专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5463016A Granular material of polyimide precursor, mixture comprising the material and process for producing the material 失效
标题翻译：聚酰亚胺前体的颗粒材料，包含该材料的混合物和用于生产该材料的方法
公开(公告)号：US5463016A
公开(公告)日：1995-10-31
申请号：US193887
申请日：1994-02-09
申请人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo
发明人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo
IPC分类号： B29C55/02 , B29K79/00 , C08G73/10 , C08J3/12 , C08J3/14 , C08L79/08 , C09D179/08 , H01B3/30 , C08G77/10 , C08G69/26
CPC分类号： C08G73/1032 , C08J3/12 , C08J3/14 , C08J2379/08
摘要： This invention provides (1) a granular material of a polyimide precursor, which has excellent solubility in solvents and excellent moldability and from which a polyimide molding having excellent mechanical properties can be produced, (2) a mixture of a granular material of a polyimide precursor with a solvent, in which the polyimide precursor shows excellent storage stability and (3) a process for the production of a granular material of a polyimide precursor, in which a solvent can be easily removed. Particularly provided are a polyimide precursor granular material having an intrinsic viscosity of 0.7 or higher and a polyimide precursor mixture which consists of a polyimide precursor granular polyimide having an intrinsic viscosity of 0.7 or higher and a solvent that does not exhibit a strong-mutual interaction with the polyimide precursor, as well as a process for the production of the polyimide precursor granular material. The granular material of a polyimide precursor can be obtained by allowing a tetracarboxylic dianhydride to undergo polymerization reaction with a diamine in a solvent that does not exhibit a strong mutual interaction with the polyimide precursor.
摘要翻译：本发明提供（1）聚酰亚胺前体的粒状材料，其在溶剂中的溶解性优异，成型性优异，可以制造出具有优异的机械性能的聚酰亚胺成型体，（2）聚酰亚胺前体的粒状材料与聚酰亚胺前体显示优异的储存稳定性的溶剂和（3）可以容易地除去溶剂的聚酰亚胺前体的粒状材料的制造方法。特别提供特性粘度为0.7以上的聚酰亚胺前体粒状材料和由特性粘度为0.7以上的聚酰亚胺前体粒状聚酰亚胺构成的聚酰亚胺前体混合物和不显示与聚酰亚胺前体，以及聚酰亚胺前体粒状材料的制造方法。聚酰亚胺前体的粒状材料可以通过使四羧酸二酐与不与聚酰亚胺前体表现出强相互作用的溶剂中的二胺进行聚合反应来获得。

2. 发明授权

US5466732A Polyimide precursor solution, process for producing the solution and moldings and coatings obtained therefrom 失效
标题翻译：聚酰亚胺前体溶液，用于制备溶液的方法和由其获得的模制品和涂料
公开(公告)号：US5466732A
公开(公告)日：1995-11-14
申请号：US217767
申请日：1994-03-25
申请人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo
发明人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo
IPC分类号： B29C55/02 , B29K79/00 , C08G73/10 , C08J3/09 , C08J3/12 , C08J3/14 , C08L79/08 , C09D179/08 , H01B3/30 , C08J3/11 , C08K5/15
CPC分类号： C08J3/095 , C08G73/1032 , C08J3/12 , C08J3/14 , C08J2379/08
摘要： A polyimide precursor solution which comprises a polyimide precursor and a solvent wherein the polyimide precursor and the solvent are not solated strongly. A process for the production of the polyimide precursor solution, as well as moldings and coatings obtained from the solution.The polyimide precursor solution of the present invention has excellent storage stability, and the solvent can be removed easily at the time of the production of moldings or coatings. According to the process of the present invention, the polyimide precursor solution can be produced easily using simple apparatus and an inexpensive solvent(s) having low toxicity. The polyimide molding obtained from the polyimide precursor solution has excellent uniformity and no residual solvent. The polyimide coating obtained from the polyimide precursor solution has excellent uniformity, no residual solvent and excellent adhesiveness to a base material.
摘要翻译：一种聚酰亚胺前体溶液，其包含聚酰亚胺前体和溶剂，其中聚酰亚胺前体和溶剂不能很强地溶剂化。用于生产聚酰亚胺前体溶液的方法，以及从溶液获得的模制品和涂料。本发明的聚酰亚胺前体溶液具有优异的储存稳定性，并且在制造模制品或涂料时可以容易地除去溶剂。根据本发明的方法，可以使用简单的装置和廉价的低毒性溶剂容易地制造聚酰亚胺前体溶液。由聚酰亚胺前体溶液获得的聚酰亚胺模塑制品具有优异的均匀性和无残留溶剂。由聚酰亚胺前体溶液获得的聚酰亚胺涂层具有优异的均匀性，无残余溶剂和对基材的优异粘附性。

