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1. 发明专利

JP2011088986A Active ray-curable peelable overprint varnish, and adhesion printed matter and release paper using the same 审中-公开
标题翻译：活性可固化可渗透过度压敏粘合剂，粘合印刷和使用相同的纸张
公开(公告)号：JP2011088986A
公开(公告)日：2011-05-06
申请号：JP2009242678
申请日：2009-10-21
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： IIDA KAZUYOSHI , YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： C09D183/04 , B05D5/08 , B05D7/24 , B32B27/00 , B32B27/10 , B32B27/32 , C08F2/48 , C09D5/00 , C09D123/00 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an active ray-curable peelable overprint varnish capable of controlling the adhesion of an adhesive layer of a printed matter.
SOLUTION: The active ray-curable peelable overprint varnish includes the silicone releasing agent and a crystalline poly-α-olefin resin.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够控制印刷物的粘合剂层的粘附性的活性的可射线固化的可剥离的套印清漆。活性可光固化的可剥离的套印清漆包括硅氧烷脱模剂和结晶性聚-α-烯烃树脂。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010185058A Curable type varnish composition 审中-公开
标题翻译：可固化型VARNISH组合物
公开(公告)号：JP2010185058A
公开(公告)日：2010-08-26
申请号：JP2009031869
申请日：2009-02-13
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： C09D11/00
摘要： PROBLEM TO BE SOLVED: To provide a composition useful as a curable type priming varnish for pseudo-emboss printing. SOLUTION: A curable type varnish composition includes one or more resins selected from a group consisting of an acrylic resin, a methacrylic rein, and a resin soluble in an acrylic monomer or a methacrylic monomer; an acrylic monomer and/or a methacrylic monomer; a silicone resin and/or a fluorinated resin; and a poly-alpha olefin resin having a structure derived from a 10C-35C alpha-olefin. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：待解决的问题：提供可用作用于伪压花印刷的可固化型底漆的组合物。解决方案：可固化型清漆组合物包括一种或多种选自丙烯酸树脂，甲基丙烯酸树脂和可溶于丙烯酸单体或甲基丙烯酸单体的树脂的树脂; 丙烯酸类单体和/或甲基丙烯酸单体; 硅树脂和/或氟化树脂; 和具有衍生自10℃-35℃的α-烯烃的结构的聚α烯烃树脂。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2012046657A Epoxy resin molding material for sealing semiconductor and thermal storage molded article 审中-公开
标题翻译：用于密封半导体和热存储模制品的环氧树脂模塑材料
公开(公告)号：JP2012046657A
公开(公告)日：2012-03-08
申请号：JP2010190774
申请日：2010-08-27
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： OBATA HIROSHI , YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： C08L63/00 , C08F255/08 , C08J3/20 , C08K3/36 , C08L51/06 , C08L101/00 , C09K5/06 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an excellent epoxy resin molding material for sealing a semiconductor and a thermal storage molded article.SOLUTION: The epoxy resin molding material for sealing the semiconductor is obtained by mixing a crosslinked body (A) of predetermined polyalphaolefin, an epoxy resin (B), and an inorganic filler (C). The epoxy resin material contains 0.2-5 mass% of the crosslinked body of polyalphaolefin. The thermal storage molded article includes a temperature adjusting agent comprising the predetermined polyalphaolefin and a thermoplastic resin.
摘要翻译：要解决的问题：提供用于密封半导体和热存储成型制品的优异的环氧树脂模制材料。解决方案：用于密封半导体的环氧树脂成型材料通过混合预定聚α-烯烃的交联体（A），环氧树脂（B）和无机填料（C）而获得。环氧树脂材料含有0.2-5质量％的聚α-烯烃的交联体。蓄热成型体包括含有规定的聚α-烯烃和热塑性树脂的温度调节剂。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2010185059A Curable type mat coat varnish for screen printing 审中-公开
标题翻译：可印刷类型的平纹皮套VARNISH用于丝网印刷
公开(公告)号：JP2010185059A
公开(公告)日：2010-08-26
申请号：JP2009031870
申请日：2009-02-13
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： C09D11/08
摘要： PROBLEM TO BE SOLVED: To provide a curable type mat coat varnish for screen printing giving homogeneous and sufficient mat effect by means of a single varnish.
