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1. 发明申请

US20090244863A1 MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT 失效
标题翻译：用于将散热器安装在电子部件上的安装装置
公开(公告)号：US20090244863A1
公开(公告)日：2009-10-01
申请号：US12110341
申请日：2008-04-27
申请人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , JUN LI , JUN DING
发明人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , JUN LI , JUN DING
IPC分类号： H05K7/00
CPC分类号： H01L23/4338 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.
摘要翻译：一种用于将散热器（40）安装在其上安装有发热电子部件（50）的印刷电路板（60）上的安装装置（10）。安装装置包括安装框架（101）和附接到安装框架的两个弹性夹子（102）。安装框架包括设置在第一安装臂上方的两个第一安装臂（1011）和两个第二安装臂（1012）。第一安装臂被配置为附接到印刷电路板。弹性夹被构造成夹在安装框架的第二安装臂和散热器之间。弹性夹具各自包括两个弹性臂（1023），其构造成用于提供朝向发热电子部件推动散热器的弹性力。

2. 发明申请

US20090244851A1 MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT 失效
标题翻译：用于将散热器安装在电子部件上的安装装置
公开(公告)号：US20090244851A1
公开(公告)日：2009-10-01
申请号：US12119514
申请日：2008-05-13
申请人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , JUN DING
发明人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , JUN DING
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.
摘要翻译：一种用于将散热器（20）安装到其上设置有发热电子部件（30）的印刷电路板（40）的安装装置（10），包括安装框架（100），两个紧固支腿（104）和四个弹性臂（105）。安装框架包括设置在第一安装臂上方的两个第一安装臂（101）和两个第二安装臂（102）。第一安装臂邻接在电路板上。夹紧腿与第二安装臂连接并插入印刷电路板以附接到印刷电路板。弹性臂与第二安装臂连接，并向发热电子部件向散热片施加向下的弹性力。

3. 发明申请

US20100046230A1 LED LAMP 失效
标题翻译：点灯
公开(公告)号：US20100046230A1
公开(公告)日：2010-02-25
申请号：US12247206
申请日：2008-10-07
申请人： JUN DING , LIN YANG , YE-FEI YU , XIN-XIANG ZHA , JER-HAUR KUO
发明人： JUN DING , LIN YANG , YE-FEI YU , XIN-XIANG ZHA , JER-HAUR KUO
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21V7/0008 , F21V7/005 , F21V29/004 , F21V29/74 , F21V29/75 , F21V29/76 , F21Y2115/10
摘要： An LED lamp (100) includes a lamp enclosure (10), a heat sink (51) and two LED modules (30). The lamp enclosure has a recess (15) and an opening (156). The heat sink is received in the recess of the lamp enclosure. The LED modules are attached to a bottom of the heat sink and oriented downwardly and outwardly towards an internal surface (1110) of the lamp enclosure. Light emitted by the LED module is firstly directed to the internal surface and other internal surfaces (130, 1130), and then reflected from the internal surfaces to an outside of the LED lamp through the opening.
摘要翻译： LED灯（100）包括灯壳（10），散热器（51）和两个LED模块（30）。灯罩具有凹部（15）和开口（156）。散热器被容纳在灯罩的凹槽中。 LED模块附接到散热器的底部并且朝向灯壳体的内表面（1110）向下和向外定向。 LED模块发出的光首先被引导到内表面和其他内表面（130,1130），然后通过开口从内表面反射到LED灯的外部。

4. 发明申请

US20090251863A1 MOUNTING DEVICE FOR MOUNTING HEAT SINK ONTO ELECTRONIC COMPONENT 失效
标题翻译：用于将散热器安装在电子部件上的安装装置
公开(公告)号：US20090251863A1
公开(公告)日：2009-10-08
申请号：US12239831
申请日：2008-09-29
申请人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , JUN LI
发明人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , JUN LI
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： An electronic apparatus includes a PCB with a heat generating electronic component disposed thereon, a heat sink, and a mounting device for mounting the heat sink onto the heat generating electronic component. The mounting device includes a mounting frame and a wire clip. The mounting frame surrounds the heat sink, and includes two first mounting arms and two second mounting arms disposed above the first mounting arms. The first mounting arms abut on the PCB. A pair of engaging wings are formed on the second mounting arms. The wire clip includes a pivot axis pivotably attached to the mounting frame and two resilient arms at opposite sides of the mounting frame. The resilient arms abut against the heat sink and engage with the engaging wings, thereby exerting a resilient force on the heat sink toward the heat generating electronic component.
摘要翻译：一种电子设备包括其上设置有发热电子部件的PCB，散热器和用于将散热器安装到发热电子部件上的安装装置。安装装置包括安装框架和线夹。安装框架围绕散热器，并且包括设置在第一安装臂上方的两个第一安装臂和两个第二安装臂。第一安装臂邻接在PCB上。一对接合翼形成在第二安装臂上。电线夹包括可枢转地附接到安装框架的枢转轴线和在安装框架的相对侧的两个弹性臂。弹性臂抵靠散热器并与接合翼接合，从而在散热片上向发热电子部件施加弹性力。

