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1. 发明申请

US20080023840A1 VIA HEAT SINK MATERIAL 有权
标题翻译：通过散热材料
公开(公告)号：US20080023840A1
公开(公告)日：2008-01-31
申请号：US11461211
申请日：2006-07-31
申请人： J. S. Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
发明人： J. S. Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
IPC分类号： H01L23/48
CPC分类号： H05K3/3415 , H01L2224/16225 , H05K1/0206 , H05K3/305 , H05K3/3447 , H05K3/3468 , H05K2201/0209 , H05K2201/0949 , H05K2201/10734 , H05K2203/1476 , Y02P70/613
摘要： The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
摘要翻译：本发明提供导热材料，使得从层的一侧传播的较少热量将到达层的另一侧上的连接材料。相反，一些热量将被导热材料导出并消散。

2. 发明申请

US20050227509A1 Making electrical connections between a circuit board and an integrated circuit 有权
标题翻译：在电路板和集成电路之间进行电气连接
公开(公告)号：US20050227509A1
公开(公告)日：2005-10-13
申请号：US10822572
申请日：2004-04-12
申请人： Shawn Lloyd , John Oldendorf , Michael Kochanowski , Scott Gilbert
发明人： Shawn Lloyd , John Oldendorf , Michael Kochanowski , Scott Gilbert
IPC分类号： H01R12/00 , H01R13/24
CPC分类号： H01R13/2435
摘要： A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.
摘要翻译：插座可以接收球栅格和平台栅格阵列封装。因此，在一些实施例中，没有焊球的早期封装原型可以封装在最终用于使用球栅阵列封装的生产设备的相同插座设计中。在一些实施例中，平台阵列和球栅阵列可以在插座上以自身为中心。可以使用S形弹簧接触器来以擦拭动作电连接到焊球或焊盘。

3. 发明申请

US20050103826A1 Via heat sink material 失效
标题翻译：通过散热片材料
公开(公告)号：US20050103826A1
公开(公告)日：2005-05-19
申请号：US10717348
申请日：2003-11-18
申请人： J.S. Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
发明人： J.S. Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
IPC分类号： B23K1/00 , H05K1/02 , H05K3/30 , H05K3/34 , B23K31/02
CPC分类号： B23K1/0016 , B23K2101/42 , H05K1/0206 , H05K3/305 , H05K3/3415 , H05K3/3447 , H05K3/3468 , H05K2201/0209 , H05K2201/0949 , H05K2201/10734 , Y02P70/613 , Y10T29/4913
摘要： The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
摘要翻译：本发明提供导热材料，使得从层的一侧传播的较少热量将到达层的另一侧上的连接材料。相反，一些热量将被导热材料导出并消散。

4. 发明授权

US07124931B2 Via heat sink material 失效
公开(公告)号：US07124931B2
公开(公告)日：2006-10-24
申请号：US10717348
申请日：2003-11-18
申请人： J. Shelton Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
发明人： J. Shelton Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K2101/42 , H05K1/0206 , H05K3/305 , H05K3/3415 , H05K3/3447 , H05K3/3468 , H05K2201/0209 , H05K2201/0949 , H05K2201/10734 , Y02P70/613 , Y10T29/4913
摘要： The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

5. 发明授权

US07592702B2 Via heat sink material 有权
标题翻译：通过散热片材料
公开(公告)号：US07592702B2
公开(公告)日：2009-09-22
申请号：US11461211
申请日：2006-07-31
申请人： J. Shelton Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
发明人： J. Shelton Lewis , Shawn Lloyd , Michael Kochanowski , John Oldendorf
IPC分类号： H01L23/48
CPC分类号： H05K3/3415 , H01L2224/16225 , H05K1/0206 , H05K3/305 , H05K3/3447 , H05K3/3468 , H05K2201/0209 , H05K2201/0949 , H05K2201/10734 , H05K2203/1476 , Y02P70/613
摘要： The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
摘要翻译：本发明提供导热材料，使得从层的一侧传播的较少热量将到达层的另一侧上的连接材料。相反，一些热量将被导热材料导出并消散。

6. 发明申请

US20060288567A1 SACRIFICIAL COMPONENT 审中-公开
公开(公告)号：US20060288567A1
公开(公告)日：2006-12-28
申请号：US11468231
申请日：2006-08-29
申请人： Shawn Lloyd , John Oldendorf , Michael Kochanowski , Scott Gilbert
发明人： Shawn Lloyd , John Oldendorf , Michael Kochanowski , Scott Gilbert
IPC分类号： H01H11/00 , H05K3/30 , H05K3/00
CPC分类号： H01L23/62 , H01L2224/16 , H01L2924/15311 , H01L2924/19106 , H05K1/141 , H05K3/3436 , H05K2201/10181 , H05K2201/10204 , H05K2201/2036 , H05K2203/1572 , Y10T29/49105 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149
摘要： A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.
摘要翻译：一种器件包括衬底。衬底还包括包括多个焊盘的第一主表面和第二主表面。至少一个部件附接到第一主表面上的多个焊盘中的至少一些。至少一个牺牲部件附接到第一主表面。所述至少一个部件相对于所述第一主表面具有第一高度，并且所述至少一个牺牲部件相对于所述第一主表面具有第二高度。第二个高度大于第一个高度。牺牲部件包括保险丝。

