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1. 发明申请

US20110309813A1 Field Device of Process Automation 有权
标题翻译：过程自动化现场设备
公开(公告)号：US20110309813A1
公开(公告)日：2011-12-22
申请号：US13124417
申请日：2009-09-18
申请人： Jürgen Meier , Martin Lange
发明人： Jürgen Meier , Martin Lange
IPC分类号： G05F5/00
CPC分类号： G08C19/02
摘要： A field device of process automation technology having an interface for output of an electrical current signal and a specifying unit, which provides a value, on which depends an electrical current signal to be output via the interface. A first controllable electrical current sink and a second controllable electrical current sink are provided. The first controllable electrical current sink and the second controllable electrical current sink are settable to predeterminable electrical current levels, and that the first controllable electrical current sink and the second controllable electrical current sink are connected with the interface in such a manner that the electrical current signal which at the interface essentially depends on the lower of the predeterminable electrical current levels, to which the first controllable electrical current sink and the second controllable electrical current sink are set.
摘要翻译：一种具有用于输出电流信号的接口的过程自动化技术的现场设备和提供一个值的指定单元，其上依赖于通过接口输出的电流信号。提供第一可控电流吸收器和第二可控电流吸收器。第一可控电流吸收器和第二可控电流吸收器可设置为可预定的电流水平，并且第一可控电流吸收器和第二可控电流吸收器以这样的方式与界面连接，使得电流信号其在界面处基本上取决于设置第一可控电流吸收器和第二可控电流吸收器的可预定电流水平的较低者。

2. 发明授权

US09230428B2 Field device of process automation 有权
标题翻译：过程自动化的现场设备
公开(公告)号：US09230428B2
公开(公告)日：2016-01-05
申请号：US13124417
申请日：2009-09-18
申请人： Jürgen Meier , Martin Lange
发明人： Jürgen Meier , Martin Lange
IPC分类号： G05B23/02 , G08C19/02
CPC分类号： G08C19/02
摘要： A field device of process automation technology having an interface for output of an electrical current signal and a specifying unit, which provides a value, on which depends an electrical current signal to be output via the interface. A first controllable electrical current sink and a second controllable electrical current sink are provided. The first controllable electrical current sink and the second controllable electrical current sink are settable to predeterminable electrical current levels, and that the first controllable electrical current sink and the second controllable electrical current sink are connected with the interface in such a manner that the electrical current signal which at the interface essentially depends on the lower of the predeterminable electrical current levels, to which the first controllable electrical current sink and the second controllable electrical current sink are set.
摘要翻译：一种具有用于输出电流信号的接口的过程自动化技术的现场设备和提供一个值的指定单元，其上依赖于通过接口输出的电流信号。提供第一可控电流吸收器和第二可控电流吸收器。第一可控电流吸收器和第二可控电流吸收器可设置为可预定的电流水平，并且第一可控电流吸收器和第二可控电流吸收器以这样的方式与界面连接，使得电流信号其在界面处基本上取决于设置第一可控电流吸收器和第二可控电流吸收器的可预定电流水平的较低者。

3. 发明授权

US5977512A Multi-wavelength laser soldering device with substrate cleaning beam 失效
标题翻译：多波长激光焊接装置，具有基板清洗梁
公开(公告)号：US5977512A
公开(公告)日：1999-11-02
申请号：US875722
申请日：1997-07-31
申请人： Ghassem Azdasht , Martin Lange
发明人： Ghassem Azdasht , Martin Lange
IPC分类号： B23K1/06 , B23K1/005 , B23K1/20 , H01L21/60 , H01L23/12 , H05K3/24 , H05K3/34 , B23K26/00
CPC分类号： H05K3/3478 , B23K1/0056 , B23K1/206 , B23K2201/42 , H01L2224/11334 , H05K2203/0126 , H05K2203/0195 , H05K2203/041 , H05K2203/043 , H05K2203/086 , H05K2203/107 , H05K2203/108 , H05K3/3489 , H05K3/3494
摘要： In a method and an apparatus for the flux-free application of a solder to a substrate or a chip an area on the surface of the substrate or on the pad of the chip, to which the solder is applied, is cleaned, to produce a sace which is suitable for soldering. Subsequently, the cleaned area is isolated from the surroundings by means of a protective gas, and finally the solder is applied to the cleaned, isolated area and remelted.
摘要翻译： PCT No.PCT / EP96 / 04067 Sec。 371日期1997年7月31日 102（e）日期1997年7月31日PCT提交1996年9月17日PCT公布。公开号WO97 / 20654 日期：1997年6月12日在将焊料无焊剂施加到衬底或芯片上的方法和装置中，衬底表面上或衬底上施加焊料的区域是清洁，以产生适合焊接的表面。随后，通过保护气体将清洁的区域与周围环境隔离，最后将焊料施加到清洁的隔离区域并重新熔化。