5. 发明申请

US20110182737A1 HEAT DISSIPATION FAN AND ROTOR THEREOF 失效
标题翻译：散热风扇及其转子
公开(公告)号：US20110182737A1
公开(公告)日：2011-07-28
申请号：US12752148
申请日：2010-04-01
申请人： XIN-XIANG ZHA , YE-FEI YU , JER-HAUR KUO
发明人： XIN-XIANG ZHA , YE-FEI YU , JER-HAUR KUO
IPC分类号： B63H1/16
CPC分类号： F04D29/681 , F04D25/0613 , F04D29/164 , F04D29/384
摘要： A rotor includes a hub, rotary blades extending outwardly from the hub, and an annular wall surrounding the rotary blades. Each rotary blade includes a windward lateral surface and a leeward lateral surface at opposite sides thereof. The annular wall adjoins the outer ends of the rotary blades and is rotatable therewith. A perforation is defined in the annular wall between two neighboring rotary blades and adjacent to the leeward lateral surface of a leading rotary blade of the neighboring rotary blades.
摘要翻译：转子包括轮毂，从轮毂向外延伸的旋转叶片和围绕旋转叶片的环形壁。每个旋转叶片包括迎风侧表面和在其相对侧的背风侧表面。环形壁邻接旋转叶片的外端，并可与其旋转。在相邻的旋转叶片之间的环形壁中限定了穿孔，并且邻近相邻旋转叶片的先导旋转叶片的背风侧表面。

6. 发明申请

US20090194778A1 LIGHT EMITTING DIODE 失效
标题翻译：发光二极管
公开(公告)号：US20090194778A1
公开(公告)日：2009-08-06
申请号：US12102868
申请日：2008-04-15
申请人： CHUNG-YUAN HUANG , JER-HAUR KUO , YE-FEI YU , LIN YANG , XIN-XIANG ZHA
发明人： CHUNG-YUAN HUANG , JER-HAUR KUO , YE-FEI YU , LIN YANG , XIN-XIANG ZHA
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , Y10S362/80 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (10) includes an LED chip (14) and an encapsulant (16) enclosing the LED chip. The LED chip has a light emitting surface (141), and the encapsulant has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a circumferential side surface of a cone, and a conical tip of the cone is located on the light emitting surface of the LED chip.
摘要翻译：发光二极管（10）包括LED芯片（14）和封装LED芯片的密封剂（16）。 LED芯片具有发光表面（141），并且密封剂在发光表面上具有光输出表面（161）。光输出表面限定多个环形同心凹槽（163）。每个槽由第一槽壁（165）和第二槽壁（166）协同封闭。第一槽壁是锥体的圆周侧表面的一部分，并且锥体的锥形末端位于LED芯片的发光表面上。

7. 发明申请

US20110150651A1 CENTRIFUGAL FAN 审中-公开
标题翻译：离心风扇
公开(公告)号：US20110150651A1
公开(公告)日：2011-06-23
申请号：US12763191
申请日：2010-04-19
申请人： XIN-XIANG ZHA , YE-FEI YU , JER-HAUR KUO
发明人： XIN-XIANG ZHA , YE-FEI YU , JER-HAUR KUO
IPC分类号： F04D1/00
CPC分类号： F04D25/166 , F04D29/424 , G06F1/20
摘要： A centrifugal fan includes a housing including an air collecting portion, a first frame and a second frame. The air collecting portion has an air outlet defined in one end thereof. The first and second frames are located at two opposite sides of an opposite end of the air collecting portion. The first and second frames each define a receiving space therein for rotatably receiving an impeller. The first and second frames each further define a vent hole therein. The receiving spaces of the first and second frames communicate with the inner space of the air collecting portion via the vent holes thereof. Airflow generated by the two impellers travels to the inner space of the air collecting portion through the vent holes of the first and second frames, and exits the centrifugal fan through the air outlet of the air collecting portion.
摘要翻译：离心式风扇包括壳体，其包括空气收集部分，第一框架和第二框架。空气收集部分具有限定在其一端的空气出口。第一和第二框架位于空气收集部分的相对端的两个相对侧。第一和第二框架各自限定其中可接收叶轮的接收空间。第一和第二框架每个还在其中限定通气孔。第一和第二框架的接收空间经由其通气孔与集气部分的内部空间连通。由两个叶轮产生的气流通过第一和第二框架的通气孔行进到集气部分的内部空间，并通过空气收集部分的空气出口离开离心风扇。

