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1. 发明申请

US20060118973A1 Sheet for optical-semiconductor-element encapsulation and process for producing optical semiconductor device with the sheet 审中-公开
标题翻译：用于光学半导体元件封装的片材和用于制造具有片材的光学半导体器件的工艺
公开(公告)号：US20060118973A1
公开(公告)日：2006-06-08
申请号：US11273082
申请日：2005-11-15
申请人： Noriaki Harada , Yuji Hotta , Ichiro Suehiro , Naoki Sadayori
发明人： Noriaki Harada , Yuji Hotta , Ichiro Suehiro , Naoki Sadayori
IPC分类号： H01L23/29
CPC分类号： H01L33/56 , B29C43/003 , B29C43/18 , B29C43/203 , B29K2105/256 , B29K2995/0018 , B29L2011/0016 , B29L2031/3425 , H01L33/505 , H01L33/52 , H01L2933/005
摘要： The present invention provides a sheet for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A that is to be brought into contact with one or more optical semiconductor elements; a light-diffusing layer formed on the layer A and containing light-diffusing particles; and a resin layer B formed on the light-diffusing layer and having a lower refractive index than that of the layer A. Also disclosed is a process for producing an optical semiconductor device using the sheet.
摘要翻译：本发明提供了一种用于光半导体元件封装的片材，其包括：与一个或多个光学半导体元件接触的最外层树脂层A; 形成在层A上并含有光漫射粒子的光漫射层; 以及形成在光漫射层上并且具有比层A低的折射率的树脂层B.还公开了使用该片的光学半导体器件的制造方法。

2. 发明申请

US20050237765A1 Direct-type backlight 失效
标题翻译：直接型背光
公开(公告)号：US20050237765A1
公开(公告)日：2005-10-27
申请号：US11105397
申请日：2005-04-14
申请人： Ichiro Suehiro , Yuji Hotta , Naoki Sadayori , Noriaki Harada , Kazuki Uawada
发明人： Ichiro Suehiro , Yuji Hotta , Naoki Sadayori , Noriaki Harada , Kazuki Uawada
IPC分类号： G02F1/1335 , F21S2/00 , F21V5/00 , F21Y101/02 , G02F1/13357 , H01L33/00 , H01L33/54 , H01L33/56
CPC分类号： H01L33/54 , G02F1/133603 , H01L2933/0091 , Y10S362/80
摘要： The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.
摘要翻译：本发明提供一种直接型背光源，具有：具有至少一个树脂层的树脂密封构件，该树脂层具有形成在树脂密封构件的最外表面上的光反射部分; 由树脂密封构件密封的光学半导体元件; 以及同心地形成在树脂层的至少一个表面上的多个圆形光散射槽，其中中心的圆的面积和各个同心圆之间的面积基本相同。

3. 发明授权

US07290902B2 Direct-type backlight 失效
标题翻译：直接型背光
公开(公告)号：US07290902B2
公开(公告)日：2007-11-06
申请号：US11105397
申请日：2005-04-14
申请人： Ichiro Suehiro , Yuji Hotta , Naoki Sadayori , Noriaki Harada , Kazuki Uawada
发明人： Ichiro Suehiro , Yuji Hotta , Naoki Sadayori , Noriaki Harada , Kazuki Uawada
IPC分类号： F21V7/00
CPC分类号： H01L33/54 , G02F1/133603 , H01L2933/0091 , Y10S362/80
摘要： The present invention provides A direct-type backlight having: a resin sealing member including at least one resin layer, which has a light reflecting section formed on the outermost surface of the resin sealing member; an optical semiconductor element sealed by the resin sealing member; and plural circular light scattering grooves formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.
摘要翻译：本发明提供一种直接型背光源，具有：具有至少一个树脂层的树脂密封构件，该树脂层具有形成在树脂密封构件的最外表面上的光反射部分; 由树脂密封构件密封的光学半导体元件; 以及同心地形成在树脂层的至少一个表面上的多个圆形光散射槽，其中中心的圆的面积和各个同心圆之间的面积基本相同。