4. 发明申请

US20100104942A1 SUBSTRATE FOR LITHIUM THIN FILM BATTERY 审中-公开
标题翻译：锂离子电池电池基板
公开(公告)号：US20100104942A1
公开(公告)日：2010-04-29
申请号：US12531833
申请日：2008-02-12
申请人： Martin Lange , Christophe Degraer
发明人： Martin Lange , Christophe Degraer
IPC分类号： H01M10/26 , H01M4/38 , H01M4/40 , H01M4/42 , H01M4/46
CPC分类号： H01M4/661 , H01M10/0525 , H01M10/0562 , H01M10/0585
摘要： When attempting to make a lithium ion-switching device such as a high-efficiency, all-solid state, thin film battery the choice of carrier substrate is all important. As such a substrate must withstand a high temperature under an oxidising atmosphere to crystallise certain layers making up the device, the substrate should not oxidise thereby ruling out most metals. The invention now describes a class of ternary alloys of which the oxidation rate is limited and that are useable to produce thin film batteries on. At least one element with a high affinity to oxygen (Al, Mg, Zn or Si) is present in the alloy. The other two metallic elements reduce the growth of the oxide of this first element. In addition the thus formed oxide scale turns out to be an effective barrier to lithium. Surprisingly, the scale shows nanoscopic voids that allow for sufficient electrical contact with the device layers, thereby eliminating the need for a separate current collector. As the ternary alloy can be made in a flexible foil, it can advantageously be used in a roll-to-roll process.
摘要翻译：当试图制造锂离子切换装置如高效全固态薄膜电池时，载体衬底的选择都是重要的。由于这样的基板必须在氧化气氛下经受高温以结晶构成该器件的某些层，所以基板不应氧化从而排除大部分金属。本发明现在描述了一类三元合金，其中氧化速率受到限制，并且可用于制造薄膜电池。在合金中存在至少一种对氧（Al，Mg，Zn或Si）具有高亲和力的元素。另外两个金属元素减少了该第一元素的氧化物的生长。另外，如此形成的氧化皮也证明是锂的有效屏障。令人惊讶的是，该比例尺显示出允许与器件层充分电接触的纳米空隙，从而不需要单独的集电器。由于三元合金可以制成柔性箔，所以它可以有利地用于卷对卷工艺。

5. 发明申请

US20070108160A1 Plasma etching of tapered structures 审中-公开
标题翻译：锥形结构的等离子体蚀刻
公开(公告)号：US20070108160A1
公开(公告)日：2007-05-17
申请号：US11559684
申请日：2006-11-14
申请人： Ha-Duong Ngo , Volker Seidemann , Daniel Studzinski , Martin Lange , Andre' Hiess
发明人： Ha-Duong Ngo , Volker Seidemann , Daniel Studzinski , Martin Lange , Andre' Hiess
IPC分类号： C23F1/00 , G06F19/00
CPC分类号： H01L21/3065 , H01L27/14609 , H01L27/14634 , H01L27/14806
摘要： The invention relates to a method of plasma etching substrates, in particular of etching tapered passages through substrates, using a process gas comprising at least one halogenide and oxygen.
摘要翻译：本发明涉及一种等离子体蚀刻衬底的方法，特别是使用包括至少一种卤化物和氧气的工艺气体蚀刻通过衬底的锥形通道。