8. 发明申请

US20090279263A1 SECURING DEVICE FOR ASSEMBLING HEAT DISSIPATION MODULE ONTO ELECTRONIC COMPONENT 失效
标题翻译：用于将散热模块组装到电子部件上的安装装置
公开(公告)号：US20090279263A1
公开(公告)日：2009-11-12
申请号：US12256462
申请日：2008-10-22
申请人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , LIN YANG , FANG-XIANG YU
发明人： JER-HAUR KUO , XIN-XIANG ZHA , YE-FEI YU , LIN YANG , FANG-XIANG YU
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A securing device (30) is used for securing a heat sink (10) to a printed circuit board (40) with a heat-generating electronic component (41) mounted thereon. The securing device includes a V-shaped elongated main body (31), a first locking leg (34), a second locking leg (332) and a resilient member (32). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame (20) on the printed circuit board. The resilient member includes a planar-shaped supporting plate (321) engaging with a bottom portion of the main body and at least one resilient foot (322) extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.
摘要翻译：固定装置（30）用于通过安装在其上的发热电子部件（41）将散热器（10）固定到印刷电路板（40）。固定装置包括V形细长主体（31），第一锁定腿（34），第二锁定腿（332）和弹性构件（32）。第一锁定腿和第二锁定腿分别连接到主体的两个相对端，用于与印刷电路板上的保持框架（20）接合。弹性构件包括与主体的底部接合的平面状支撑板（321）和从支撑板向下延伸的至少一个弹性脚（322）。当散热器通过固定装置组装到电子部件时，弹性脚变形以在散热器上施加弹性力。

9. 发明申请

US20110005727A1 THERMAL MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：热模块及其制造方法
公开(公告)号：US20110005727A1
公开(公告)日：2011-01-13
申请号：US12560353
申请日：2009-09-15
申请人： YE-FEI YU , XIN-XIANG ZHA , XIAN-MIN JIN , JER-HAUR KUO
发明人： YE-FEI YU , XIN-XIANG ZHA , XIAN-MIN JIN , JER-HAUR KUO
IPC分类号： F28D15/04 , F28F7/00 , B21D53/02
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/0275 , F28D15/046 , F28F3/02 , H01L23/427 , H01L2924/0002 , H05K7/20336 , Y10T29/4935 , Y10T29/49353 , H01L2924/00
摘要： A thermal module includes a substrate and a heat pipe integrally embedded in the substrate by insert molding technique. An end of the heat pipe protrudes laterally out of the substrate. The heat pipe includes a tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the thermal module includes following steps: providing a tube with a wick structure attached to an inner surface thereof, an end of the tube being open; placing the tube into a mold; injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end; sealing the open end of the tube.
摘要翻译：热模块包括通过嵌入成型技术一体地嵌入基板的基板和热管。热管的端部从基板侧向突出。热管包括管，连接到管的内表面的芯结构和填充在管中的工作流体。一种用于制造热模块的方法包括以下步骤：提供具有连接到其内表面的芯结构的管，管的端部是开口的; 将管放入模具中; 将熔融金属注射到模具中以形成衬底，其中管整体地嵌入衬底中，并且管的开口端横向突出出衬底; 通过开口端将工作流体填充到管中; 密封管的开口端。

10. 发明申请

US20090316414A1 LED LAMP 审中-公开
标题翻译：点灯
公开(公告)号：US20090316414A1
公开(公告)日：2009-12-24
申请号：US12202397
申请日：2008-09-01
申请人： LIN YANG , YE-FEI YU , XIN-XIANG ZHA , JER-HAUR KUO
发明人： LIN YANG , YE-FEI YU , XIN-XIANG ZHA , JER-HAUR KUO
IPC分类号： F21V7/00
CPC分类号： F21V7/0025 , F21S4/28 , F21V7/0008 , F21V7/005 , F21Y2103/10 , F21Y2115/10
摘要： An LED lamp (100) includes a lamp enclosure (10), an LED module and a reflective plate (50). The lamp enclosure has a groove (15) and an opening (156). The opening is located above and communicates with the groove. The LED module and the reflective plate are received in the groove of the lamp enclosure. The LED module is oriented towards the opening. The reflective plate is located between the LED module and opening in such a manner that at least a portion of light (71) emitted by the LED module is firstly directed to the reflective plate, and then reflected from the reflective plate to an internal surface (115) of the lamp enclosure, and at last reflected from the internal surface to the opening.
摘要翻译： LED灯（100）包括灯壳（10），LED模块和反射板（50）。灯罩具有凹槽（15）和开口（156）。开口位于槽的上方并连通。 LED模块和反射板被接收在灯壳的凹槽中。 LED模块朝向开口。反射板位于LED模块和开口之间，使得由LED模块发射的光（71）的至少一部分首先被引导到反射板，然后从反射板反射到内表面（ 115），并且最后从内表面反射到开口。

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