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1. 发明申请

US20130328184A1 COMPOSITE MEMBER INCLUDING SUBSTRATE MADE OF COMPOSITE MATERIAL 有权
标题翻译：复合材料包括复合材料的基材
公开(公告)号：US20130328184A1
公开(公告)日：2013-12-12
申请号：US14000247
申请日：2012-02-20
申请人： Isao Iwayama , Taichiro Nishikawa , Toshiya Ikeda , Shigeki Koyama
发明人： Isao Iwayama , Taichiro Nishikawa , Toshiya Ikeda , Shigeki Koyama
IPC分类号： C22C29/06 , H01L23/34
CPC分类号： C22C29/065 , B22F2999/00 , C04B41/009 , C04B41/515 , C04B41/88 , C04B2111/00844 , C22C2001/1073 , C22C2204/00 , C25D7/12 , H01L23/15 , H01L23/34 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , Y10T428/24612 , Y10T428/2495 , Y10T428/263 , B22F3/02 , B22F3/10 , B22F3/26 , C25D7/00 , C23C18/00 , H01L2924/00 , C04B35/565 , C04B38/00 , C04B41/4523
摘要： A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10−3 and not more than 10×10−3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
摘要翻译：复合构件具有由具有与镁或镁合金组合的SiC的复合材料制成的基板，并且具有不小于0.01×10-3且不大于10×10-3的翘曲度，所述翘曲度被限定作为lmax / Dmax，其中lmax是沿其最长侧测量的复合构件的一个表面的表面位移的最大值和最小值之间的差，Dmax是最长侧的长度。因此，提供一种能够有效地散热到安装对象的复合构件，使用该复合构件的散热构件以及具有该散热构件的半导体装置。

2. 发明授权

US09556501B2 Magnesium-based composite member, heat radiation member, and semiconductor device 有权
标题翻译：镁基复合构件，散热构件和半导体装置
公开(公告)号：US09556501B2
公开(公告)日：2017-01-31
申请号：US13635988
申请日：2011-03-16
申请人： Isao Iwayama , Taichiro Nishikawa , Yoshiyuki Takaki , Toshiya Ikeda , Shigeki Koyama
发明人： Isao Iwayama , Taichiro Nishikawa , Yoshiyuki Takaki , Toshiya Ikeda , Shigeki Koyama
IPC分类号： H01L23/10 , C22C1/10 , C22C29/06 , H01L23/373 , H01L23/40 , B22F3/11 , C22C23/00 , C22C23/02 , C22C47/06 , C22C49/04 , C22C49/14
CPC分类号： C22C1/1068 , B22F3/11 , C22C1/1015 , C22C23/00 , C22C23/02 , C22C29/065 , C22C29/067 , C22C47/06 , C22C49/04 , C22C49/14 , H01L23/3733 , H01L23/3736 , H01L23/4006 , H01L2924/0002 , Y10T428/12007 , Y10T428/12361 , H01L2924/00
摘要： A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.
摘要翻译：镁基复合构件设置有用于插入用于附接到固定目标的紧固构件的通孔。衬底上设置有用于插入紧固构件的衬底孔，并且由复合材料制成，该复合材料是SiC和镁和镁合金中任一种的基体金属的复合材料。接收部分附接到基底并由与基体金属不同的金属材料制成。接收部分设置有接收部分孔，通过该接收部分孔插入紧固构件，并且通孔的内周面的至少一部分由接纳部孔的内周面形成。