SOLUTION: A curable type mat coat varnish for screen printing includes a crystalline poly-alpha olefin resin which has a structure originated from a 10-35C alpha-olefin, and has a melting point (Tm) of 40-100°C. The melting point is obtained by using a differential scanning calorimeter (DSC) from a melting endothermic curve which is obtained by retaining the polymer at 190°C for 5 minutes under nitrogen atmosphere, subsequently cooling to -10°C at 5°C/min., then keeping at -10°C for 5 minutes, and heating to 190°C at 10°C/min.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于丝网印刷的可固化型垫涂层清漆，通过单一清漆提供均匀且足够的垫效果。解决方案：用于丝网印刷的可固化型垫涂层清漆包括具有起始于10-35℃α-烯烃的结构并且具有40-100℃的熔点（Tm）的结晶聚α烯烃树脂。通过使用来自熔融吸热曲线的差示扫描量热计（DSC）获得熔点，该曲线是通过在氮气氛下将聚合物在190℃下保持5分钟而获得的，随后以5℃/ min冷却至-10℃ 然后在-10℃保持5分钟，并以10℃/ min加热到190℃。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2011178909A Actinic ray-curable varnish composition 审中-公开
标题翻译：丙酰基可固化变性组合物
公开(公告)号：JP2011178909A
公开(公告)日：2011-09-15
申请号：JP2010045047
申请日：2010-03-02
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： YUKIMASA SHINICHI , OSAKO YASUHIRO , IIDA KAZUYOSHI
IPC分类号： C08F2/46 , C08F2/44 , C08F289/00 , C08L23/00 , C08L33/00
摘要： PROBLEM TO BE SOLVED: To provide an actinic ray-curable varnish composition which enables to provide gloss difference to a print without providing any ink curing equipment between coaters or printing units, and enables to produce a print with high designability through an easy process.
SOLUTION: The actinic ray-curable varnish composition contains (A) one or more resins selected from an acrylic resin, a methacrylic resin and a resin soluble in an acrylic monomer or a methacrylic monomer, (B) an acrylic monomer and/or a methacrylic monomer, and (C) a poly-α-olefin resin satisfying the following (1) and (2): (1) the melting point (Tm) is 30-100°C, (2) a single peak is observed, which is derived from side chain crystallization observed at 15 deg
摘要翻译：要解决的问题：提供一种能够在不在涂布机或印刷单元之间提供任何油墨固化设备的情况下对印刷品提供光泽差异的光化学可光固化清漆组合物，并且能够通过简单的方式制备具有高可设计性的印刷品处理。光聚合性光固化性清漆组合物含有（A）一种或多种选自丙烯酸树脂，甲基丙烯酸树脂和可溶于丙烯酸单体或甲基丙烯酸单体的树脂的树脂，（B）丙烯酸类单体和/ 或甲基丙烯酸单体，（C）满足以下（1）和（2）的聚-α-烯烃树脂：（1）熔点（Tm）为30-100℃，（2）单峰为观察到，其衍生自在广角X射线散射强度分布中在15度<2θ<30度观察到的侧链结晶。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010185060A Temperature-indicating ink composition and printed matter 审中-公开
标题翻译：温度指示墨水组合物和印刷物
公开(公告)号：JP2010185060A
公开(公告)日：2010-08-26
申请号：JP2009031871
申请日：2009-02-13
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： C09D11/00
摘要： PROBLEM TO BE SOLVED: To produce a low cost temperature-indicating ink composition and printed matter having temperature-indicating properties. SOLUTION: This temperature-indicating ink composition includes a polyolefin resin, a polyol compound and/or an isocyanate compound, wherein the polyolefin resin content is 30-60 wt.%. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：制备低成本的指示油墨组合物和具有温度指示性能的印刷品。解决方案：该温度指示油墨组合物包括聚烯烃树脂，多元醇化合物和/或异氰酸酯化合物，其中聚烯烃树脂含量为30-60重量％。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010185052A Thermosetting resin composition and molded article of the same 审中-公开
标题翻译：热固性树脂组合物及其模塑制品
公开(公告)号：JP2010185052A
公开(公告)日：2010-08-26
申请号：JP2009031736
申请日：2009-02-13
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： OSAKO YASUHIRO , YUKIMASA SHINICHI , FUKUNAGA YUICHI
IPC分类号： C08L23/24 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that can give a molded article that is finely and uniformly filled with much CPAO (Crystalline Poly Alpha Olefin) in a high density without bleeding out at the surface of the molded article, and that has a special character peculiar to CPAO, namely a character to change the elastic modulus and transparency caused by phase change that changes at about the melting point of CPAO.
