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1. 发明专利

JPH04280660A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04280660A
公开(公告)日：1992-10-06
申请号：JP6753091
申请日：1991-03-08
申请人： JAPAN GORE TEX INC
发明人： HAZAKI YOSHITO , HATAKEYAMA MINORU , FUKUTAKE SUNAO , URAGAMI AKIRA
IPC分类号： H01L23/29 , H01L23/31
摘要： PURPOSE:To effectively and easily protect a resin sealed semiconductor device against resin cracks caused by quick heating when mounting by soldering. CONSTITUTION:A semiconductor device 10 is mounted on a chip mount 1, and a fluororesin porous body 5 is provided to the underside of the chip mount 1 or the underside of a support, and these component parts are sealed up with a sealing material 3. By this setup, cracks are surely prevented from occurring in a resin layer due to vapor or temperature change caused by quick heating when mounting the device by soldering, so that the device can be kept high in characteristics.

2. 发明专利

JPH0722544A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0722544A
公开(公告)日：1995-01-24
申请号：JP7037891
申请日：1991-03-12
申请人： JAPAN GORE TEX INC
发明人： URAGAMI AKIRA , HATAKEYAMA MINORU , HAZAKI YOSHITO , FUKUTAKE SUNAO
IPC分类号： H01L23/29 , H01L23/31
摘要： PURPOSE:To adequately prevent resin crack of a small and thinner of resin sealing layer by loading a semiconductor element on a chip loading area and molding the surrounding of the chap loading area having loaded a semiconductor element with a resin sealing material including fine pieces of fluorine resin porous material. CONSTITUTION:A semiconductor element 10 is loaded on a chip loading material 11 and an electrode of the semiconductor element 10 and a lead 12 are connected with a gold fine wire 14 having excellent electrical characteristic. The chip loading material 11 is surrounded and sealed by a molding resin 13 including fine pieces 15 of fluorine resin porous material. Thereby, generation of crack in the mold resin 13 due to alleviation and absorption of internal stress can be adequately prevented even when temperature changes suddenly during the soldering process and thermal stress is applied after humidity is absorbed.

3. 发明专利

JPH0680875B2 失效
公开(公告)号：JPH0680875B2
公开(公告)日：1994-10-12
申请号：JP12585686
申请日：1986-06-02
申请人： JAPAN GORE TEX INC
发明人： HATAKEYAMA MINORU , KOMADA ICHIRO
IPC分类号： B32B15/08 , B32B15/082 , H05K1/03 , H05K3/28

4. 发明专利

JPH04363032A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04363032A
公开(公告)日：1992-12-15
申请号：JP7856191
申请日：1991-03-18
申请人： JAPAN GORE TEX INC
发明人： FUKUTAKE SUNAO , HATAKEYAMA MINORU , HAZAKI YOSHITO , URAGAMI AKIRA
IPC分类号： H01L21/52 , H01L21/48 , H01L21/58 , H01L23/29 , H01L23/31 , H01L23/495 , H01L29/06
摘要： PURPOSE:To reduce a stress caused at the inside of an IC chip by a method wherein a porous polytetrafluoroethylene layer is formed between a semiconductor element and a base material. CONSTITUTION:A porous polytetrafluoroethylene layer 5 in laid between a base body 3 and a semiconductor element 1. The layer 5 is preferably made by stretching polytetrafluoroethylene film and make it porous. The member can be obtained properly when fine hole gaps at 2mum or lower are formed at a porosity of 40 to 95%, especially at 60 to 80%. Thereby, when the layer 5 whose Young's modulus is low is used, the stretch of the base material 3 is absorbed by the layer 5 when a temperature is raised. Thereby, a large stress is not caused on both the surface and the rear surface of the element 1. In the same manner, when the temperature is lowered, the contraction of the base material 3 is transmitted to the element 1 after it has been reduced largely, and a chip is not damaged.

5. 发明专利

JPH03233808A OIL-DOPED INSULATOR FOR ELECTRIC APPLIANCE 失效
公开(公告)号：JPH03233808A
公开(公告)日：1991-10-17
申请号：JP2596290
申请日：1990-02-07
申请人： JAPAN GORE TEX INC
发明人： HATAKEYAMA MINORU , SASAKI HIROBUMI , WADA JINICHI
IPC分类号： H01B3/00 , H01B3/30 , H01B3/44 , H01F27/12 , H01F27/32
摘要： PURPOSE:To improve reliability of an insulator by impregnating a continuously porous fluorinated carbon resin or aramid resin sheet with an insulating oil and using it for the insulator. CONSTITUTION:Since a continuously porous fluorinated carbon resin or aramid resin sheet or layer 1 has low dielectric constant as compared with a press board or a crepe paper, an insulator of the sheet or layer impregnated with an insulating oil decrease the dielectric constant as a whole. The mechanical strength of the continuously porous fluorinated carbon resin or aramid resin layer 1 can be increased by laminating solid resin layers or filling the pores with resin but even in this case, the dielectric constant of the insulator as a whole is made lower than that of an insulator made of a conventional press board, etc., by limiting the dielectric constant of the resin below a prescribed value. Consequently, a continuously porous fluorinated carbon resin or aramid resin sheet impregnated with an insulating oil is used, and thus reliability of the insulator is improved.

