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1. 发明授权

US11498063B2 Selectively functionalized porous material 有权
公开(公告)号：US11498063B2
公开(公告)日：2022-11-15
申请号：US16593019
申请日：2019-10-04
申请人： International Business Machines Corporation
发明人： Geraud J. Dubois , Bruno Michel , Patrick Ruch , Sarmenio Saliba , Willi Volksen
IPC分类号： B01J35/10 , B01J21/08
摘要： A porous substrate susceptible to one or both of hydroxylation and alkoxylation by a first protic solvent is exposed to a first relative pressure of the first protic solvent. The porous substrate includes a first plurality of pores having a first average pore diameter and a second plurality of pores having a second average pore diameter that is greater than the first average pore diameter. The first relative pressure is effective to one or both of hydroxylate or alkoxylate substantially only pores of the first average pore diameter to form a first modified porous substrate. The first modified porous substrate is reacted with a first functionalizing reagent that is effective to functionalize one or both of hydroxylated or alkoxylated surfaces, thereby functionalizing substantially only the first plurality of the pores, to form a first functionalized porous substrate.

2. 发明授权

US11168234B2 Enhanced adhesive materials and processes for 3D applications 有权
公开(公告)号：US11168234B2
公开(公告)日：2021-11-09
申请号：US16750719
申请日：2020-01-23
申请人： International Business Machines Corporation
发明人： James L. Hedrick , Robert D. Miller , Deborah A. Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
IPC分类号： C09J9/00 , H01L23/48 , H01L23/00 , H01L21/683 , H01L21/768 , C09J11/04 , H01L25/00 , H01L25/065 , C09J183/04 , C09J179/08 , C09J179/04 , C09J11/06 , H01L23/60 , B82Y30/00 , B82Y40/00 , C08K5/544 , C08K5/548 , C08K5/5425 , C08K5/5465 , C08K7/24 , C08K3/04
摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

3. 发明授权

US10471418B2 Selectively functionalized porous material 有权
公开(公告)号：US10471418B2
公开(公告)日：2019-11-12
申请号：US14885514
申请日：2015-10-16
申请人： International Business Machines Corporation
发明人： Geraud J. Dubois , Bruno Michel , Patrick Ruch , Sarmenio Saliba , Willi Volksen
IPC分类号： B01J35/10 , B01J21/08
摘要： A porous substrate susceptible to one or both of hydroxylation and alkoxylation by a first protic solvent is exposed to a first relative pressure of the first protic solvent. The porous substrate includes a first plurality of pores having a first average pore diameter and a second plurality of pores having a second average pore diameter that is greater than the first average pore diameter. The first relative pressure is effective to one or both of hydroxylate or alkoxylate substantially only pores of the first average pore diameter to form a first modified porous substrate. The first modified porous substrate is reacted with a first functionalizing reagent that is effective to functionalize one or both of hydroxylated or alkoxylated surfaces, thereby functionalizing substantially only the first plurality of the pores, to form a first functionalized porous substrate.

4. 发明授权

US10370556B2 Surface modification by polymer anchoring on porous substrates 有权
公开(公告)号：US10370556B2
公开(公告)日：2019-08-06
申请号：US15375418
申请日：2016-12-12
申请人： International Business Machines Corporation
发明人： Geraud J. M. Dubois , Krystelle Lionti , Teddie P. Magbitang , Willi Volksen
IPC分类号： C09D133/12 , C09D125/06 , B05D3/10 , B05D5/00 , B05D1/00 , B05D3/02
摘要： Disclosed is a method for mechanically anchoring polymers on the surface of a porous substrate by trapping polymer chains within the pores of the substrate under capillary forces. Surface modification of the porous substrate is achieved by anchoring one end of the polymer chains within the pores while one or more other ends of the polymer chains dangle from the surface of the porous substrate. The method provides a unique way of modifying the surface of a material without chemical reactions or precursor-substrate interactions.

5. 发明申请

US20180340100A1 ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS 审中-公开
公开(公告)号：US20180340100A1
公开(公告)日：2018-11-29
申请号：US16004028
申请日：2018-06-08
申请人： James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu , INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
IPC分类号： C09J9/00 , H01L25/00 , C09J11/04 , H01L23/00 , H01L23/48 , H01L21/768 , H01L21/683 , C09J183/04 , C09J179/08 , C09J179/04 , C09J11/06 , H01L25/065 , C08K7/24 , C08K5/548 , C08K5/5465 , C08K5/544 , C08K5/5425 , B82Y40/00 , B82Y30/00 , C08K3/04
摘要： The present invention related to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

6. 发明申请

US20150311066A1 SURFACE PLASMA MODIFICATION OF POROUS THIN-FILMS TO OPTIMIZE PORE FILLING 有权
标题翻译：多孔薄膜的表面等离子体改性优化孔填充
公开(公告)号：US20150311066A1
公开(公告)日：2015-10-29
申请号：US14261357
申请日：2014-04-24
申请人： International Business Machines Corporation
发明人： Robert L. Bruce , Geraud J. Dubois , Theo J. Frot , Krystelle Lionti , Teddie P. Magbitang , Willi Volksen
IPC分类号： H01L21/02 , H01L21/311
CPC分类号： H01L21/02315 , H01L21/02203 , H01L21/3105 , H01L21/31116 , H01L21/31127 , H01L21/324 , H01L21/76802 , H01L21/76826
摘要： The present invention describes a process to modify a top portion of a porous ultra low-k (ULK) material in order to maximize porosity filling with a filling material that initially displayed low compatibility with the ULK material. Surface modification is achieved by a plasma treatment, enhancing the compatibility between the ULK surface and the filling material. The invention obtains high filling levels with minimum modification to the ULK material, as only a thin top portion is modified without significant pore sealing.
摘要翻译：本发明描述了一种修饰多孔超低k（ULK）材料的顶部的方法，以便最初用与ULK材料低相容性的填充材料最大化孔隙填充。通过等离子体处理实现表面改性，增强ULK表面和填充材料之间的相容性。本发明通过对ULK材料的最小修改获得高填充量，因为只有薄的顶部部分被修改而没有显着的孔密封。

