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1. 发明授权

EP1050013B1 CHIPKARTENMODUL FÜR BIOMETRISCHE SENSOREN 有权
标题翻译：智能卡模块进行生物传感器
公开(公告)号：EP1050013B1
公开(公告)日：2003-04-09
申请号：EP99907262.2
申请日：1999-01-20
申请人： Infineon Technologies AG
发明人： FRIES, Manfred , FISCHER, Jürgen , HOUDEAU, Detlef
IPC分类号： G06K9/00 , G07C9/00 , G06K19/077
CPC分类号： G06K19/0718 , G06K9/0002 , G06K19/077 , G07C9/00087 , G07C9/00158
摘要： The invention relates to a chip card module (4) for biometric sensors for installing in chip cards (1). A support (5) has at least one continuous window (9) in the area of a sensor chip (10). Said sensor chip (10) is fixed to the support (5) in such a way that the active surface (11) of the sensor chip (10) is oriented towards the support (5) and is situated in the area of the window (9) of the support (5) so that it can be accessed through said window (9).

2. 发明公开

EP1234275A2 CHIPKARTENMODUL MIT ANISOTROP LEITFÄHIGER TRÄGERFOLIE 有权
标题翻译：具有各向异性导电载体箔芯片卡模块
公开(公告)号：EP1234275A2
公开(公告)日：2002-08-28
申请号：EP00989819.8
申请日：2000-12-01
申请人： Infineon Technologies AG
发明人： HEINEMANN, Erik , PUESCHNER, Frank , HOUDEAU, Detlef
IPC分类号： G06K19/00
CPC分类号： G06K19/07743
摘要： The invention relates to a chip card module with a support film (3), made from an anisotropically conducting material and at least one semi-conductor chip (1). The semi-conductor chip (1) comprises connector points (2). Direct contact surfaces (4) are arranged on a surface of the support film (3). The support film (3) is so arranged between semi-conductor chip (1) and the contact surfaces (4), that it connects the connector points (2) of the semi-conductor chip (1), with the contact surfaces (4), by means of a direct contact.

3. 发明授权

EP1078330B1 SENSOREINRICHTUNG ZUR ERFASSUNG VON BIOMETRISCHEN MERKMALEN, INSBESONDERE FINGERMINUTIEN 有权
标题翻译：传感器装置用于检测生物特征，尤其是手指细节
公开(公告)号：EP1078330B1
公开(公告)日：2002-08-07
申请号：EP99936259.3
申请日：1999-05-17
申请人： Infineon Technologies AG
发明人： FRIES, Manfred , FISCHBACH, Reinhard , HOUDEAU, Detlef
IPC分类号： G06K9/00 , G06K11/16 , G06K9/20 , A61B5/117
CPC分类号： G06K9/0002 , A61B5/1172
摘要： The invention relates to a sensor device for detecting biometric characteristics, especially fingerprint minutiae, using a biometric sensor chip (3), wherein the sensor chip (3) is fixed to a flexible printed board (2) consisting of a highly flexible substrate (5) and conductors (6, 6') placed on the substrate (5), which are in electrical contact with the sensor chip (3) and are guided towards a connecting area (7) of the flexible printed board (2).

4. 发明授权

EP0978093B1 CHIPKARTE, VERFAHREN ZUR HERSTELLUNG EINER CHIPKARTE UND HALBLEITERCHIP ZUR VERWENDUNG IN EINER CHIPKARTE 失效
标题翻译：智能卡制造用于使用芯片卡及半导体芯片在芯片卡
公开(公告)号：EP0978093B1
公开(公告)日：2001-10-17
申请号：EP97934421.5
申请日：1997-07-14
申请人： Infineon Technologies AG
发明人： HUBER, Michael , STAMPKA, Peter , HOUDEAU, Detlef
IPC分类号： G06K19/077
CPC分类号： G06K19/07728 , G06K19/07743
摘要： A chip card has a card body (1) and several contact surfaces (3) made of an electroconductive material and electrically connected to contacts (11) associated to an electronic circuit designed on the semiconductor substrate (10) of a semiconductor chip (4). The contact surfaces (3) are produced as a structured coating on a main surface of the semiconductor chip (4) which faces the electronic circuit. The semiconductor chip (4) produced together with the contact surfaces (3) is inserted into and secured to a cavity of the card body (1) of the chip card in such a way that the contact surfaces (3) are substantially flush with the outer surface (7) of the card body. To ensure a sufficiently high mechanical flexibility, the silicium substrate is preferably less than approximately 100 νm thick.