SOLUTION: The thermosetting resin composition includes a side chain crystalline α-olefin polymer satisfying the following (1)-(3) and a thermosetting resin, wherein the distributed grain size of the side chain crystalline α-olefin polymer is 1-100 μm, and the content of the side chain crystalline α-olefin polymer to the 100 pts.wt. thermosetting resin is 30-400 pts.wt. (1) Only one melting point (Tm) is present within the range of 25-100°C, (2) in the wide angle X-ray scattering intensity distribution, only one peak attributable to side chain crystallization at 15 deg
摘要翻译：要解决的问题：为了提供一种热固性树脂组合物，其可以以高密度给出精细均匀地填充多个CPAO（结晶聚α烯烃）的模制品，而不会在模制品的表面渗出，具有CPAO特有的特殊特性，即改变CPAO熔点附近相变的弹性模量和透明度。解决方案：热固性树脂组合物包括满足以下（1） - （3）的侧链结晶α-烯烃聚合物和热固性树脂，其中侧链结晶α-烯烃聚合物的分布晶粒尺寸为1- 100μm，侧链结晶α-烯烃聚合物的含量为100重量份热固性树脂为30-400重量份（1）在广角X射线散射强度分布中，只有一个熔点（Tm）在25-100℃，（2）的范围内，在15度<2θ< 观察到30度，（3）平均侧链长度，排除侧链结晶性α-烯烃聚合物的主链导入部的平均碳数为10以上。（C） 2010年，JPO＆INPIT

8. 发明专利

JP2010003897A Epoxy resin sheet member for sealing semiconductor, and manufacturing method thereof 审中-公开
标题翻译：用于密封半导体的环氧树脂片材及其制造方法
公开(公告)号：JP2010003897A
公开(公告)日：2010-01-07
申请号：JP2008161657
申请日：2008-06-20
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： H01L23/29 , B32B27/38 , C08K3/00 , C08L23/00 , C08L63/00 , H01L23/31
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an excellent epoxy resin sheet member for sealing a semiconductor which is extremely small in occurrence of defects (non-filling, gold wire deformation, void occurrence, semiconductor movement and the like) in molding, in resin sealing by pressure-bonding molding of a semiconductor element; and a manufacturing method thereof. SOLUTION: This epoxy resin sheet member for sealing a semiconductor: is formed by melting and kneading at least (A) powder and/or an atomized body of crystalline polyalphaolefin having a melting point of 30-90°C and particle diameters ≤50 μm, (B) an epoxy resin and (C) an inorganic filler; and has a sealing layer formed of a sealing material containing 0.2-5 mass% of crystalline polyalphaolefin. The epoxy resin sheet member for sealing a semiconductor further has protective film(s) on one surface or both surfaces of the sealing layer. This manufacturing method of the epoxy resin sheet member includes processes of: manufacturing the sealing material by spraying the crystalline polyalphaolefin having a melting point of 30-90°C in a molten state; and forming a separation layer by applying or spraying, to the protective film, the crystalline polyalphaolefin having a melting point of 30-90°C in a molten state. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于密封在模制中发生缺陷（非填充，金线变形，空隙发生，半导体移动等）非常小的半导体的优异环氧树脂板部件，通过半导体元件的压接成型进行树脂密封; 及其制造方法。＆lt; P＆gt;解决方案：用于密封半导体的环氧树脂片材通过熔融和捏合至少（A）粉末和/或熔点为30-90℃的结晶聚α-烯烃的雾化体，并且粒径≤ 50μm，（B）环氧树脂和（C）无机填料; 并且具有由含有0.2-5质量％的结晶聚α-烯烃的密封材料形成的密封层。用于密封半导体的环氧树脂片材还具有在密封层的一个表面或两个表面上的保护膜。该环氧树脂片材的制造方法包括以下工序：通过在熔融状态下喷射熔点为30〜90℃的结晶性聚α-烯烃，制造密封材料; 以及在熔融状态下将熔点为30〜90℃的结晶性聚α-烯烃施加或喷涂到保护膜上，形成分离层。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010001386A Epoxy resin molding material for sealing semiconductor and method for manufacturing the same 审中-公开
标题翻译：用于密封半导体的环氧树脂模塑材料及其制造方法
公开(公告)号：JP2010001386A
公开(公告)日：2010-01-07
申请号：JP2008161653
申请日：2008-06-20
申请人： Idemitsu Kosan Co Ltd , 出光興産株式会社
发明人： YUKIMASA SHINICHI , OSAKO YASUHIRO
IPC分类号： C08L63/00 , C08K3/36 , C08L23/24
摘要： PROBLEM TO BE SOLVED: To provide an excellent epoxy resin molding material for sealing a semiconductor nearly free from generation of defects (an unfilled void, deformation of a gold wire, generation of a void, displacement of a semiconductor and the like) during molding in resin seal by transfer molding of a semiconductor element and to provide a method for manufacturing the same.
SOLUTION: The epoxy resin molding material for sealing the semiconductor is obtained by melt blending at least (A) powder or a foggy material having ≤75 μm particle diameter of a crystalline polyα-olefin having 30 to 90°C melting point, (B) an epoxy resin and (C) an inorganic filler, wherein the content of crystalline polyα-olefin is 0.2 to 5 mass%. The method for manufacturing the epoxy resin molding material is characterized in that the crystalline polyα-olefin having 30 to 90°C melting point is sprayed and added in a melted state.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于密封半导体的优良环氧树脂成型材料，其几乎不会产生缺陷（未填充的空隙，金丝的变形，空穴的产生，半导体的位移等）在通过半导体元件的转印成型在树脂密封件中成型时，提供其制造方法。解决方案：用于密封半导体的环氧树脂成型材料通过熔融共混至少（A）粉末或具有≤75μm粒径的具有30至90℃熔点的结晶聚α-烯烃的有雾材料，（B）环氧树脂和（C）无机填料，其中结晶聚α-烯烃的含量为0.2〜5质量％。环氧树脂成型材料的制造方法的特征在于，以熔融状态喷雾并添加具有30〜90℃熔点的结晶性聚α-烯烃。版权所有（C）2010，JPO＆INPIT

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