3. 发明授权

US06294049B1 Polyimide precursor fibrid, polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom, and process for producing the fibrid and the paper products 失效
标题翻译：聚酰亚胺前体纤维原料，聚酰亚胺纸，聚酰亚胺复合纸和由其制得的聚酰亚胺复合板，以及制备纤条体和纸制品的方法
公开(公告)号：US06294049B1
公开(公告)日：2001-09-25
申请号：US08428497
申请日：1995-04-27
申请人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo , Masato Wada
发明人： Isao Tomioka , Takeshi Nakano , Mikio Furukawa , Yoshiaki Echigo , Masato Wada
IPC分类号： D21M1326
CPC分类号： C08G73/1028 , D01D5/40 , D01F6/74 , D21H13/26
摘要： A polyimide precursor fibrid material which comprises a polyimide precursor that forms a polyimide having a property of no thermal melting when subjected to a ring closure reaction and which is substantially free from aprotic polar organic solvents, and polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom. Since the inventive polyimide precursor fibrid material does not contain aprotic polar organic solvents, a polyimide paper product having excellent strength can be obtained from the polyimide precursor fibrid material, and a polyimide composite paper product and a polyimide composite board both consisting of uniformly dispersed components and having excellent strength can be obtained from the polyimide precursor fibrids and other staple fibers.
摘要翻译：一种聚酰亚胺前体纤条体，其包含聚酰亚胺前体，该聚酰亚胺前体在进行闭环反应时形成不具有热熔性质并且基本上不含非质子极性有机溶剂的聚酰亚胺，聚酰亚胺纸，聚酰亚胺复合纸和聚酰亚胺复合板由此获得。由于本发明的聚酰亚胺前体纤条体不含非质子极性有机溶剂，所以可以从聚酰亚胺前体纤条体材料和聚酰亚胺复合纸制品和聚酰亚胺复合板获得具有优异强度的聚酰亚胺纸制品，它们均匀分散的组分和可以从聚酰亚胺前体纤条体和其它短纤维获得优异的强度。

4. 发明授权

US5510395A Film forming solution, porous film obtained therefrom and coated material with the porous film 失效
标题翻译：成膜溶液，由此获得的多孔膜和具有多孔膜的涂覆材料
公开(公告)号：US5510395A
公开(公告)日：1996-04-23
申请号：US194310
申请日：1994-02-10
申请人： Isao Tomioka , Minoru Saito , Hiroshi Yamada , Yoshiaki Iwaya , Yoshiaki Echigo
发明人： Isao Tomioka , Minoru Saito , Hiroshi Yamada , Yoshiaki Iwaya , Yoshiaki Echigo
IPC分类号： C08G73/10 , C09D179/08 , H05K1/03 , B32B15/08 , C08G63/44 , C08G69/44
CPC分类号： C08G73/1071 , C08G73/1032 , C09D179/08 , H05K1/0346 , Y10T428/31681 , Y10T428/31721
摘要： A film forming solution which does not require aprotic polar solvents, a porous film of poly(4,4'-oxydiphenylenepyromellitimide) obtained from the film forming solution which has excellent heat and chemical resistances, which is controllable in terms of porosity and pore size of the film and which has excellent electrical characteristics, and a coated material where the porous film is formed on a base material.Particularly, a film forming solution of a precursor of poly(4,4'-oxydiphenylenepyromellitimide) and a mixture of at least three solvents which are poor solvents for the precursor when each solvent is used alone, a porous film of poly(4,4'-oxydiphenylenepyromellitimide) obtained from the film forming solution and a coated material where the porous film is formed on a base material.
摘要翻译：不需要非质子极性溶剂的成膜溶液，由成膜溶液获得的具有优异的耐热和耐化学性的聚（4,4'-氧联二苯基甲酰基亚胺）多孔膜，其孔隙率和孔径可控制该膜具有优异的电气特性，以及在基材上形成多孔膜的涂覆材料。特别是，当单独使用溶剂时，作为前体的不良溶剂的聚（4,4'-氧二苯基甲苯酰亚胺）的前体的成膜溶液和至少三种溶剂的混合物，聚由该成膜溶液获得的“ - 二氧化二苯甲酰基亚胺酰亚胺”和在基材上形成多孔膜的涂布材料。