3. 发明申请

US20130009301A1 MAGNESIUM-BASED COMPOSITE MEMBER, HEAT RADIATION MEMBER, AND SEMICONDUCTOR DEVICE 有权
标题翻译：基于镁的复合构件，热辐射构件和半导体器件
公开(公告)号：US20130009301A1
公开(公告)日：2013-01-10
申请号：US13635988
申请日：2011-03-16
申请人： Isao Iwayama , Taichiro Nishikawa , Yoshiyuki Takaki , Toshiya Ikeda , Shigeki Koyama
发明人： Isao Iwayama , Taichiro Nishikawa , Yoshiyuki Takaki , Toshiya Ikeda , Shigeki Koyama
IPC分类号： B32B3/24 , H01L23/34 , F28F21/08
CPC分类号： C22C1/1068 , B22F3/11 , C22C1/1015 , C22C23/00 , C22C23/02 , C22C29/065 , C22C29/067 , C22C47/06 , C22C49/04 , C22C49/14 , H01L23/3733 , H01L23/3736 , H01L23/4006 , H01L2924/0002 , Y10T428/12007 , Y10T428/12361 , H01L2924/00
摘要： A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.
摘要翻译：镁基复合构件设置有用于插入用于附接到固定目标的紧固构件的通孔。衬底上设置有用于插入紧固构件的衬底孔，并且由复合材料制成，该复合材料是SiC和镁和镁合金中任一种的基体金属的复合材料。接收部分附接到基底并由与基体金属不同的金属材料制成。接收部分设置有接收部分孔，通过该接收部分孔插入紧固构件，并且通孔的内周面的至少一部分由接纳部孔的内周面形成。

4. 发明授权

US09347120B2 Composite member including substrate made of composite material 有权
标题翻译：复合构件包括由复合材料制成的基底
公开(公告)号：US09347120B2
公开(公告)日：2016-05-24
申请号：US14000247
申请日：2012-02-20
申请人： Isao Iwayama , Taichiro Nishikawa , Toshiya Ikeda , Shigeki Koyama
发明人： Isao Iwayama , Taichiro Nishikawa , Toshiya Ikeda , Shigeki Koyama
IPC分类号： C22C29/06 , H01L23/15 , H01L23/373 , H01L23/34 , C25D7/12 , C04B41/88 , C04B41/00 , C04B41/51 , C22C1/10 , C04B111/00
CPC分类号： C22C29/065 , B22F2999/00 , C04B41/009 , C04B41/515 , C04B41/88 , C04B2111/00844 , C22C2001/1073 , C22C2204/00 , C25D7/12 , H01L23/15 , H01L23/34 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , Y10T428/24612 , Y10T428/2495 , Y10T428/263 , B22F3/02 , B22F3/10 , B22F3/26 , C25D7/00 , C23C18/00 , H01L2924/00 , C04B35/565 , C04B38/00 , C04B41/4523
摘要： A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10−3 and not more than 10×10−3, the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
摘要翻译：复合构件具有由具有与镁或镁合金组合的SiC的复合材料制成的基板，并且具有不小于0.01×10-3且不大于10×10-3的翘曲度，所述翘曲度被限定作为lmax / Dmax，其中lmax是沿其最长侧测量的复合构件的一个表面的表面位移的最大值和最小值之间的差，Dmax是最长侧的长度。因此，提供一种能够有效地散热到安装对象的复合构件，使用该复合构件的散热构件以及具有该散热构件的半导体装置。

5. 发明申请

US20100206537A1 HEAT SPREADER FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于半导体器件的热交换器及其制造方法
公开(公告)号：US20100206537A1
公开(公告)日：2010-08-19
申请号：US12599635
申请日：2008-05-20
申请人： Toshiya Ikeda , Shigeki Koyama , Shinya Nishida
发明人： Toshiya Ikeda , Shigeki Koyama , Shinya Nishida
IPC分类号： F28F7/00 , B23P15/26
CPC分类号： H01L23/3735 , H01L23/3677 , H01L23/473 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , Y10T29/49393 , H01L2924/00
摘要： Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader (1) for a semiconductor device comprises: a plurality of columnar members (13) joined onto at least one of surfaces of a plate-like member (11, 12) by stud welding; and a joining layer (14) formed between the plate-like member (11, 12) and the columnar members (13). The plate-like member (11, 12) includes a base material (11) and surface layers (12). The surface layers (12) and the columnar members (13) are made of a material containing aluminum or an aluminum alloy. A thickness of the plate-like member (11, 12) is 0.5 mm through 6 mm and a thickness of each of the surface layers (12) is 0.1 mm through 1 mm. The joining layer (14) has a joining interface (15) on a boundary with the plate-like member (11, 12). A proportion of an area of the joining interface (15) being present in the surface layer (12) is greater than or equal to 50% and less than or equal to 100%, converted in terms of a plane projected to the one of the surfaces of the plate-like member.
摘要翻译：提供一种用于半导体器件的散热器，其可以被接合，使得即使当用于半导体器件的散热结构中并入半导体器件的散热结构时，多个销状翅片也不容易断裂，其中通过使用水进行直接冷却，以及制造半导体装置的散热器的方法。用于半导体器件的散热器（1）包括：多个柱状构件（13），通过螺柱焊接在板状构件（11,12）的至少一个表面上; 以及形成在所述板状构件（11,12）和所述柱状构件（13）之间的接合层（14）。板状构件（11,12）包括基材（11）和表层（12）。表面层（12）和柱状构件（13）由含有铝或铝合金的材料制成。板状部件（11,12）的厚度为0.5mm〜6mm，各表面层（12）的厚度为0.1mm〜1mm。接合层（14）在与板状构件（11,12）的边界上具有接合界面（15）。存在于表面层（12）中的接合界面（15）的面积的一部分大于或等于50％且小于或等于100％，根据投影到所述表面层板状构件的表面。