6. 发明授权

US6059176A Device and a method for applying a plurality of solder globules to a substrate 失效
标题翻译：装置以及将多个焊球应用于基板的方法
公开(公告)号：US6059176A
公开(公告)日：2000-05-09
申请号：US56479
申请日：1998-04-07
申请人： Ghassem Azdasht , Ramin Azadeh , Clemens Ruthnick , Martin Lange
发明人： Ghassem Azdasht , Ramin Azadeh , Clemens Ruthnick , Martin Lange
IPC分类号： B23K3/06 , B23K35/14 , G02B6/42 , H05K3/34 , B23K35/12 , B23K1/20 , B23K26/00 , B23K31/02
CPC分类号： B23K3/0623 , H05K3/3478 , G02B6/4232 , H05K2203/041 , H05K2203/082 , H05K2203/107 , H05K3/3494
摘要： A method for applying a plurality of solder globules to a substrate has a solder-globule fixing method, a plurality of glass fibers and a fibre holder. The solder-globule fixing method has provided therein a plurality of passages whose cross-sectional areas are smaller than the cross-sectional areas ofthe solder globules to be applied. The fibre holder is arranged relative to the solder-globule fixing device in such a way that between the fibre holder and the solder-globule fixing device a cavity is formed, which is adapted to be acted upon when submitted to pressure via a pressure-transmitting conduit. The fibre holder holds the glass fibres in alignment with the passages.
摘要翻译：将多个焊球施加到基板的方法具有焊球固定方法，多个玻璃纤维和纤维保持器。焊球固定方法在其中设置有多个通道，其横截面积小于要施加的焊球的横截面面积。光纤保持器相对于焊球固定装置布置成使得在光纤保持器和焊球固定装置之间形成空腔，该空腔适于当通过压力传递导管。纤维架将玻璃纤维与通道对准。

7. 发明申请

US20120017741A1 SAWING WIRE WITH ABRASIVE PARTICLES PARTLY EMBEDDED IN A METAL WIRE AND PARTLY HELD BY AN ORGANIC BINDER 有权
标题翻译：用金属线嵌入的一部分磨损颗粒的锯线和有机粘合剂的一部分
公开(公告)号：US20120017741A1
公开(公告)日：2012-01-26
申请号：US13260494
申请日：2010-04-28
申请人： Martin Lange , Jan Vaneecke , Rebecca Lameire
发明人： Martin Lange , Jan Vaneecke , Rebecca Lameire
IPC分类号： B26D1/547 , B28D1/12
CPC分类号： B28D5/042 , B23D61/185 , B24B27/0633 , Y10T83/9292
摘要： A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120,130) is that the application of a metallic binder layer (30) can be avoided. Metallic binder layers add to the cost of a fixed abrasive sawing wire and in many cases pose health and safety problems which can be avoided by the use of an organic binder layer. Moreover the advantages of a good fixture of the abrasive particles in the metallic wire are maintained. Different embodiments are presented with different degrees of embedment into the metal wire.
摘要翻译：提供具有磨料颗粒（20）的锯线（100,110,120,130），其中所述颗粒（20）部分地嵌入所述金属芯（14）中并且部分地嵌入所述有机粘合剂层（30）中。电线（100,110,120,130）的优点是可以避免金属粘合剂层（30）的应用。金属粘合剂层增加固定的磨料锯线的成本，并且在许多情况下造成健康和安全问题，这可以通过使用有机粘合剂层来避免。此外，保持金属线中磨料颗粒的良好固定的优点。不同的实施例具有不同程度的嵌入到金属丝中。