4. 发明授权

US07559681B2 Light pipe for direct-type backlight and direct-type backlight 失效
标题翻译：直管式背光灯和直接型背光灯管
公开(公告)号：US07559681B2
公开(公告)日：2009-07-14
申请号：US11263616
申请日：2005-11-01
申请人： Ichiro Suehiro , Noriaki Harada , Yuji Hotta
发明人： Ichiro Suehiro , Noriaki Harada , Yuji Hotta
IPC分类号： F21V7/04
CPC分类号： G02B6/0061 , G02B6/0018 , G02B6/0038
摘要： The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.
摘要翻译：本发明提供一种具有上表面和下表面的直接型背光源的光管，其具有：设置在上表面上的光反射部件; 以及在从上表面和下表面中选择的至少一个表面上同心地形成的多个光散射部件，其中，所述多个光散射部件中的每一个为圆形槽或圆形突起，其中各散射光体之间的各区域基本上为相同。

5. 发明申请

US20060119751A1 Light pipe for direct-type backlight and direct-type backlight 失效
公开(公告)号：US20060119751A1
公开(公告)日：2006-06-08
申请号：US11263616
申请日：2005-11-01
申请人： Ichiro Suehiro , Noriaki Harada , Yuji Hotta
发明人： Ichiro Suehiro , Noriaki Harada , Yuji Hotta
IPC分类号： G02F1/1335
CPC分类号： G02B6/0061 , G02B6/0018 , G02B6/0038
摘要： The present invention provides a light pipe for a direct-type backlight having an upper surface and a lower surface, which has: a light reflecting member provided on the upper surface; and plural light scattering members formed concentrically on at least one surface selected from the upper surface and the lower surface, wherein each of the plural light scattering members is a circular groove or a circular projection, wherein each area between respective light scattering members is substantially the same.

6. 发明授权

US06961185B2 Microlens array 失效
标题翻译：微透镜阵列
公开(公告)号：US06961185B2
公开(公告)日：2005-11-01
申请号：US10757512
申请日：2004-01-15
申请人： Ichiro Suehiro , Naoki Sadayori , Yuji Hotta
发明人： Ichiro Suehiro , Naoki Sadayori , Yuji Hotta
IPC分类号： C08G18/02 , C08G18/71 , C08G18/72 , C08G18/76 , G02B1/04 , G02B3/00 , G02B27/10 , B29D11/00 , G03B21/60 , G08G63/00
CPC分类号： G02B3/0031 , C08G18/025 , C08G18/71 , C08G18/724 , C08G18/7607 , G02B1/041
摘要： A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula: wherein R represents a diisocyanate residue; R1 represents a monoisocyanate residue; and n represents an integer of 1 to 100.
摘要翻译：一种具有形成凸透镜的树脂层的微透镜阵列，其中所述树脂层包含由下式表示的聚碳二亚胺树脂的固化产物：其中R表示二异氰酸酯残基; R 1表示单异氰酸酯残基; n表示1〜100的整数。

7. 发明授权

US06566608B2 Production method of anisotropic conductive film and anisotropic conductive film produced by this method 失效
标题翻译：通过该方法制造的各向异性导电膜和各向异性导电膜的制造方法
公开(公告)号：US06566608B2
公开(公告)日：2003-05-20
申请号：US09837411
申请日：2001-04-18
申请人： Miho Yamaguchi , Ichiro Suehiro , Fumiteru Asai , Yuji Hotta
发明人： Miho Yamaguchi , Ichiro Suehiro , Fumiteru Asai , Yuji Hotta
IPC分类号： H01B700
CPC分类号： H01R43/007 , H01R13/2414 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49798 , Y10T29/5187
摘要： The present invention provides a production method of an anisotropic conductive film, which method includes the steps of (a) winding an insulated wire around a core member to form one roll of a winding layer, this insulated wire including a metal conductor wire and a coating layer made from an insulating resin, this coating layer being formed on the wire, placing an insulating resin film on the obtained winding layer, and repeating the winding and the placing to give a laminate alternately having the winding layer having a single row of insulated wires and an insulating resin layer made from the insulating resin film, (b) partially or entirely melting at least one of the coating layer and the insulating resin layer to integrate the winding layer and the insulating resin layer, and (c) slicing the laminate along a plane forming an angle with the insulated wire in a desired film thickness.
摘要翻译：本发明提供各向异性导电膜的制造方法，该方法包括以下步骤：（a）将绝缘线缠绕在芯部件上以形成卷绕层的一卷，该绝缘线包括金属导线和涂层由绝缘树脂制成的层，该涂层形成在导线上，在获得的缠绕层上放置绝缘树脂膜，并重复缠绕和放置以交替地形成具有单排绝缘电线的绕组层的层压体和绝缘树脂膜制成的绝缘树脂层，（b）部分或全部熔化涂层和绝缘树脂层中的至少一个以使绕组层和绝缘树脂层结合在一起，并且（c）与所述绝缘线形成所需膜厚度的平面。