6. 发明授权

US5671346A Figure processing method 失效
标题翻译：图处理方法
公开(公告)号：US5671346A
公开(公告)日：1997-09-23
申请号：US741243
申请日：1991-08-02
申请人： Masaaki Tamura , Ayako Fujii , Yoshiko Kobari , Mamoru Nagano , Kiyoshi Watanabe , Hidehiko Morinaga , Shigeki Koyama , Yoshikazu Sawada
发明人： Masaaki Tamura , Ayako Fujii , Yoshiko Kobari , Mamoru Nagano , Kiyoshi Watanabe , Hidehiko Morinaga , Shigeki Koyama , Yoshikazu Sawada
IPC分类号： G09G5/24 , G06T11/20 , G06T11/80
CPC分类号： G06T11/203
摘要： A figure pattern is processed by modifying a point array that forms the figure pattern. The modification may include moving the points of the array, inserting points into the array, deleting points of the array, and changing the attributes of the points or the point array. According to one arrangement, a sample point of an array forming the outline of a figure pattern is designated for deletion and a figure pattern corresponding to the sample point array is generated on the basis of an attribute of sample points adjacent to the sample point designated for deletion.
摘要翻译：通过修改形成图形图案的点阵列来处理图形图案。修改可以包括移动阵列的点，将点插入到阵列中，删除阵列的点，以及改变点或点阵列的属性。根据一种布置，将形成图形轮廓的阵列的采样点指定为删除，并且基于与指定用于为删除。

7. 发明授权

US6112213A Image processing method and apparatus for designating movement and copying of image data 失效
标题翻译：用于指定图像数据的移动和复制的图像处理方法和装置
公开(公告)号：US6112213A
公开(公告)日：2000-08-29
申请号：US605668
申请日：1996-02-22
申请人： Shigeki Koyama
发明人： Shigeki Koyama
IPC分类号： G06T3/20 , G06F17/24 , G06T3/40 , G06T11/60 , G06T11/80
CPC分类号： G06F17/24
摘要： Editing of a displayed image is performed with simple operations. The editing is made by specifying an edit-start and edit-end points in an edit area of a displayed image, designating a movement area and movement destination based on the edit-start and edit-end points, designating a copy area and copy destination based on the edit-start and edit-end points, then moving the movement area to the movement destination and copying the copy area at the copy destination.
摘要翻译：通过简单的操作执行显示图像的编辑。通过在显示图像的编辑区域中指定编辑开始和编辑结束点，基于编辑开始和编辑结束点指定移动区域和移动目的地进行编辑，指定复制区域和复制目的地基于编辑开始和编辑结束点，然后将移动区域移动到移动目的地并复制复制目的地的复制区域。