8. 发明授权

US06180434B2 Method for producing a contactless chip card 有权
标题翻译：无接触芯片卡的制造方法
公开(公告)号：US06180434B2
公开(公告)日：2001-01-30
申请号：US09284361
申请日：1999-04-13
申请人： Martin Lange , Ghassem Azdasht
发明人： Martin Lange , Ghassem Azdasht
IPC分类号： H01L2144
CPC分类号： G06K19/0775 , G06K19/07749
摘要： A method of producing a contactless chip card (10) includes first the step of holding a chip (14), which is provided with terminal pads (16a, 16b) on a surface thereof, in a mould defining a chip-card substrate (12), in such a way that the chip surface provided with the terminal pads is located substantially in the same plane as a chip-card substrate surface defined by the mould. In addition, a chip-card substrate material is introduced into the mould, whereupon a coil structure (18) is applied by screen-printing a conductive paste onto the chip-card substrate (12) in such a way that the coil structure (18) extends up to the terminal pads (16a, 16b) on the chip.
摘要翻译：一种制造非接触式芯片卡（10）的方法首先包括在其表面上设置有端子焊盘（16a，16b）的芯片（14）保持在限定芯片卡基板（12）的模具中的步骤），使得设置有端子焊盘的芯片表面基本上位于与由模具限定的芯片卡基板表面相同的平面中。此外，将芯片卡基材材料引入模具中，由此通过将导电浆料丝网印刷到芯片卡基材（12）上，使线圈结构（18）以线圈结构（18））延伸到芯片上的端子焊盘（16a，16b）。

9. 发明授权

US08720429B2 Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder 有权
标题翻译：锯切金属丝，磨料颗粒部分地嵌入金属丝中，部分地由有机粘合剂保持
公开(公告)号：US08720429B2
公开(公告)日：2014-05-13
申请号：US13260494
申请日：2010-04-28
申请人： Martin Lange , Jan Vaneecke , Rebecca Lameire
发明人： Martin Lange , Jan Vaneecke , Rebecca Lameire
IPC分类号： B28D5/04
CPC分类号： B28D5/042 , B23D61/185 , B24B27/0633 , Y10T83/9292
摘要： A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120,130) is that the application of a metallic binder layer (30) can be avoided. Metallic binder layers add to the cost of a fixed abrasive sawing wire and in many cases pose health and safety problems which can be avoided by the use of an organic binder layer. Moreover the advantages of a good fixture of the abrasive particles in the metallic wire are maintained. Different embodiments are presented with different degrees of embedment into the metal wire.
摘要翻译：提供具有磨料颗粒（20）的锯线（100,110,120,130），其中所述颗粒（20）部分地嵌入所述金属芯（14）中并且部分地嵌入所述有机粘合剂层（30）中。电线（100,110,120,130）的优点是可以避免金属粘合剂层（30）的应用。金属粘合剂层增加固定的磨料锯线的成本，并且在许多情况下造成健康和安全问题，这可以通过使用有机粘合剂层来避免。此外，保持金属线中磨料颗粒的良好固定的优点。不同的实施例具有不同程度的嵌入到金属线中。

10. 发明申请

US20130183094A1 PROCESS FOR REPAIRING ROAD SURFACING SYSTEMS, IN PARTICULAR FOR OPEN-PORE ASPHALTS 有权
标题翻译：维修道路交通系统的过程，特别是开放沥青路面
公开(公告)号：US20130183094A1
公开(公告)日：2013-07-18
申请号：US13686181
申请日：2012-11-27
申请人： Franz Xaver Redl , Holger Leifheit , Thomas Stuehrenberg , Martin Lange
发明人： Franz Xaver Redl , Holger Leifheit , Thomas Stuehrenberg , Martin Lange
IPC分类号： C09D175/04 , E01C23/06 , C09D195/00
CPC分类号： C09D175/04 , C09D195/00 , E01C7/187 , E01C23/06
摘要： The present invention relates to a process for repairing top layers for roads, tracks, and other areas used by traffic, by applying an amount of at least 20 g/m2 of a polymeric material to the damaged site, applying an amount of at least 80 g/m2 of a first polyurethane reaction mixture (which can comprise additives) to the polymeric material, and applying, to the first polyurethane reaction mixture, a mixture comprising mineral aggregate and a second polyurethane reaction mixture, and allowing the material to harden. The present invention further relates to a repair kit for repairing top layers for roads, tracks, and other areas used by traffic.
摘要翻译：本发明涉及通过将至少20g / m 2的聚合物材料施加至损坏部位的道路，轨道和其他交通使用区域来修复顶层的方法，施加至少80 g / m 2的第一聚氨酯反应混合物（其可以包含添加剂），并且向第一聚氨酯反应混合物施加包含矿物骨料和第二聚氨酯反应混合物的混合物，并允许该材料硬化。本发明还涉及一种用于修理用于道路，轨道和交通使用的其它区域的顶层的修理工具。

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