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1. 发明授权

US07071521B2 Process for producing microelectromechanical components and a housed microelectromechanical component 失效
标题翻译：用于生产微电子机械部件和容纳的微机电部件的方法
公开(公告)号：US07071521B2
公开(公告)日：2006-07-04
申请号：US10994659
申请日：2004-11-22
申请人： Jürgen Leib , Florian Bieck
发明人： Jürgen Leib , Florian Bieck
IPC分类号： H01L27/14 , H01L21/00 , H01L21/302
CPC分类号： B81C1/00301 , B81B2201/047 , B81B2207/096
摘要： A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.
摘要翻译：一种方法从基板产生微电子机械部件，该基板具有与第一侧基本相反的第一侧和第二侧，并且至少第一侧具有至少一个微机电元件。该方法包括以下步骤：将至少一个导电通道提供到基板中，将第一侧连接到第二侧，并将至少一个支撑件固定到基板的第一侧，其中至少一个导电通道被薄化覆盖具有机械稳定性的基板材料由支撑件确保。

2. 发明授权

US07285834B2 Process for producing microelectromechanical components and a housed microelectromechanical component 失效
标题翻译：用于生产微电子机械部件和容纳的微机电部件的方法
公开(公告)号：US07285834B2
公开(公告)日：2007-10-23
申请号：US11378962
申请日：2006-03-18
申请人： Jürgen Leib , Florian Bieck
发明人： Jürgen Leib , Florian Bieck
IPC分类号： H01L27/14 , H01L21/00
CPC分类号： B81C1/00301 , B81B2201/047 , B81B2207/096
摘要： A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.
摘要翻译：一种方法从基板产生微电子机械部件，该基板具有与第一侧基本相反的第一侧和第二侧，并且至少第一侧具有至少一个微机电元件。该方法包括以下步骤：将至少一个导电通道提供到衬底中，将第一侧连接到第二侧，以及将至少一个支撑件固定到衬底的第一侧，其中至少一个导电通道被薄化覆盖具有机械稳定性的基板材料由支撑件确保。

3. 发明授权

US07160478B2 Method for producing electronic componets 有权
标题翻译：电子元件的生产方法
公开(公告)号：US07160478B2
公开(公告)日：2007-01-09
申请号：US10487604
申请日：2002-08-26
申请人： Jürgen Leib , Florian Bieck
发明人： Jürgen Leib , Florian Bieck
IPC分类号： B29D11/00 , H01B13/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/02325 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.
摘要翻译：提供一种电子部件的制造方法。该方法包括在晶片上提供至少一个管芯，所述至少一个管芯至少在第一侧上具有至少一个传感器技术有源和/或发射器件; 产生至少一个具有至少一个可用于至少一个传感器技术活动和/或发射装置的结构的图案化载体; 将所述晶片与所述至少一个图案化支撑件接合，使得所述第一侧面向所述至少一个图案化支撑件; 以及将所述至少一个管芯与所述晶片分离。

4. 发明授权

US06911392B2 Process for making contact with and housing integrated circuits 失效
标题翻译：与集成电路接触和接收的过程
公开(公告)号：US06911392B2
公开(公告)日：2005-06-28
申请号：US10228699
申请日：2002-08-26
申请人： Florian Bieck , Jürgen Leib
发明人： Florian Bieck , Jürgen Leib
IPC分类号： H01L23/52 , H01L20060101 , H01L21/00 , H01L21/3205 , H01L21/44 , H01L21/76 , H01L21/768 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/485 , H01L25/16 , H01L27/146 , H01L31/02 , H01L31/0203
CPC分类号： H01L21/76877 , H01L21/76898 , H01L23/3114 , H01L24/13 , H01L24/14 , H01L24/94 , H01L25/0657 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14683 , H01L27/1469 , H01L31/0203 , H01L2221/68363 , H01L2224/02372 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/13024 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014
摘要： The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the to the terminal contact [sic] and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.
摘要翻译：本发明提出了一种用于为集成在基底材料中的至少一个部件产生电接触连接的方法，该基底材料具有第一表面区域，并且至少一个末端接触件至少部分地布置在第一表面区域中，其特征在于通过对第一表面区域施加覆盖物并且产生至少一个接触通道，该接触通道在衬底材料中相对于第一表面区域横向延伸，在该过程中，为了形成在要提供的第二表面区域中的至少一个接触位置，经由相应的接触通道产生从接触位置到至少一个端子接触件的至少一个电接触连接。非常有利的是，以这种方式可能在端子接触件上产生接触位置，因此可以在衬底材料的该侧上产生电连接到端子接触件的接触位置，该位置是远离有源表面，可以分配沿着衬底材料延伸的沟槽和根据现有技术围绕部件引导的侧向接触。