8. 发明授权

US06144765A Figure processing method 失效
标题翻译：图处理方法
公开(公告)号：US06144765A
公开(公告)日：2000-11-07
申请号：US328344
申请日：1994-10-21
申请人： Masaaki Tamura , Ayako Fujii , Yoshiko Kobari , Mamoru Nagano , Kiyoshi Watanabe , Hidehiko Morinaga , Shigeki Koyama , Yoshikazu Sawada
发明人： Masaaki Tamura , Ayako Fujii , Yoshiko Kobari , Mamoru Nagano , Kiyoshi Watanabe , Hidehiko Morinaga , Shigeki Koyama , Yoshikazu Sawada
IPC分类号： H04N1/38 , G06T11/20 , G09G5/24 , G06K9/48
CPC分类号： G06T11/203
摘要： Disclosed is a technique for setting a body frame for a pattern and collectively deleting an area located outside the body frame. Consecutive codes can be assigned to scanned patterns.
摘要翻译：公开了一种用于设置用于图案的身体框架并且共同地删除位于身体框架外部的区域的技术。连续代码可以分配给扫描图案。

9. 发明授权

US5596689A Figure processing with magnification of designated portion of display 失效
标题翻译：图处理与放大显示的指定部分
公开(公告)号：US5596689A
公开(公告)日：1997-01-21
申请号：US739500
申请日：1991-08-02
申请人： Masaaki Tamura , Ayako Fujii , Yoshiko Kobari , Mamoru Nagano , Kiyoshi Watanabe , Hidehiko Morinaga , Shigeki Koyama , Yoshikazu Sawada
发明人： Masaaki Tamura , Ayako Fujii , Yoshiko Kobari , Mamoru Nagano , Kiyoshi Watanabe , Hidehiko Morinaga , Shigeki Koyama , Yoshikazu Sawada
IPC分类号： G09G5/24 , G06F17/50 , G06T3/40 , G06T11/20 , G06T11/80 , G09G5/36 , G06T3/00
CPC分类号： G06T11/203
摘要： A change in magnification of a figure pattern within a predetermined area is performed by designating a desired rectangular frame or one point on a screen, A plurality of menus associated with figure processes are performed by interruption,
摘要翻译：通过指定期望的矩形框或屏幕上的一个点来执行预定区域内的图形的放大率的变化。通过中断执行与图形处理相关联的多个菜单，

10. 发明授权

US5739827A Image processing method and apparatus 失效
标题翻译：图像处理方法和装置
公开(公告)号：US5739827A
公开(公告)日：1998-04-14
申请号：US587660
申请日：1996-01-17
申请人： Mamoru Nagano , Yoshiko Kobari , Hiroyuki Namiki , Shigeki Koyama
发明人： Mamoru Nagano , Yoshiko Kobari , Hiroyuki Namiki , Shigeki Koyama
IPC分类号： G06F3/041 , G06F3/048 , G06T11/60 , G06T11/80 , G06T11/00
CPC分类号： G06T11/60
摘要： An image process is performed using a computer, without needing any special knowledge by a user. First, when a picture on a screen is designated and inputted by an input unit, a check is made to determine if an input figure name corresponding to the input figure is defined in a first table stored in a memory. When it is judged that the input figure name is defined, a setting method of a value of a variable in the first table is determined. On the basis of the determined setting method, the value is set into the variable shown by the variable name in the first table. A check is made to determine if a figure shown by a connected figure name which is defined in a second table stored in the same memory as that of the first table, and is interlocked with the variable shown by the variable name exists on a screen. When it is judged that such a figure exists, the figure shown by the connected figure name is edited and displayed on the basis of the display type in the second table.
摘要翻译：使用计算机执行图像处理，而不需要用户的任何特殊知识。首先，当通过输入单元指定并输入屏幕上的图片时，进行检查以确定在存储在存储器中的第一表中是否定义了与输入图形相对应的输入图形名称。当判定输入图形名称被定义时，确定第一表中的变量的值的设定方法。在确定的设置方法的基础上，将该值设置为第一个表中变量名所示的变量。进行检查以确定在与存储在与第一表相同的存储器中的第二表中定义的连接图名称所示的图形是否与变量名称所示的变量互锁在屏幕上。当判断出这样的图形时，根据第二表中的显示类型编辑并显示所连接的图形名称所示的图形。

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