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1. 发明授权

US5698068A Thermocompression bonding equipment 失效
标题翻译：热压粘合设备
公开(公告)号：US5698068A
公开(公告)日：1997-12-16
申请号：US429695
申请日：1995-04-27
申请人： Iwao Ichikawa , Norio Kawatani , Kazuaki Suzuki , Yukio Yamada
发明人： Iwao Ichikawa , Norio Kawatani , Kazuaki Suzuki , Yukio Yamada
IPC分类号： H01R43/00 , B29C65/00 , B29C65/18 , G02F1/1345 , H01R43/02 , H05K3/32 , B30B15/34
CPC分类号： B29C65/18 , B29C65/305 , B29C66/80 , B29C66/81427 , B29C66/8167 , B29C66/8322 , B29C66/836
摘要： This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.
摘要翻译：本发明提供一种热压接设备，当要被接合的材料被改变时，允许容易地更换和制备压接头，减少更换所需的工作时间并制备压接头，并且简化了压接头。热压接设备设置有头单元20，头单元20包括基座10，热压接头56和用于滑动设置在基座10上的热压接头56的滑动机构50，独立于头单元构造的按压装置30，用于按压滑动机构50以滑动热压接头56，从而热压接ACF，LCD和TAB的材料，以及设置有用于定位基座10的定位装置40,41的基架40。

2. 发明授权

US5439161A Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device 失效
标题翻译：热压接合装置，热压接法及制造液晶显示装置的工序
公开(公告)号：US5439161A
公开(公告)日：1995-08-08
申请号：US301389
申请日：1994-09-07
申请人： Norio Kawatani , Iwao Ichikawa , Kazuaki Suzuki , Yukio Yamada
发明人： Norio Kawatani , Iwao Ichikawa , Kazuaki Suzuki , Yukio Yamada
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/00 , H01L21/603
CPC分类号： H01L21/67138 , H01L24/80 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/14
摘要： A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.
摘要翻译：一种热压接装置，其中通过热压接可以高精度地连接对象部分，并且整个装置不会由于高压而容易地变形，并且可以以高度的细度将大尺寸的部件连接在一起准确性。热压接装置被构造成通过热压接将第一构件结合到第二构件，并且包括基座构件，用于将第二构件保持在其上的保持装置，用于向第一构件施加热量的发热元件，以及加压构件，用于将发热元件按压在第一构件和第二构件上。保持装置，发热元件和加压构件与基座构件分开设置。还公开了使用热压接装置进行的热压接方法和制造液晶显示装置的方法。

3. 发明申请

US20050071990A1 Electronic-component alignment method and apparatus therefor 失效
标题翻译：电子部件对准方法及其装置
公开(公告)号：US20050071990A1
公开(公告)日：2005-04-07
申请号：US10495905
申请日：2003-09-30
申请人： Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
发明人： Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
IPC分类号： B41J2/14 , H01L21/00 , H01L21/68 , H05K1/02 , H05K3/30 , B23Q15/00
CPC分类号： H01L21/67294 , B41J2/14024 , H01L21/67144 , H01L21/67259 , H01L21/681 , H05K1/0269 , H05K3/303 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： Two electronic components can be accurately aligned with each other such that a mark-recognition apparatus captures mutually corresponding alignment marking-means of the two components in the same fields of view thereof and measures the positions of the two components. A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon so as to have an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. Thus, in a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.
摘要翻译：两个电子部件可以彼此准确地对准，使得标记识别装置在相同视场中捕获两个部件的相互对应的对准标记装置，并测量两个部件的位置。具有在其预定位置穿过预定位置以彼此间隔预定间隔的两个对准孔的第一电子部件用接收台保持，并且还具有形成在其上的预定位置处的两个对准标记的第二电子部件，以便在两个对准孔之间的间隔与位置调节机构保持一致。因此，在第二电子部件的对准标记被引入第一电子部件的对应的对准孔的状态下，标记识别装置在相同的视场中捕获对准标记和对准孔，并且测量两个部件的位置和位置调节机构调节第二电子部件的位置，使得第二电子部件的对准标记位于第一电子部件的对准孔中的预定位置。

4. 发明授权

US07594319B2 Electronic-component alignment method 失效
标题翻译：电子元器件对准方法
公开(公告)号：US07594319B2
公开(公告)日：2009-09-29
申请号：US11420245
申请日：2006-05-25
申请人： Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
发明人： Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
IPC分类号： H05K3/30
CPC分类号： H01L21/67294 , B41J2/14024 , H01L21/67144 , H01L21/67259 , H01L21/681 , H05K1/0269 , H05K3/303 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon so as to have an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.
摘要翻译：具有在其预定位置穿过预定位置以彼此间隔预定间隔的两个对准孔的第一电子部件用接收台保持，并且还具有形成在其上的预定位置处的两个对准标记的第二电子部件，以便在两个对准孔之间的间隔与位置调节机构保持一致。在第二电子部件的对准标记被引入第一电子部件的对应的对准孔的状态下，标记识别装置在相同的视场中捕获对准标记和对准孔，并测量位置并且位置调节机构调节第二电子部件的位置，使得第二电子部件的对准标记位于第一电子部件的对准孔中的预定位置。