5. 发明授权

US08114304B2 Method for producing electronic components 失效
标题翻译：电子部件的制造方法
公开(公告)号：US08114304B2
公开(公告)日：2012-02-14
申请号：US11603388
申请日：2006-11-22
申请人： Jürgen Leib , Florian Bieck
发明人： Jürgen Leib , Florian Bieck
IPC分类号： B29D11/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/02325 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： In order to achieve an integration of functional structures into the housing of electronic components, provision is made of a method for producing an electronic component comprising at least one semiconductor element having at least one sensor-technologically active and/or emitting device on at least one side, the method comprising the following steps: provision of at least one die on a wafer, production of at least one patterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the at least one support, so that that side of the die which has the sensor-technologically active and/or emitting device faces the support, separation of the die.
摘要翻译：为了实现将功能结构集成到电子部件的壳体中，提供了一种用于制造电子部件的方法，所述电子部件包括至少一个半导体元件，所述至少一个半导体元件具有至少一个传感器技术活动和/或发射装置该方法包括以下步骤：在晶片上设置至少一个管芯，生产至少一个图案化支架，其具有至少一个对传感器技术活动和/或发射器件有功能的结构，具有至少一个支撑件的晶片，使得具有传感器技术活动和/或发射装置的模具的侧面朝向支撑件，模具的分离。

6. 发明授权

US07821106B2 Process for making contact with and housing integrated circuits 有权
标题翻译：与集成电路接触和接收的过程
公开(公告)号：US07821106B2
公开(公告)日：2010-10-26
申请号：US12042108
申请日：2008-03-04
申请人： Florian Bieck , Jürgen Leib
发明人： Florian Bieck , Jürgen Leib
IPC分类号： H01L29/40
CPC分类号： H01L21/76877 , H01L21/76898 , H01L23/3114 , H01L24/13 , H01L24/14 , H01L24/94 , H01L25/0657 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14683 , H01L27/1469 , H01L31/0203 , H01L2221/68363 , H01L2224/02372 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/13024 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014
摘要： A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.
摘要翻译：提供了一种用于制造集成在基底材料中的部件的电接触连接的方法，所述基底材料具有第一表面区域，并且至少一个末端接触件至少部分地布置在每个部件的第一表面区域中，其被区分特别是通过对第一表面区域施加覆盖物并生产至少一个接触通道，该接触通道在衬底材料中相对于第一表面区域横向延伸，在该过程中，为了形成至少一个接触位置在要设置的第二表面区域中，经由相应的接触通道产生从接触位置至至少一个端子触点的至少一个电接触连接。

7. 发明授权

US07700957B2 Process for making contact with and housing integrated circuits 失效
标题翻译：与集成电路接触和接收的过程
公开(公告)号：US07700957B2
公开(公告)日：2010-04-20
申请号：US10947974
申请日：2004-09-22
申请人： Florian Bieck , Jürgen Leib
发明人： Florian Bieck , Jürgen Leib
IPC分类号： H01L27/15
CPC分类号： H01L21/76877 , H01L21/76898 , H01L23/3114 , H01L24/13 , H01L24/14 , H01L24/94 , H01L25/0657 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14683 , H01L27/1469 , H01L31/0203 , H01L2221/68363 , H01L2224/02372 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/13024 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014
摘要： The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the terminal contact and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.
摘要翻译：本发明提出了一种用于为集成在基底材料中的至少一个部件产生电接触连接的方法，该基底材料具有第一表面区域，并且至少一个末端接触件至少部分地布置在第一表面区域中，其特征在于通过对第一表面区域施加覆盖物并且产生至少一个接触通道，该接触通道在衬底材料中相对于第一表面区域横向延伸，在该过程中，为了形成在要提供的第二表面区域中的至少一个接触位置，经由相应的接触通道产生从接触位置到至少一个端子接触件的至少一个电接触连接。非常有利的是，以这种方式可能在端子触点上产生接触位置，因此可以在基板材料的远离有源表面的那侧上产生电连接到端子触点的接触位置，可以分配沿着衬底材料延伸的沟槽和根据现有技术围绕部件引导的侧向接触。

