会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Method for high-precision fixing of a miniaturized component on a support plate
    • 用于在支撑板上高精度地固定小型化部件的方法
    • US07759604B2
    • 2010-07-20
    • US11460206
    • 2006-07-26
    • Laurent StaufferPeter KipferHeinz Bernhard
    • Laurent StaufferPeter KipferHeinz Bernhard
    • B23K26/20B23K1/005
    • G02B7/02B23K1/0056G02B7/00H05K3/202H05K3/341H05K3/3494H05K2201/062H05K2201/0969H05K2203/0195H05K2203/107Y02P70/613Y10T29/31
    • The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space. Supply of electromagnetic radiation (12) to the bottom (6) of the fixing section (3) for melting the solder material (8′) so that, as a result of drop formation and optionally as a result of lowering of the component (1) the space fills with molten solder material (8′) for mutual fixing. Waiting for the mutual fixing by resolidification of the molten solder material (8′).
    • 本发明涉及一种用于通过焊接接头在支撑板(4)的预定固定部分(3)上高精度固定小型化部件(1)的方法,特别是具有微光学元件(2)。 支撑板由金属材料形成,并且具有包围固定部分(3)的切口区域(10),由支撑板(4)的至少一个连接腹板(9)桥接,保持 从固定部(3)向剩余的支撑板的热传递较低,并补偿固定部(3)的横向热膨胀。 将焊料(8)施加在固定部(3)的顶部。 该方法特别包括以下步骤:在固定部分(3)上方的部件(1)的布置,部件(1)的焊料材料(8)和基部(7)以相对的位置存在而不接触和形成 一个空间 向固定部分(3)的底部(6)提供电磁辐射(12),以熔化焊料(8'),使得由于液滴形成和任选地由于部件(1)的降低 ),空间填充有熔融焊料(8')以进行相互固定。 通过重新熔化焊料材料(8')等待相互固定。