5. 发明授权

US5719253A Poly(amic acid) solution and polyimide film or polymide-coated material obtained therefrom 失效
标题翻译：聚（酰胺酸）溶液和由其获得的聚酰亚胺膜或聚酰亚胺涂层材料
公开(公告)号：US5719253A
公开(公告)日：1998-02-17
申请号：US539740
申请日：1995-10-05
申请人： Yoshiaki Echigo , Shoji Okamoto , Hiroshi Yamada , Isao Tomioka , Yoshiaki Iwaya
发明人： Yoshiaki Echigo , Shoji Okamoto , Hiroshi Yamada , Isao Tomioka , Yoshiaki Iwaya
IPC分类号： C08G73/10 , C09D179/08 , H05K1/03 , C08K5/17
CPC分类号： C08G73/1007 , C08G73/1032 , C09D179/08 , H05K1/0346
摘要： This invention provides a poly(amic acid) solution which does not contain aprotic polar solvents such as DMF, NMP, DMAc, DMSO, as well as a polyimide film obtained therefrom having appropriate flexibility and a small coefficient of linear thermal expansion and a coated material in which the polyimide film is formed on a substrate. More particularly, it provides a poly(amic acid) solution which has an aromatic poly(amic acid) and a tertiary amine as the solute and a water soluble alcohol compound and/or a water soluble ether compound as the solvent and contains substantially no aprotic polar solvent, as well as a polyimide film obtained from the poly(amic acid) solution and a coated material obtained by forming the film on a substrate.
摘要翻译：本发明提供不含非质子极性溶剂如DMF，NMP，DMAc，DMSO的聚（酰胺酸）溶液，以及由其获得的具有适当柔性和小的线性热膨胀系数的涂覆材料其中聚酰亚胺膜形成在基底上。更具体地，它提供了具有芳族聚（酰胺酸）和叔胺作为溶质的聚（酰胺酸）溶液和水溶性醇化合物和/或水溶性醚化合物作为溶剂，并且基本上不含非质子极性溶剂，以及由聚（酰胺酸）溶液获得的聚酰亚胺膜和通过在基材上形成膜得到的涂布材料。

6. 发明申请

US20090246554A1 LAMINATE HAVING PEELABILITY AND PRODUCTION METHOD THEREFOR 审中-公开
标题翻译：具有可剥离性和生产方法的层压板
公开(公告)号：US20090246554A1
公开(公告)日：2009-10-01
申请号：US12310219
申请日：2008-05-09
申请人： Mikio Furukawa , Seiji Sejima , Yoshiaki Echigo
发明人： Mikio Furukawa , Seiji Sejima , Yoshiaki Echigo
IPC分类号： B32B15/088 , B32B15/04 , B32B37/12 , B32B15/01 , B32B15/08 , B05D5/12 , C23C28/02
CPC分类号： H05K3/025 , H05K1/0346 , H05K1/0393 , H05K2201/0154 , H05K2201/0317 , H05K2203/0152 , H05K2203/0156 , H05K2203/0264 , Y10T428/12 , Y10T428/12778 , Y10T428/26 , Y10T428/31678 , Y10T428/31681
摘要： A metal conductor layer is provided on at least one surface of a heat resistant base. The heat resistant base is peelable from the metal conductor layer. The heat resistant base is preferably a metal foil or a non-thermoplastic polyimide resin film. The metal conductor layer preferably includes a vapor deposition metal layer and/or a plating metal layer. The metal conductor layer preferably includes a metal layer (I) formed in an interface with the heat resistant base by vapor deposition, and at least one metal layer (II) formed on the metal layer (I) by vapor deposition or electroplating. At least one insulative film layer of a non-thermoplastic polyimide resin may be provided on the metal conductor layer.
摘要翻译：金属导体层设置在耐热基底的至少一个表面上。耐热基座可从金属导体层剥离。耐热基材优选为金属箔或非热塑性聚酰亚胺树脂膜。金属导体层优选包括蒸镀金属层和/或电镀金属层。金属导体层优选包括通过气相沉积与耐热基底的界面形成的金属层（I），以及通过气相沉积或电镀在金属层（I）上形成的至少一个金属层（II）。可以在金属导体层上设置至少一层非热塑性聚酰亚胺树脂的绝缘膜层。