8. 发明授权

US09076779B1 Packaging of electronic circuitry 有权
标题翻译：电子电路封装
公开(公告)号：US09076779B1
公开(公告)日：2015-07-07
申请号：US13438707
申请日：2012-04-03
申请人： Florian Bieck , Robert J. Montgomery
发明人： Florian Bieck , Robert J. Montgomery
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49541 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/367 , H01L23/5389 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/24 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/96 , H01L2221/68327 , H01L2221/68372 , H01L2224/0401 , H01L2224/0603 , H01L2224/06181 , H01L2224/12105 , H01L2224/13014 , H01L2224/1403 , H01L2224/14051 , H01L2224/24137 , H01L2224/24195 , H01L2224/73259 , H01L2224/9222 , H01L2224/96 , H01L2924/10253 , H01L2924/1203 , H01L2924/1306 , H01L2924/181 , H01L2224/82 , H01L2224/11 , H01L2924/00012 , H01L2924/00
摘要： The present disclosure includes novel techniques to provide wafer level fan-outs in electronic circuit packages housing one or more circuit devices, at least one of which has input and/or output nodes disposed on opposite facings.
摘要翻译：本公开包括用于在容纳一个或多个电路器件的电子电路封装中提供晶片级扇出的新技术，其中至少一个具有设置在相对面上的输入和/或输出节点。

9. 发明申请

US20050042786A1 Process for making contact with and housing integrated circuits 失效
标题翻译：与集成电路接触和接收的过程
公开(公告)号：US20050042786A1
公开(公告)日：2005-02-24
申请号：US10947974
申请日：2004-09-22
申请人： Florian Bieck , Jurgen Leib
发明人： Florian Bieck , Jurgen Leib
IPC分类号： H01L23/52 , H01L20060101 , H01L21/00 , H01L21/3205 , H01L21/44 , H01L21/76 , H01L21/768 , H01L23/00 , H01L23/12 , H01L23/31 , H01L23/485 , H01L25/16 , H01L27/146 , H01L31/02 , H01L31/0203
CPC分类号： H01L21/76877 , H01L21/76898 , H01L23/3114 , H01L24/13 , H01L24/14 , H01L24/94 , H01L25/0657 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14683 , H01L27/1469 , H01L31/0203 , H01L2221/68363 , H01L2224/02372 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/13024 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2225/06582 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014
摘要： The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the terminal contact and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.
摘要翻译：本发明提出了一种用于为集成在基底材料中的至少一个部件产生电接触连接的方法，该基底材料具有第一表面区域，并且至少一个末端接触件至少部分地布置在第一表面区域中，其特征在于通过对第一表面区域施加覆盖物并且产生至少一个接触通道，该接触通道在衬底材料中相对于第一表面区域横向延伸，在该过程中，为了形成在要提供的第二表面区域中的至少一个接触位置，经由相应的接触通道产生从接触位置到至少一个端子接触件的至少一个电接触连接。非常有利的是，以这种方式可能在端子触点上产生接触位置，因此可以在基板材料的远离有源表面的那侧上产生电连接到端子触点的接触位置，可以分配沿着衬底材料延伸的沟槽和根据现有技术围绕部件引导的侧向接触。

10. 发明申请

US20120168940A1 APPARATUS AND METHOD OF APPLYING A FILM TO A SEMICONDUCTOR WAFER AND METHOD OF PROCESSING A SEMICONDUCTOR WAFER 有权
标题翻译：将膜应用于半导体波长的装置和方法以及加工半导体波形的方法
公开(公告)号：US20120168940A1
公开(公告)日：2012-07-05
申请号：US13394812
申请日：2010-10-14
申请人： Florian Bieck
发明人： Florian Bieck
IPC分类号： H01L23/48 , B32B37/10 , B32B38/10 , H01L21/31
CPC分类号： H01L21/31 , H01L21/67132 , H01L21/76898 , H01L23/481 , H01L2224/02372 , H01L2224/0401 , H01L2224/05024 , H01L2224/05025 , H01L2224/11 , H01L2224/13 , H01L2924/1461 , Y10T156/12 , H01L2924/00
摘要： Implementations and techniques for applying a film to a semiconductor wafer and for processing a semiconductor wafer are generally disclosed.
摘要翻译：通常公开了将膜施加到半导体晶片和用于处理半导体晶片的实施方式和技术。

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