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    • 1. 发明授权
    • Low viscosity electrostatic discharge (ESD) dissipating adhesive
    • 低粘度静电放电(ESD)消散胶
    • US08493699B2
    • 2013-07-23
    • US12852428
    • 2010-08-06
    • William T. Bandy, IVDylan J. BodayIcko E. T. IbenWayne A. McKinley
    • William T. Bandy, IVDylan J. BodayIcko E. T. IbenWayne A. McKinley
    • H02H3/22
    • G11B5/00817G11B5/40
    • In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 MΩ. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.
    • 在一个实施例中,系统包括电缆,该电缆包括多个引线以及耦合到覆盖区域中的多个引线的ESD消散粘合剂,用于向电子设备的元件提供ESD保护。 ESD粘合剂包括分散在膜中的聚合物薄膜和导电填料的混合物,并且ESD粘合剂具有约50至100摩尔%的电阻率。 在另一个实施例中,用于向电子设备的元件提供ESD保护的方法包括将ESD粘合剂穿过电缆的暴露引线并从ESD粘合剂蒸发溶剂。 至少一些引线耦合到电子设备的元件。 ESD粘合剂包括聚合物薄膜,分散在聚合物薄膜中的导电填料和用于控制ESD粘合剂的粘度的溶剂。
    • 5. 发明授权
    • Tunnel junction resistor for high resistance devices and systems using the same
    • 隧道结电阻器用于高电阻器件和使用其的系统
    • US08289662B2
    • 2012-10-16
    • US12123989
    • 2008-05-20
    • Icko E. T. Iben
    • Icko E. T. Iben
    • G11B5/39
    • G01R33/098G11B5/00826G11B5/40G11B5/6094H01L27/22
    • A device in one embodiment includes a plurality of tunnel junction resistors coupled in series; a first lead coupled to one end of the plurality of tunnel junction resistors coupled in series; and a second lead coupled to another end of the plurality of tunnel junction resistors coupled in series. A device in another embodiment includes a magnetoresistive sensor; a plurality of tunnel junction resistors coupled in series; a first lead coupling one end of the magnetoresistive sensor to one end of the plurality of tunnel junction resistors coupled in series; and a second lead coupling another end of the magnetoresistive sensor to another end of the plurality of tunnel junction resistors coupled in series.
    • 一个实施例中的器件包括串联耦合的多个隧道结电阻器; 耦合到串联耦合的多个隧道结电阻器的一端的第一引线; 以及耦合到串联耦合的多个隧道结电阻器的另一端的第二引线。 另一实施例中的器件包括磁阻传感器; 串联耦合的多个隧道结电阻; 第一引线将磁阻传感器的一端耦合到串联耦合的多个隧道结电阻器的一端; 以及第二引线将磁阻传感器的另一端耦合到串联耦合的多个隧道结电阻器的另一端。
    • 8. 发明授权
    • In situ radio frequency shield for a magnetic linear recording media head
    • 用于磁性线性记录介质头的原位射频屏蔽
    • US08089722B2
    • 2012-01-03
    • US11623276
    • 2007-01-15
    • Icko E. T. IbenLuis H. PalaciosAndrew C. Ting
    • Icko E. T. IbenLuis H. PalaciosAndrew C. Ting
    • G11B5/127G11B21/02
    • G11B5/11G11B5/008
    • A read/write head for magnetic tapes configured with an in situ radio frequency (RF) shield is provided. The RF shield of the invention inhibits device elements reading data from reading RF radiation irradiated by other device elements writing data. The RF shield may be situated between the device elements of one module and the device elements of a second module. The dimensions and materials of the RF shield may be selected depending upon the operating frequencies of the head and skin depth of materials comprising the RF shield. The data cable may be bonded to device element pads of a module using ACF bonding. AFC bonding the cable to the module may allow a metal ground plane on the cable to be extended to provide additional RF shielding.