7. 发明申请

US20060216957A1 INTEGRATED CIRCUIT PACKAGE SOCKET AND SOCKET CONTACT 有权
标题翻译：集成电路插座和插座联系人
公开(公告)号：US20060216957A1
公开(公告)日：2006-09-28
申请号：US11090385
申请日：2005-03-25
申请人： Shawn Lloyd , John Oldendorf , J. Lewis , Michael Kochanowski
发明人： Shawn Lloyd , John Oldendorf , J. Lewis , Michael Kochanowski
IPC分类号： H01R12/00
CPC分类号： H05K7/1069
摘要： An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.
摘要翻译：集成电路（IC）封装插座设置有将IC封装连接到电路板的单件式插座触针的阵列。单件接触销支撑在接触销的中间部分，并且包括两个锐角弯曲部，其允许接触销的两端独立地弹性地接合IC封装的封装焊盘和电路板的接触焊盘。接触销进一步成形并布置成在接合期间横向滑动封装焊盘和接触垫，以刮除或穿透任何氧化物或其它污染物积聚。

8. 发明申请

US20050218516A1 Sacrificial component 有权
标题翻译：牺牲成分
公开(公告)号：US20050218516A1
公开(公告)日：2005-10-06
申请号：US10815465
申请日：2004-03-31
申请人： Shawn Lloyd , John Oldendorf , Michael Kochanowski , Scott Gilbert
发明人： Shawn Lloyd , John Oldendorf , Michael Kochanowski , Scott Gilbert
IPC分类号： H01L23/52 , H01L23/62 , H05K1/14 , H05K3/34
CPC分类号： H01L23/62 , H01L2224/16 , H01L2924/15311 , H01L2924/19106 , H05K1/141 , H05K3/3436 , H05K2201/10181 , H05K2201/10204 , H05K2201/2036 , H05K2203/1572 , Y10T29/49105 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149
摘要： A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.
摘要翻译：一种器件包括衬底。衬底还包括包括多个焊盘的第一主表面和第二主表面。至少一个部件附接到第一主表面上的多个焊盘中的至少一些。至少一个牺牲部件附接到第一主表面。所述至少一个部件相对于所述第一主表面具有第一高度，并且所述至少一个牺牲部件相对于所述第一主表面具有第二高度。第二个高度大于第一个高度。牺牲部件包括保险丝。

9. 发明授权

US5627729A One-piece memory card 失效
标题翻译：一体式存储卡
公开(公告)号：US5627729A
公开(公告)日：1997-05-06
申请号：US415698
申请日：1995-04-03
申请人： John Oldendorf , Mark Stack
发明人： John Oldendorf , Mark Stack
IPC分类号： G06K19/077 , H05K5/02 , H05K1/14
CPC分类号： H05K5/0269 , G06K19/077 , Y10S439/946
摘要： A memory card assembly is provided having a one-piece construction including a cardedge receptacle for slidingly receiving the conductive fingers of a printed circuit board and providing for an electrical connection without soldering. The one-piece construction is achieved by the injection molding of an internal frame to capture the protruding edges of the top and bottom metallic covers. Sufficient normal force of the cardedge receptacle is maintained by a brace member.
摘要翻译：提供一种存储卡组件，其具有一体式构造，其包括用于滑动地接收印刷电路板的导电指状物的卡止式插座，并且在不焊接的情况下提供电连接。通过内部框架的注射成型来获得一体式结构，以捕获顶部和底部金属盖的突出边缘。卡edge式容器的足够的法向力由支撑构件保持。

10. 发明授权

US5586008A Gravity latch for surface mount components 失效
标题翻译：表面贴装元件的重力锁
公开(公告)号：US5586008A
公开(公告)日：1996-12-17
申请号：US389108
申请日：1995-02-15
申请人： Charles A. Kozel , John Oldendorf , John T. Scheitz , Tuan J. Tan
发明人： Charles A. Kozel , John Oldendorf , John T. Scheitz , Tuan J. Tan
IPC分类号： H01R12/55 , H01R12/71 , H05K3/30 , H05K1/14
CPC分类号： H01R12/7058 , H01R12/725 , H05K3/303
摘要： A latch connected to a surface mount component for subsequent connection to a printed circuit board is provided as well as a method for mounting a surface mount component to a printed circuit board having a zero mounting force. The surface mount component has a soldering tail extending therefrom and at least one latch or latch contact insertable through an aperture in the printed circuit board, without force, such that the soldering tails extending from the surface mount component rest on corresponding soldering pads of the printed circuit board. As a result, surface mount components are mountable to a printed circuit board using standard, available equipment, such as a vacuum head placed component which allow for placement of the component via gravity, and the components are subsequently soldered to the printed circuit board. The assembly also includes a board latch pin and a weighted cap.
摘要翻译：提供连接到表面安装部件以用于随后连接到印刷电路板的闩锁以及用于将表面安装部件安装到具有零安装力的印刷电路板的方法。表面安装部件具有从其延伸的焊接尾部，并且至少一个闩锁或闩锁接触件可通过印刷电路板中的孔插入，而不受力，使得从表面安装部件延伸的焊接尾部搁置在印刷的相应焊盘上电路板。因此，表面安装部件可使用标准的可用设备安装到印刷电路板，例如真空头放置部件，其允许通过重力放置部件，并且部件随后被焊接到印刷电路板。组件还包括板闩销和加重盖。

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