6. 发明专利

JPH0368149A IC MOUNTING FILM CARRIER 失效
公开(公告)号：JPH0368149A
公开(公告)日：1991-03-25
申请号：JP20289089
申请日：1989-08-07
申请人： JAPAN GORE TEX INC
发明人： FUKUTAKE SUNAO , HATAKEYAMA MINORU
IPC分类号： H01L21/60 , H01L23/14 , H01L23/498
摘要： PURPOSE:To improve signals in transmission speed between a mounting IC chip and a carrier by a method wherein at least a part of a base film is formed of porous resin sheet. CONSTITUTION:A PTFE(porous polytetrafluoroethylene) sheet 9 is provided under a conductor 1 through the intermediary of a fluorine adhesive layer 2. By this setup, not only the positional deviation of an inner and an outer lead, 5 and 6, can be prevented but also the film carrier 1 can be decreased in transmission delay of signals owing to the sheet 9 of excellent dielectric characteristic (epsilonr=1.2). As the sheet 9 is very flexible, it is also conducive to the relaxation of thermal stress induced due to the linear expansion coefficient difference between the conductor 1 and a base film.

7. 发明专利

JPS62283694A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPS62283694A
公开(公告)日：1987-12-09
申请号：JP12585586
申请日：1986-06-02
申请人： JAPAN GORE TEX INC
发明人： HATAKEYAMA MINORU , KOMADA ICHIRO , MORIYA HIRONORI
IPC分类号： B29C43/32 , B29K27/18 , B29L31/34 , B32B15/08 , B32B15/082 , H05K1/03

8. 发明专利

JPH04242991A FLUORORESIN BASE MATERIAL 失效
公开(公告)号：JPH04242991A
公开(公告)日：1992-08-31
申请号：JP1145591
申请日：1991-01-08
申请人： JAPAN GORE TEX INC
发明人： HATAKEYAMA MINORU , IEGI MASAHIRO
IPC分类号： C08J9/00 , C08J9/40 , C08K3/00 , C08L27/12 , H05K1/03
摘要： PURPOSE:To enhance heat resistance of a porous fluororesin base material and to obtain an excellent fluororesin base material to be used as a material for a printed circuit board by adhesively coupling a special carbon material in the pores of the base material. CONSTITUTION:A fluororesin base material in which fluorine-containing carbon material is adhesively coupled in the pares of a porous fluororesin base material. As the fluorine-containing carbon material includes, for example, graphite, fluorinated pitch, etc.

9. 发明专利

JPH02296882A ADHESIVE SHEET 失效
公开(公告)号：JPH02296882A
公开(公告)日：1990-12-07
申请号：JP11613189
申请日：1989-05-11
申请人： JAPAN GORE TEX INC
发明人： HATAKEYAMA MINORU , HAZAKI YOSHITO , NOMI HARUO
IPC分类号： C09J7/02 , H05K3/38 , H05K3/46
摘要： PURPOSE:To obtain an adhesive sheet excellent in the adhesive properties of both sides of the sheet and in the product quality by forming chemically, physically or geometrically asymmetric adhesive layers on both sides of the substrate. CONSTITUTION:An adhesive sheet having adhesive layers formed on both sides of the substrate, wherein the adhesive layers of the both sides are chemically, physically, or geometrically asymmetric. As each of the adhesive layers can be optimized as to the material, unevenness, etc., of each adherend surface adhered to each adhesive layer, the adhesive sheet can solve problems caused by the symmetrical adhesive layers of the both sides in a conventional adhesive tape. In addition, as the most suitable adhesive layer is formed on each side in casing, the adhesive sheet enables adhesion without defects such as adhesion failure, void, and degradation and nonuniformity of product quality even when used in adhering materials to be stuck and of surface conditions (e.g. unevenness) differing from each other.

10. 发明专利

JPS62283693A PRINTED BOARD 失效
公开(公告)号：JPS62283693A
公开(公告)日：1987-12-09
申请号：JP12585686
申请日：1986-06-02
申请人： JAPAN GORE TEX INC
发明人： HATAKEYAMA MINORU , KOMADA ICHIRO
IPC分类号： B32B15/08 , B32B15/082 , H05K1/03 , H05K3/28

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