    • 提供了一种配置有原位射频(RF)屏蔽的磁带读/写头。 本发明的RF屏蔽禁止读取数据的装置元件读取由写入数据的其他装置元件照射的RF辐射。 RF屏蔽可以位于一个模块的设备元件和第二模块的设备元件之间。 RF屏蔽的尺寸和材料可以根据包括RF屏蔽的材料的头部和皮肤深度的工作频率来选择。 数据电缆可以使用ACF接合结合到模块的器件元件焊盘。 将电缆连接到模块的AFC可以允许电缆上的金属接地平面被延伸以提供额外的RF屏蔽。
    • 9. 发明授权
    • Removable ESD protection device using diodes
    • 使用二极管的可拆卸ESD保护装置
    • US07161772B2
    • 2007-01-09
    • US10717095
    • 2003-11-19
    • Icko E. T. Iben
    • Icko E. T. Iben
    • G11B5/39G11B5/40
    • G11B5/4915G11B33/1493
    • A removable device which is used during manufacturing for ESD/EOD protection and removed when the head is mounted in a drive. The device consists of crossed diodes which are mounted in the device and will connect to the readers. Each reader has two or more crossed diodes detachably coupled to its leads. The diodes are mounted on a device which is removable at the end of manufacturing assembly and the device can be reused. The device limits the voltage across a reader to the voltage limit of the number of diodes connected in series. Crossed diodes are connected in parallel with the electrical device to be protected to protect against random current spikes in either direction through the device in question. The device has leads which can be connected to an external device to measure the reader resistance or other electrical properties.
    • 一种可拆卸的设备,在制造过程中用于ESD / EOD保护,并在头部安装在驱动器中时被移除。 该器件由安装在器件中并将连接到读取器的交叉二极管组成。 每个读取器具有可拆卸地耦合到其引线的两个或更多个交叉二极管。 二极管安装在可在制造组件结束时移除的设备,并且该设备可以被重复使用。 该器件将阅读器上的电压限制为串联连接的二极管数量的电压极限。 交叉二极管与待保护的电气设备并联连接,以防止通过所述设备的任一方向的随机电流尖峰。 该器件具有可连接到外部器件的引线,以测量读取器电阻或其他电气特性。
    • 10. 发明授权
    • Process, apparatus, and system for adhesive bond strength recovery using joule heating
    • 使用焦耳加热的胶粘剂粘合强度回收的工艺,设备和系统
    • US06994141B2
    • 2006-02-07
    • US10338319
    • 2003-01-08
    • Icko E. T. Iben
    • Icko E. T. Iben
    • B32B31/26G11G5/40
    • B29C65/342B29C66/91214B29C66/91221B29C66/91317B29C66/91411B29C66/91641B29C66/91655B29C66/961B29C73/00C09J5/06C09J2201/602B29C65/00
    • A process, apparatus, and system are presented for adhesive bond strength recovery in a bonded system, which may be an electronic device, such as, a magnetic drive or magnetic disk drive. The adhesive bond strength of an adhesive bonding material degrades over time and under certain ambient conditions, such as humidity. The process, apparatus, and system are designed to recover at least a portion of the initial adhesive bond strength through the application of joule heating. The adhesive bonding material, and possibly the materials bonded by the adhesive bonding material, is heated via an embedded heat source within the bonded system. The embedded heat source receives electric power from a controlled power source that selectively applies power to achieve optimum heating and adhesive bond strength recovery consistent with a characterization of the bonded system, heat source, and adhesive bonding material.
    • 本发明提出了一种粘合系统中的粘合剂粘结强度恢复方法,装置和系统,其可以是诸如磁驱动器或磁盘驱动器的电子装置。 粘合剂粘合材料的粘合强度随着时间和某些环境条件如湿度而降低。 工艺,设备和系统被设计成通过应用焦耳加热来恢复初始粘合剂粘合强度的至少一部分。 粘合剂粘合材料以及可能由粘合剂粘合材料粘合的材料通过嵌入式热源在粘合体系内被加热。 嵌入式热源从受控电源接收电力,该电源选择性地施加电力以实现与粘合系统,热源和粘合剂粘合材料的表征一致的最佳加热和粘合剂粘合强度恢复。