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1. 发明授权

US5852326A Face-up semiconductor chip assembly 失效
标题翻译：面朝上半导体芯片组装
公开(公告)号：US5852326A
公开(公告)日：1998-12-22
申请号：US110527
申请日：1998-07-06
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/60 , H01L21/822 , H01L21/98 , H01L23/13 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/58 , H01L25/065 , H01L25/16 , H01L23/48 , H01L23/52
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/485 , H01L23/49805 , H01L23/49827 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/4911 , H01L2224/73265 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351
摘要： A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires extending alongside the edges of the chip connect the contacts and the terminals. The terminals of the assembly are movable with respect to the chip.
摘要翻译：一种半导体组件，其在芯片顶表面的周边区域和覆盖芯片底表面的背衬元件上具有触点。背衬元件具有端子，使得端子中的至少一些覆盖在芯片的底表面上。包括沿芯片边缘延伸的接合线的引线连接触点和端子。组件的端子可相对于芯片移动。

2. 发明授权

US5685885A Wafer-scale techniques for fabrication of semiconductor chip assemblies 失效
标题翻译：制造半导体芯片组件的晶圆尺度技术
公开(公告)号：US5685885A
公开(公告)日：1997-11-11
申请号：US319966
申请日：1994-10-07
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/60 , H01L21/822 , H01L21/98 , H01L23/13 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/58 , H01L25/065 , H01L25/16 , H05K3/30
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/485 , H01L23/49805 , H01L23/49827 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/02371 , H01L2224/04105 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/4911 , H01L2224/73265 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49171
摘要： Semiconductor chip assemblies are fabricated by assembling flexible, sheetlike elements bearing terminals to a wafer, connecting the terminals of each sheetlike element to contacts on the chip, and subsequently severing the chips from the wafer to provide individual assemblies. Each assembly includes a sheetlike element and a chip, arranged so that the terminals on the flexible element.
摘要翻译：半导体芯片组件通过将带有端子的柔性片状元件组装到晶片，将每个片状元件的端子连接到芯片上的触点，并且随后从晶片切断芯片以提供单独的组件来制造半导体芯片组件。每个组件包括片状元件和芯片，其布置成使得柔性元件上的端子。

3. 发明授权

US5390844A Semiconductor inner lead bonding tool 失效
标题翻译：半导体内引线焊接工具
公开(公告)号：US5390844A
公开(公告)日：1995-02-21
申请号：US96700
申请日：1993-07-23
申请人： Thomas H. Distefano , Igor Y. Khandros , Gaetan Mathiew , Jason Sweis , John Grange , Gary W. Grube
发明人： Thomas H. Distefano , Igor Y. Khandros , Gaetan Mathiew , Jason Sweis , John Grange , Gary W. Grube
IPC分类号： H01L21/60 , B23K20/02 , B23K20/10 , H01L21/00 , H01L21/603 , H05K3/32
CPC分类号： H01L21/67138 , B23K20/025 , B23K20/106 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01076 , H01L2924/01082
摘要： A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.
摘要翻译：用于将内部引线键合到半导体芯片的接合工具被布置成捕获和对准沿多个方向中的任一个延伸的细长引线部分，优选地在两个相互正交的方向中的任一个方向上对准。因此，即使在多个方向上引线延伸的情况下，该工具也可以应用于将所有引线对齐并将其结合到芯片上而不转动工具或芯片。

4. 发明授权

US6133627A Semiconductor chip package with center contacts 失效
标题翻译：具有中心触点的半导体芯片封装
公开(公告)号：US6133627A
公开(公告)日：2000-10-17
申请号：US984615
申请日：1997-12-03
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/60 , H01L21/822 , H01L21/98 , H01L23/13 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/58 , H01L25/16 , H01L23/48 , H01L23/52
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/50 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K2201/10378
摘要： A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.
摘要翻译：在其顶表面的中心区域上具有触点的半导体芯片设置有覆盖在顶表面的中心部分上的电介质元件。电介质元件具有面向芯片的第一表面和背离芯片的第二表面，包围中心触点的孔和限定孔的边缘。中心接触引线从芯片上的中心触点延伸到介质元件上的中心端子。电介质元件上的端子可以使用通常用于电气装置的表面安装（例如焊接）的技术连接到基板。引线，优选地介电元件是柔性的，使得端子可相对于芯片上的触点移动，以补偿芯片和基板的不同的热膨胀。电介质元件可以设置有设置在端子和芯片之间的柔性层。整个组件紧凑。

5. 发明授权

US07198969B1 Semiconductor chip assemblies, methods of making same and components for same 失效
标题翻译：半导体芯片组件，制造方法和组件相同
公开(公告)号：US07198969B1
公开(公告)日：2007-04-03
申请号：US09656690
申请日：2000-09-07
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/00 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/322
CPC分类号： H01L22/32 , H01L21/6836 , H01L21/822 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/485 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/48 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/05599 , H01L2224/16145 , H01L2224/274 , H01L2224/45099 , H01L2224/48091 , H01L2224/81801 , H01L2224/8547 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.
摘要翻译：半导体芯片组件包括柔性的片状元件，其具有覆盖在芯片的前表面或后表面上的端子，以提供紧凑的单元。片状元件上的端子可相对于芯片移动，以补偿热膨胀。诸如插入在芯片和端子之间的柔性层的弹性元件允许各个端子朝向与测试探针组件的芯片驱动接合的独立移动，以允许尽可能公差地进行可靠的接合。

6. 发明授权

US06433419B1 Face-up semiconductor chip assemblies 有权
公开(公告)号：US06433419B1
公开(公告)日：2002-08-13
申请号：US09488268
申请日：2000-01-20
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L23053
摘要： A semiconductor chip is mounted in face-up disposition, with a contact-bearing front surface facing away from a substrate such as a circuit panel, and with a rear face facing toward the substrate. A backing element having terminals is disposed between the rear face of the chip and the substrate, and the terminals of the backing element are connected to contact pads on the substrate. The terminals of the backing element are movable with respect to the chip to compensate for differential thermal expansion of the chip and substrate.