7. 发明授权

US08492506B2 Polyimide resin composition, polyimide precursor resin composition for the same, production method thereof, and polyimide film and production method thereof 有权
标题翻译：聚酰亚胺树脂组合物，聚酰亚胺前体树脂组合物及其制备方法及其制备方法
公开(公告)号：US08492506B2
公开(公告)日：2013-07-23
申请号：US12310288
申请日：2008-08-07
申请人： Takeshi Yoshida , Akira Shigeta , Yoshiaki Echigo
发明人： Takeshi Yoshida , Akira Shigeta , Yoshiaki Echigo
IPC分类号： C08G73/10 , C08G73/00 , C08G6/00 , B29D7/00
CPC分类号： C08G73/10 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/14 , C08J5/18 , C08J2379/08 , C08L79/08 , H05K1/0346
摘要： An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used. The present invention relates to a polyimide precursor resin composition, comprising a polyamide-imide (A) containing a diamine monomer unit represented by the following formula (1) and a polyamic acid (B) containing at least one kind of monomer unit selected tetracarboxylic acid monomer units represented by the following formulae (2p) to (2r), wherein the haze of the film having a thickness of 40 μm obtained by imidation of the polyimide precursor resin composition is 4% or less: (wherein, R represents an alkylene group having 1 to 5 carbon atoms);
摘要翻译：为了解决上述问题而提出的本发明的目的在于提供一种透明性优异的聚酰亚胺前体树脂组合物，其能够降低成型时的残留挥发物的比率，并提供聚酰亚胺树脂组合物（例如聚酰亚胺膜）优异即使使用较便宜的聚酰胺 - 酰亚胺也具有机械性能和透明度。本发明涉及一种聚酰亚胺前体树脂组合物，其包含含有由下式（1）表示的二胺单体单元的聚酰胺 - 酰亚胺（A）和含有至少一种单体单元选择的四羧酸的聚酰胺酸（B）由下式（2p）至（2r）表示的单体单元，其中通过酰亚胺化聚酰亚胺前体树脂组合物获得的厚度为40μm的膜的雾度为4％以下：（其中，R表示亚烷基具有1至5个碳原子）;

8. 发明授权

US07384683B2 Substrate for flexible printed wiring board and method for manufacturing the same 失效
标题翻译：柔性印刷电路板用基板及其制造方法
公开(公告)号：US07384683B2
公开(公告)日：2008-06-10
申请号：US10571084
申请日：2004-09-10
申请人： Yoshiaki Echigo , Jusirou Eguchi , Akira Shigeta , Makoto Uchida , Shigeru Moteki
发明人： Yoshiaki Echigo , Jusirou Eguchi , Akira Shigeta , Makoto Uchida , Shigeru Moteki
IPC分类号： B32B3/00 , H05K1/00 , C09J5/10
CPC分类号： H05K1/036 , H05K1/0346 , H05K1/0393 , H05K2201/0195 , H05K2201/043 , Y10T428/24917 , Y10T428/31511 , Y10T428/31515 , Y10T428/31681 , Y10T428/31721
摘要： The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 μm and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N/cm or more.
摘要翻译：本发明提供一种柔性印刷电路板用基板，其具有包含环氧树脂组合物的粘合剂层，分别层叠在粘合剂层的两面上的绝缘层，分别形成有一对含有非热塑性聚酰亚胺树脂的膜和导体层设置在膜的外表面上。分别层叠在粘合剂层的两面上的绝缘层的总厚度为10〜100μm，粘合剂层的厚度的2〜10倍。通过粘合剂层中间的绝缘层之间的相互粘附强度为7.0N / cm以上。