5. 发明授权

EP0951691B1 CHIPKARTE 失效
公开(公告)号：EP0951691B1
公开(公告)日：2001-10-10
申请号：EP98904010.0
申请日：1998-01-07
申请人： Infineon Technologies AG
发明人： FRIES, Manfred , PÜSCHNER, Frank , MUNDIGL, Josef , FISCHER, Jürgen , HOUDEAU, Detlef
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/07749 , G06K19/07779 , G06K19/07783 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： The present invention pertains to a chip card with a card frame on which a data processing circuit and a linking module for non contact data transmission between said data processing circuit and an external data processing station are provided. When manufacturing such a chip card, a circuit is first installed on the plastic card frame. Thereafter, along the external edges of said chip card, a send-and-receive reel linked to the appropriate connections of the integrated circuit is mounted. The disadvantage of such a realization is the need to destroy the defective cards. With a chip card according to the invention, the data processing circuit and the connection module are provided at least in the area of a module support, and the card frame has an area for accommodating said module support, resulting in the possibility to first check, when the module support is finished, whether it operates correctly, prior to incorporating it into the frame card.

6. 发明授权

EP1236169B1 WARENETIKETT 有权
标题翻译：商品标签
公开(公告)号：EP1236169B1
公开(公告)日：2004-02-18
申请号：EP99966832.0
申请日：1999-12-07
申请人： Infineon Technologies AG
发明人： FRIES, Manfred , HOUDEAU, Detlef
IPC分类号： G06K19/067
CPC分类号： G06K19/07749 , G06K19/073 , G06K19/0739

7. 发明授权

EP0965103B1 CHIPKARTENMODUL UND DIESEN UMFASSENDE CHIPKARTE 失效
标题翻译：智能卡模块和这些全面CHIPCARD
公开(公告)号：EP0965103B1
公开(公告)日：2002-08-14
申请号：EP98909358.8
申请日：1998-02-06
申请人： Infineon Technologies AG
发明人： HOUDEAU, Detlef , PÜSCHNER, Frank , STAMPKA, Peter , HUBER, Michael , HEITZER, Josef , MUNDIGL, Josef
IPC分类号： G06K19/077
CPC分类号： G06K19/07747 , G06K19/07743 , H01L2224/16
摘要： The invention relates to a chip card module (1) comprising a semiconductor chip which contacts a metallic lead frame (2) having contact areas (3) in an electrically conductive manner. Both the semiconductor chip and contact areas (3) contact each other in an electrically conductive manner via connecting areas (5) which are arranged on the side (4) of an electrically isolating protective layer applied to the semiconductor chip which faces away from said semiconductor chip. The contacts between the connecting areas (5) and contact areas (3) can be made by solder joints (6) or electrically conductive glued joints. The invention further relates to a chip card (10) comprising the chip card module (1) described in the invention.