7. 发明授权

US09058983B2 In-situ hardmask generation 有权
标题翻译：原位硬掩模生成
公开(公告)号：US09058983B2
公开(公告)日：2015-06-16
申请号：US13919725
申请日：2013-06-17
申请人： International Business Machines Corporation
发明人： Geraud Jean-Michel Dubois , Theo J. Frot , Teddie P. Magbitang , Willi Volksen
IPC分类号： B44C1/22 , H01L21/02
CPC分类号： H01L21/0226 , H01L21/02126 , H01L21/02203 , H01L21/0234 , H01L21/02362 , H01L21/3105 , H01L21/31144 , H01L21/76802 , H01L21/76826
摘要： In some examples, a process to generate an in-situ hardmask layer on porous dielectric materials using the densifying action of a plasma in conjunction with a sacrificial polymeric filler, the latter which enables control of the hardmask thickness as well as a well-defined interface with the underlying ILD.
摘要翻译：在一些实例中，使用等离子体与牺牲聚合物填料结合的致密化作用在多孔电介质材料上产生原位硬掩模层的方法，后者能够控制硬掩模厚度以及良好界定的界面与底层ILD。

8. 发明授权

US08871632B2 Reduction of pore fill material dewetting 有权
标题翻译：减少孔隙填充材料去湿
公开(公告)号：US08871632B2
公开(公告)日：2014-10-28
申请号：US13655599
申请日：2012-10-19
申请人： International Business Machines Corporation
发明人： Geraud Jean-Michel Dubois , Theo J. Frot , Teddie P. Magbitang , Willi Volksen
IPC分类号： H01L21/4763 , H01L21/768 , H01L21/3105 , H01L21/02
CPC分类号： H01L21/3105 , H01L21/02203 , H01L21/76802 , H01L21/7682 , H01L21/76822 , H01L21/76826 , H01L21/76828 , H01L2221/1047
摘要： In one embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, includes operations comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent (e.g., a high boiling point solvent); and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.
摘要翻译：在一个实施例中，机器可读的程序存储设备有形地体现了可由机器执行的用于执行操作的指令程序，包括：提供包括覆盖衬底的第一层的结构，其中第一层包括电介质材料具有多个孔; 将填充材料施加到第一层的表面，其中填充材料包含聚合物和至少一种添加剂，其中至少一种添加剂包含表面活性剂，高分子量聚合物和溶剂中的至少一种（例如，高沸点溶剂）; 并且在施加填充材料之后，加热该结构以使得填充材料能够在第一层的区域上均匀地至少部分地填充多个孔，其中加热该结构导致剩余的填充材料均匀地留在表面上第一层

9. 发明申请

US20130045608A1 REDUCTION OF PORE FILL MATERIAL DEWETTING 有权
标题翻译：减少填料填充材料
公开(公告)号：US20130045608A1
公开(公告)日：2013-02-21
申请号：US13655599
申请日：2012-10-19
申请人： International Business Machines Corporation
发明人： Geraud Jean-Michel Dubois , Theo J. Frot , Teddie P. Magbitang , Willi Volksen
IPC分类号： H01L21/312
CPC分类号： H01L21/3105 , H01L21/02203 , H01L21/76802 , H01L21/7682 , H01L21/76822 , H01L21/76826 , H01L21/76828 , H01L2221/1047
摘要： In one embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, includes operations comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent (e.g., a high boiling point solvent); and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.
摘要翻译：在一个实施例中，机器可读的程序存储设备有形地体现了可由机器执行的用于执行操作的指令程序，包括：提供包括覆盖衬底的第一层的结构，其中第一层包括电介质材料具有多个孔; 将填充材料施加到第一层的表面，其中填充材料包含聚合物和至少一种添加剂，其中至少一种添加剂包含表面活性剂，高分子量聚合物和溶剂中的至少一种（例如，高沸点溶剂）; 并且在施加填充材料之后，加热该结构以使得填充材料能够在第一层的区域上均匀地至少部分地填充多个孔，其中加热该结构导致剩余的填充材料均匀地留在表面上第一层

10. 发明申请

US20200165494A1 ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS 审中-公开
公开(公告)号：US20200165494A1
公开(公告)日：2020-05-28
申请号：US16750719
申请日：2020-01-23
申请人： International Business Machines Corporation
发明人： James L. Hedrick , Robert D. Miller , Deborah A. Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
IPC分类号： C09J9/00 , H01L23/48 , H01L23/00 , H01L21/683 , H01L21/768 , C09J11/04 , H01L25/00 , H01L25/065 , C09J183/04 , C09J179/08 , C09J179/04 , C09J11/06 , H01L23/60
摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

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