9. 发明授权

US5994418A Hollow polyimide microspheres 有权
标题翻译：中空聚酰亚胺微球
公开(公告)号：US5994418A
公开(公告)日：1999-11-30
申请号：US316865
申请日：1999-05-21
申请人： Erik S. Weiser , Terry L. St. Clair , Yoshiaki Echigo , Hisayasu Kaneshiro
发明人： Erik S. Weiser , Terry L. St. Clair , Yoshiaki Echigo , Hisayasu Kaneshiro
IPC分类号： B01J13/04 , C08J9/02 , C08J9/32 , B01J13/02
CPC分类号： C08J9/32 , B01J13/04 , C08J2379/08 , Y10S264/06
摘要： A shaped article composed of an aromatic polyimide has a hollow, essentially spherical structure and a particle size of about 100 to about 1500 .mu.m, a density of about 1 to about 6 pounds/ft.sup.3 and a volume change of 1 to about 20% by a pressure treatment of 30 psi for 10 minutes at room temperature. A syntactic foam, made of a multiplicity of the shaped articles which are bounded together by a matrix resin to form an integral composite structure, has a density of about 3 to about 30 pounds/ft.sup.3 and a compression strength of about 100 to about 1400 pounds/in.sup.2.
摘要翻译：由芳族聚酰亚胺组成的成形制品具有中空的，基本上为球形的结构，并且具有约100至约1500μm的粒度，约1至约6磅/ ft 3的密度和1至约20％的体积变化，由在室温下压力处理30psi 10分钟。由多个成形制品制成的复合泡沫体，其通过基质树脂结合以形成整体复合结构，其密度为约3至约30磅/英3 3，压缩强度为约100至约1400磅 / in2。

10. 发明授权

US5348818A Carbonaceous material and a cell using the same 失效
标题翻译：碳质材料和使用其的电池
公开(公告)号：US5348818A
公开(公告)日：1994-09-20
申请号：US006498
申请日：1993-01-21
申请人： Keiichi Asami , Hideki Takahashi , Katsuo Inoue , Yoshiaki Echigo , Toshiyuki Ohsawa , Toshiyuki Kabata
发明人： Keiichi Asami , Hideki Takahashi , Katsuo Inoue , Yoshiaki Echigo , Toshiyuki Ohsawa , Toshiyuki Kabata
IPC分类号： D01F9/28 , H01M4/02 , H01M4/137 , H01M4/58 , H01M4/587 , H01M4/60 , H01M4/62 , H01M10/0525 , H01M10/0562 , H01M10/36 , C01B31/02
CPC分类号： H01M4/587 , D01F9/28 , H01M10/0525 , H01M4/02 , H01M4/60 , H01M4/624 , H01M10/0562 , H01M4/137 , H01M4/625
摘要： The present invention provides a carbonaceous material suitable for an electrode of a secondary cell. The carbonaceous material has a specific surface area by BET method of at least 10 m.sup.2 /g and a nitrogen/carbon atom weight ratio of 0.15 to 0.01, and is obtained by heat-treating a polyimide polymer having repeating units represented by: ##STR1## wherein R represents a 4 valent aromatic residue having at least one aromatic ring, of which each 2 valences are bonded with an adjacent carbon atom in the aromatic ring, R' represents a divalent aromatic residue having 1 to 4 aromatic rings and n is an integer of at least 2. The present invention also provides a secondary cell using the above mentioned carbonaceous material as electrode.
摘要翻译：本发明提供适用于二次电池电极的碳质材料。碳质材料的比表面积通过BET法为至少10m 2 / g，氮/碳原子重量比为0.15〜0.01，通过热处理具有以下的重复单元的聚酰亚胺聚合物得到：＆lt; IMAGE＆gt; （1）其中R表示具有至少一个芳环的4价芳族残基，其中每个2价与芳环中的相邻碳原子键合，R'表示具有1至4个芳环的二价芳族残基和n 是至少为2的整数。本发明还提供了使用上述碳质材料作为电极的二次电池。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式