦合放大器设备。

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