7. 发明授权

US06372527B1 Methods of making semiconductor chip assemblies 失效
标题翻译：制造半导体芯片组件的方法
公开(公告)号：US06372527B1
公开(公告)日：2002-04-16
申请号：US09392030
申请日：1999-09-08
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L2166
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/48 , H01L24/50 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K2201/10378 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A method of making semiconductor chip assemblies includes providing a semiconductor wafer including a plurality of semiconductor chips having contacts on a contact bearing surface thereof and providing a substrate having a first surface with a plurality of conductive terminals located thereon and a second surface. The substrate is then assembled with the wafer so that the terminals are electrically connected to the contacts on the chips and portions of the substrate are removed to expose the terminals. In certain embodiments, an encapsulant may be injected between the wafer and the substrate for providing a compliant layer.
摘要翻译：制造半导体芯片组件的方法包括提供半导体晶片，其包括具有在其接触支承表面上的触点的多个半导体芯片，并提供具有位于其上的多个导电端子和第二表面的第一表面的基板。然后将衬底与晶片组装，使得端子电连接到芯片上的触点，并且去除衬底的部分以露出端子。在某些实施例中，可以在晶片和衬底之间注入密封剂以提供柔顺层。

8. 发明授权

US5950304A Methods of making semiconductor chip assemblies 失效
标题翻译：制造半导体芯片组件的方法
公开(公告)号：US5950304A
公开(公告)日：1999-09-14
申请号：US861280
申请日：1997-05-21
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/60 , H01L21/822 , H01L21/98 , H01L23/13 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/58 , H01L25/065 , H01L25/16 , H05K13/04 , H05K3/30
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/485 , H01L23/49805 , H01L23/49827 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/02371 , H01L2224/04105 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/4911 , H01L2224/73265 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49171
摘要： A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.
摘要翻译：在其顶表面的中心区域上具有触点的半导体芯片设置有覆盖在顶表面的中心部分上的电介质元件。电介质元件具有面向芯片的第一表面和背离芯片的第二表面，包围中心触点的孔和限定孔的边缘。中心接触引线从芯片上的中心触点延伸到介质元件上的中心端子。电介质元件上的端子可以使用通常用于电气装置的表面安装（例如焊接）的技术连接到基板。引线，优选地介电元件是柔性的，使得端子可相对于芯片上的触点移动，以补偿芯片和基板的不同的热膨胀。电介质元件可以设置有设置在端子和芯片之间的柔性层。整个组件紧凑。

9. 发明授权

US5679977A Semiconductor chip assemblies, methods of making same and components for same 失效
标题翻译：半导体芯片组件，制造方法和组件相同
公开(公告)号：US5679977A
公开(公告)日：1997-10-21
申请号：US30194
申请日：1993-04-28
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/60 , H01L21/822 , H01L21/98 , H01L23/13 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/58 , H01L25/065 , H01L25/16 , H01L23/48 , H01L23/52
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/485 , H01L23/49805 , H01L23/49827 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/02371 , H01L2224/04105 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/4911 , H01L2224/73265 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49171
摘要： Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.
摘要翻译：半导体芯片组件包括柔性的片状元件，其具有覆盖在芯片的前表面或后表面上的端子，以提供紧凑的单元。片状元件上的端子可相对于芯片移动，以补偿热膨胀。诸如插入在芯片和端子之间的柔性层的弹性元件允许各个端子朝向与测试探针组件的芯片驱动接合的独立移动，以允许尽可能公差地进行可靠的接合。

10. 发明授权

US06191473B1 Bonding lead structure with enhanced encapsulation 失效
标题翻译：结合引线结构增强封装
公开(公告)号：US06191473B1
公开(公告)日：2001-02-20
申请号：US09315252
申请日：1999-05-20
申请人： Thomas H. Distefano
发明人： Thomas H. Distefano
IPC分类号： H01L2352
CPC分类号： H01L24/50 , H01L23/49572 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/00
摘要： A connection component for a semiconductor chip includes a support structure having a top surface including a dielectric material and a bottom surface. The support structure includes a central portion, a peripheral portion and one or more gaps extending substantially between the central portion and the peripheral portion. A bus overlies the top surface of the support structure. The each bus has an outer edge which overlies the peripheral portion of the support structure and an inner edge which overlies the one or more gaps. The support structure also includes one or more electrically conductive leads having first ends secured to the central portion and second ends overlying the gaps and being secured to the inner edge of the bus. The second ends of the leads are displaceable relative to the bus in response to bonding forces being applied to the leads for engaging contacts on a semiconductor chip.
摘要翻译：用于半导体芯片的连接部件包括具有包括电介质材料和底面的顶表面的支撑结构。支撑结构包括中心部分，周边部分和基本上在中心部分和周边部分之间延伸的一个或多个间隙。公共汽车覆盖在支撑结构的顶面上。每个总线具有覆盖支撑结构的周边部分的外边缘和覆盖在一个或多个间隙上的内边缘。支撑结构还包括一个或多个导电引线，其具有固定到中心部分的第一端和覆盖间隙的第二端并固定到总线的内边缘。引线的第二端可以响应于施加到引线上的接合力而相对于母线移位，以接合半导体芯片上的触点。

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