5. 发明授权

US5683026A Pressure-bonding unit and pressure-bonding head unit 失效
标题翻译：压接单元和压接头单元
公开(公告)号：US5683026A
公开(公告)日：1997-11-04
申请号：US650311
申请日：1996-05-20
申请人： Norio Kawatani , Hirokazu Nakayama
发明人： Norio Kawatani , Hirokazu Nakayama
IPC分类号： H01L21/603 , B23K37/00 , B23K20/02
CPC分类号： H01L24/80 , H01L2924/01033 , H01L2924/01068 , H01L2924/14 , H01L2924/351
摘要： A thermocompression-bonding unit and a pressure-bonding head unit which are structurally simple and where reliability is high. The pressure-bonding head unit includes a pressure-bonding head; pressure-bonding head holding means for integrally fixing and holding the pressure-bonding head, the pressure-bonding head holding means being formed with a cutout from a first direction side in parallel with the pressure-bonding surface and also being formed with an opening perpendicular both to the first direction and the pressure-bonding surface; first deformation means for deforming the pressure-bonding head holding means so that a cutout inlet of the cutout opens or closes by a desired amount; and second deformation means for deforming the pressure-bonding head holding means so that one opening end or the other opening end of the opening is crushed in a direction parallel to the first direction by a desired amount. Thus the pressure-bonding unit and the pressure-bonding head unit, which are structurally simple and where reliability is high, can be realized.
摘要翻译：结构简单，可靠性高的热压接单元和压接头单元。压接头单元包括压接头; 压接头保持装置，用于一体地固定和保持压接头，压接头保持装置在与压接表面平行的第一方向侧形成有切口，并且还形成有垂直的开口两者相对于第一方向和压接表面; 第一变形装置，用于使压接头保持装置变形，使得切口的切口入口打开或关闭期望的量; 以及第二变形装置，用于使压接头保持装置变形，使得开口的一个开口端或另一个开口端在平行于第一方向的方向上被粉碎所需的量。因此，可以实现结构简单且可靠性高的压接单元和压接头单元。

6. 发明授权

US07251883B2 Electronic-component alignment method and apparatus therefor 失效
标题翻译：电子部件对准方法及其装置
公开(公告)号：US07251883B2
公开(公告)日：2007-08-07
申请号：US10495905
申请日：2003-09-30
申请人： Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
发明人： Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
IPC分类号： H05K3/30 , B23P21/00 , B23Q15/00
CPC分类号： H01L21/67294 , B41J2/14024 , H01L21/67144 , H01L21/67259 , H01L21/681 , H05K1/0269 , H05K3/303 , H05K13/0812 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon at an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.
摘要翻译：具有以预定间隔在其预定位置穿孔的两个对准孔的第一电子部件与接收台一起保持，并且还具有在其间以间隔形成在其上的间隔处的预定位置的两个对准标记的第二电子部件与两者之间的间隔一致定位孔用位置调节机构保持。在第二电子部件的对准标记被引入第一电子部件的对应的对准孔的状态下，标记识别装置在相同的视场中捕获对准标记和对准孔，并测量位置并且位置调节机构调节第二电子部件的位置，使得第二电子部件的对准标记位于第一电子部件的对准孔中的预定位置。

7. 发明授权

US4733462A Apparatus for positioning circuit components at predetermined positions and method therefor 失效
标题翻译：用于将电路部件定位在预定位置的装置及其方法
公开(公告)号：US4733462A
公开(公告)日：1988-03-29
申请号：US867926
申请日：1986-05-29
申请人： Norio Kawatani
发明人： Norio Kawatani
IPC分类号： H05K3/00 , H05K3/30 , H05K13/04 , H05K3/34 , B23P19/00
CPC分类号： H05K13/0413 , H05K13/046 , H05K3/0008 , H05K2201/09781 , H05K2203/0195 , H05K2203/167 , H05K3/303 , Y10S269/903 , Y10T29/49133 , Y10T29/49144 , Y10T29/53261
摘要： An apparatus for positioning circuit components such as flat package IC's at predetermined positions of a printed circuit board and a method therefor are disclosed. In the apparatus, a guide body is provided on the printed circuit board and a positioning member is installed on a retainer plate which holds one of the circuit components. The guide portion guides the positioning member to a point where the component coincides with the predetermined position.
摘要翻译：公开了一种用于在诸如印刷电路板的预定位置处定位诸如扁平封装IC的电路部件的装置及其方法。在该装置中，引导体设置在印刷电路板上，并且定位部件安装在保持电路部件之一的保持板上。引导部分将定位构件引导到组件与预定位置一致的点。

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