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    • 5. 发明公开
    • COMPLEX LAMINATED CHIP ELEMENT
    • 复合层压芯片元件
    • EP1654763A1
    • 2006-05-10
    • EP04774129.3
    • 2004-07-15
    • Innochips Technology Co., Ltd.Park, In-KilHwang, Soon-HaKim, Duk-Hee
    • Park, In-KilHwang, Soon-HaKim, Duk-Hee
    • H01L27/02
    • H01G4/40H01C1/148H01C7/008H01C7/18H01C13/02H01F17/0006H01F27/40H01F2017/0026H01G4/232H01G4/35H03H1/02H03H2001/0014H03H2001/0085H03H2001/0092
    • The present invention relates to a laminated chip element which can be manufactured to have desired electric properties by combining various elements in accordance with the desired objectives. More p articularly, t he present invention relates to a laminated chip element which has superior high frequency properties and can be manufactured to control capacitance and/or inductance of the laminated chip element to a desired value. There is provided a laminated chip element, comprising at least one first sheet on which first and second conductive patterns are formed, the first and second conductive patterns being spaced apart from each other in a direction of both ends of the first sheet; and at least one second sheet on which a third conductive pattern is formed, the third conductive pattern being formed in a transverse direction of both the ends of the first sheet; wherein one ends of the first and second conductive patterns are connected to first and second external terminals, respectively, at least one end of the third conductive pattern is connected to a third external terminal, and the first and second sheets are laminated. There is also provided a laminated chip element, comprising: at least one first sheet on which a first conductive pattern is formed, the first conductive pattern consisting of first to third portions, the first and second portions being spaced apart from each other in a direction of both ends of the first sheet, the second portion connecting the first and second portions to each other to have a predetermined inductance; and at least one second sheet on which a second conductive pattern is formed in a transverse direction of both the ends of the first sheet; wherein the first and second portions are connected to first and second external terminals, respectively, at least one ends of the second conductive pattern is connected to a third external terminal, and the first and second sheets are laminated.
    • 8. 发明公开
    • Emi shielding gasket
    • Emi屏蔽垫片
    • EP2442628A2
    • 2012-04-18
    • EP11184583.0
    • 2011-10-11
    • Innochips Technology Co., Ltd.
    • Park, In-KilKim, Dae Kyum
    • H05K1/02
    • H05K3/3431H05K9/0015H05K2201/10371Y02P70/613
    • Provided is an electromagnetic interference shielding gasket, which includes an elastomer, a soldering prevention part disposed in at least one region of a side surface and a bottom surface of the elastomer, and an electrode disposed on the bottom surface of the elastomer. Even when solder cream for attaching the EMI shielding gasket to a printed circuit board is pushed from the bottom surface of the EMI shielding gasket by its surface tension and solder-rising, the solder cream stays in the soldering prevention part without moving upward along the side surface of the EMI shielding gasket. Accordingly, the reliability of soldering can be ensured without sacrificing elastic resilient force of the EMI shielding gasket.
    • 提供了一种电磁干扰屏蔽垫片,其包括弹性体,设置在弹性体的侧表面和底表面的至少一个区域中的防焊部分以及设置在弹性体的底表面上的电极。 即使当用于将EMI屏蔽垫片附接到印刷电路板的焊膏由于其表面张力和焊料升高而从EMI屏蔽垫片的底表面推动时,焊膏仍留在防焊部分中而不沿着侧面向上移动 EMI屏蔽垫片的表面。 因此,可以确保焊接的可靠性而不牺牲EMI屏蔽垫片的弹性回弹力。