8. 发明公开

EP1222492A1 MODUL MIT ANZEIGEEINHEIT UND ANSTEUERSCHALTUNG 有权
标题翻译：显示单元，用于用于制造智能卡与方法
公开(公告)号：EP1222492A1
公开(公告)日：2002-07-17
申请号：EP00965777.6
申请日：2000-08-18
申请人： Infineon Technologies AG
发明人： HOUDEAU, Detlef
IPC分类号： G02F1/13
CPC分类号： G02F1/13452
摘要： The invention relates to a display unit wherein the electronic system used for the operation and control of said device is arranged on the rear side of a display element. The inventive display unit (1) has a front area with at least one display unit (4); a rear area (3) which is opposite said front area (2) and provided with at least one control element (5) which is used to control the at least one display element (4); electric lines are also provided in order to connect the at least one display element to the at least one control element (5). Preferably, an LCD display (4) with an outer coating (5), a liquid crystal coating (7) and a base film (8), is used. The at least one control element (5) is arranged on the base film (8). The control element is, for instance, an unpacked IC which is placed on the folded back base film (8) and offset in a lateral manner in such a way that it cannot cause the LCD display to overheat. Preferably, the electric lines consist of printed circuits placed on the base foil (8).

9. 发明授权

EP0904602B1 VERFAHREN ZUR HERSTELLUNG EINES TRÄGERELEMENTS FÜR HALBLEITERCHIPS 失效
标题翻译：用于生产CARRIER元素半导体芯片
公开(公告)号：EP0904602B1
公开(公告)日：2002-01-30
申请号：EP97925908.2
申请日：1997-06-10
申请人： Infineon Technologies AG
发明人： HUBER, Michael , STAMPKA, Peter , HOUDEAU, Detlef , FISCHER, Jürgen , HEITZER, Josef , GRAF, Helmut
IPC分类号： H01L23/498 , H01L23/24 , G06K19/077 , H01L21/48
CPC分类号： G06K19/07745 , H01L23/16 , H01L23/24 , H01L23/4985 , H01L23/49855 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05647 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/181 , H01L2924/19042 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A carrier element for a semiconductor chip (23), in particular for mounting in chip cards, has a substrate (15) that carries the chip (23) and a reinforcing foil (10) laminated on the side of the substrate (15) that carries the chip (23). The reinforcing foil (10) has a recess (14) for receiving the chip (23) and its connection lines (24), whose edge is provided with a frame (12) that forms a single piece with the foil (10).

10. 发明授权

EP0919041B1 VERFAHREN ZUR HERSTELLUNG EINES CHIPKARTEN-MODULS FÜR EINE KOMBI-CHIPKARTE 失效
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES CHIPKARTEN-MODULSFÜREINE KOMBI-CHIPKARTE
公开(公告)号：EP0919041B1
公开(公告)日：2001-11-28
申请号：EP97942853.9
申请日：1997-08-12
申请人： Infineon Technologies AG , PAV Card GmbH
发明人： HOUDEAU, Detlef , WILM, Robert
IPC分类号： G06K19/077
CPC分类号： G06K19/07743 , H01L24/45 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01058 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01005
摘要： The invention relates to a chip card module (1) comprising a supporting plate (2) which has a first contact plane (3) and a semiconductor chip (4) and electrically conductive connections (5) between the semiconductor chip and the first contact plane. Apart from the first contact plane, the chip card module has, on the reverse side of the supporting plate (2), another connection plane (6) also electrically connected to the semiconductor chip (4). The other connection plane may be used, for example, for turning on a built-in induction coil inside the chip body for non-contacting data transfer. The invention relates also to a combined chip card for contacting and non-contacting data transfer, which contains said chip card module (1), and manufacturing thereof.
摘要翻译：智能卡模块具有支撑板，该支撑板具有第一接触面和半导体芯片以及半导体芯片与第一接触面之间的导电连接。除了第一接触面之外，智能卡模块在支撑板的背面具有另一个也与半导体芯片电连接的连接平面。例如，可以使用另一连接平面来打开用于非接触式数据传输的芯片内部的内置感应线圈。本发明还涉及一种用于接触和非接触数据传输的组合智能卡，其包含智能卡模块。通过给定的顺序的过程步骤指定制造过程，导致智能卡模块的生产。

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