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    • 1. 发明授权
    • Multi-station rotary die handling device
    • 多工位旋转模具处理装置
    • US06364089B1
    • 2002-04-02
    • US09549241
    • 1999-12-10
    • Inderjit SinghJaime A. BayanHem TakiarAshok S. Prabhu
    • Inderjit SinghJaime A. BayanHem TakiarAshok S. Prabhu
    • B65G4724
    • H01L21/67132B65G47/848H01L21/6838
    • The invention relates to apparatus and methods for semiconductor device handling. In one aspect, the invention relates to a rotary flipper including a wheel having a plurality of stations. A semiconductor device is placed within a first station in a first orientation. While the semiconductor device is held, the wheel portion of the rotary flipper rotates and the next station receives another semiconductor device. When the first station is in an unloading position, the semiconductor device is released. At this point, the semiconductor device is oriented in a second position. In one aspect, the semiconductor device is released into a cavity of a tape and reel. In another aspect, vacuum pressure is applied to hold the die. In one embodiment, the invention relates to a semiconductor device handling apparatus and apparatus that includes of a rotary semiconductor device flipper.
    • 本发明涉及半导体器件处理的装置和方法。 一方面,本发明涉及一种包括具有多个站的车轮的旋转导板。 半导体器件以第一取向放置在第一工位内。 在保持半导体器件的同时,旋转推板的轮部分旋转并且下一个站接收另一个半导体器件。 当第一站处于卸载位置时,半导体器件被释放。 此时,半导体器件被定向在第二位置。 在一个方面,半导体器件被释放到带和卷的空腔中。 另一方面,施加真空压力以保持模具。 在一个实施例中,本发明涉及一种包括旋转半导体器件引脚的半导体器件处理装置和装置。
    • 2. 发明授权
    • Solution to mold wire sweep in fine pitch devices
    • 解决方案在细间距设备中模制丝线扫描
    • US5780772A
    • 1998-07-14
    • US788546
    • 1997-01-24
    • Inderjit SinghJaime A. Bayan
    • Inderjit SinghJaime A. Bayan
    • H01L21/56H01L23/495H01L23/28
    • H01L24/49H01L21/565H01L23/49506H01L2224/05554H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/49171H01L2224/49179H01L24/48H01L2924/00014H01L2924/01033H01L2924/01068H01L2924/01082H01L2924/14
    • A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting element between two widely spaced functional bonding wires. The integrated circuit package includes an array of electrically conductive leads for electrically connecting the package to other electrical elements and an integrated circuit die having a plurality of input/output terminal pads. A plurality of functional bonding wires electrically connects certain ones of the input/output terminal pads to associated electrically conductive leads such that the functional bonding wires have a predetermined pitch which defines an approximate minimum desired spacing between adjacent functional bonding wires. The plurality of functional bonding wires includes two widely spaced functional bonding wires which are spaced apart from one another by a distance substantially greater than the predetermined minimum desired spacing. An encapsulating material surrounds the die, the bonding wires, and at least portions of the leads. The encapsulating material flow restricting element restricts the flow of the encapsulating material in the area between the two widely spaced functional bonding wires during the encapsulating process of the package thereby preventing excessive, non-uniform bonding wire sweep of either of the two widely spaced functional bonding wires during the encapsulating process. In one embodiment, the encapsulating material flow restricting element is at least one additional non-functional bonding wire formed between the two widely spaced functional bonding wires.
    • 在集成电路封装的封装处理期间防止不均匀接合线扫描的方法包括在两个宽间隔开的功能性接合线之间形成封装材料流限制元件的步骤。 集成电路封装包括用于将封装电连接到其它电气元件的导电引线阵列和具有多个输入/输出端子焊盘的集成电路管芯。 多个功能性接合线将某些输入/输出端子焊盘电连接到相关联的导电引线,使得功能性接合线具有限定相邻功能性接合线之间的近似最小期望间隔的预定间距。 多个功能性接合线包括两个相互间隔开的距离远大于预定的最小期望间隔的宽度相隔的功能性接合线。 封装材料包围管芯,接合线以及引线的至少部分。 封装材料流动限制元件在封装封装过程期间限制封装材料在两个广泛间隔开的功能性接合线之间的区域中的流动,从而防止了两个广泛间隔的功能性接合中的任一个的过度的,不均匀的接合线扫 封装过程中的电线。 在一个实施例中,封装材料流动限制元件是形成在两个宽间隔开的功能性接合线之间的至少一个附加的非功能性接合线。
    • 4. 发明申请
    • FLAT-CLINCH STAPLER
    • 平缝机
    • US20140291376A1
    • 2014-10-02
    • US13982081
    • 2011-01-27
    • D. RanjanNavdeep BassiInderjit Singh
    • D. RanjanNavdeep BassiInderjit Singh
    • B25C5/02
    • B25C5/02B25C5/025
    • A flat-clinch-stapler comprises: a base portion (20) having upstanding bearing pieces (21) at its rear end for supporting a first transverse pivot axis (22), and a floating clincher table (11); a magazine (5) having a U-shaped cross section pivotably mounted at its rear end about said first pivot axis; a driver arm (1) carrying a driver blade (9) and being pivotably mounted at its rear end to said first pivot axis; and a handle member (300) pivotably mounted about a second transverse axis (310) in the bearing pieces offset relative to said first pivot axis in a direction to the front end of the base portion and acting on the driver arm at a position even further to the front end of the stapler. The magazine bottom wall guides the free ends of the legs of staples within the magazine. An elongated intermediate member (3) disposed between said magazine and said driver arm is pivotably mounted to said first pivot axis and has an inverted U-shaped cross section comprising a top wall and side walls downwardly extending inbetween and along said side walls of said magazine, the bottom edges of said side walls of said intermediate member engaging the cross members of staples within said magazine.
    • 扁平订书机包括:在其后端具有用于支撑第一横向枢转轴线(22)的直立轴承件(21)的底座部分(20)和浮动敲弯台(11); 具有U形横截面的杂志(5),所述U形横截面在其后端围绕所述第一枢转轴线可枢转地安装; 驱动臂(1),其承载驱动器叶片(9)并且在其后端可枢转地安装到所述第一枢转轴线; 以及手柄构件(300),其围绕第一横向轴线(310)可枢转地安装在所述轴承件中,所述轴承件相对于所述第一枢转轴线在基本部分的前端的方向上偏移,并且在更远的位置处作用在所述驱动臂上 到订书机的前端。 刀库底壁引导刀库内钉钉的自由端。 设置在所述盒和所述驱动臂之间的细长中间构件(3)可枢转地安装到所述第一枢转轴线上并且具有倒置的U形横截面,该横截面包括顶壁和向下延伸到所述盒的所述侧壁 所述中间构件的所述侧壁的底边缘与所述料盒内的缝钉的横向构件接合。