8. 发明授权

US07231706B2 Method of manufacturing an anisotropic conductive film 失效
标题翻译：制造各向异性导电膜的方法
公开(公告)号：US07231706B2
公开(公告)日：2007-06-19
申请号：US10406546
申请日：2003-04-03
申请人： Miho Yamaguchi , Ichiro Suehiro , Fumiteru Asai , Yuji Hotta
发明人： Miho Yamaguchi , Ichiro Suehiro , Fumiteru Asai , Yuji Hotta
IPC分类号： H01F7/127 , H01F5/02 , B21C23/08
CPC分类号： H01R43/007 , H01R13/2414 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49798 , Y10T29/5187
摘要： An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating resin film to give a laminate alternately having the winding layer comprising a single row of insulated wires and an insulating resin layer made from the insulating resin film. A coating layer and insulating resin layer are melted to integrate the winding layer and the insulating resin layer. The laminate then is sliced along a plane forming an angle with the insulated wire in a desired film thickness.
摘要翻译：通过将绝缘电线缠绕在芯部件上以形成卷绕层的一卷来制备各向异性导电膜，将绝缘树脂膜放置在所获得的缠绕层上，并重复缠绕绝缘电线的步骤以及放置绝缘树脂膜，交替地形成具有由一排绝缘线构成的绕组层和由绝缘树脂膜制成的绝缘树脂层的层叠体。将涂层和绝缘树脂层熔化以使绕组层和绝缘树脂层成为一体。然后将层压体沿着与绝缘电线形成所需膜厚度的平面切割。

9. 发明申请

US20130029091A1 RESIN SHEET, METHOD OF PRODUCING THE SAME AND THROUGH-HOLE FORMING APPARATUS 审中-公开
标题翻译：树脂片，其制造方法和通孔形成装置
公开(公告)号：US20130029091A1
公开(公告)日：2013-01-31
申请号：US13546604
申请日：2012-07-11
申请人： Ichiro Suehiro
发明人： Ichiro Suehiro
IPC分类号： B28B1/48
CPC分类号： B26F1/14 , Y10T428/24273
摘要： A method of producing a resin sheet includes the steps of arranging a resin sheet between a substrate and a die opposed to the substrate, and forming a through-hole in the resin sheet to pass through the resin sheet in a pressing direction by relatively pressing the die against the substrate. The die includes a first protrusion protruding toward a downstream side in the pressing direction. A second protrusion protruding toward the downstream side in the pressing direction is formed on a peripheral edge portion of an end portion of the first protrusion on the downstream side in the pressing direction. An end portion of the second protrusion on the downstream side in the pressing direction is formed at an acute angle in sectional view along the pressing direction.
摘要翻译：制造树脂片的方法包括以下步骤：在与基板相对的基板和模具之间布置树脂片，并且在树脂片中形成通孔，以通过相对地按压冲击基板。模具包括朝向按压方向的下游侧突出的第一突起。在按压方向的下游侧的第一突起的端部的周缘部形成有朝向按压方向的下游侧突出的第二突起。沿按压方向的下游侧的第二突起的端部沿着按压方向以截面图形成锐角。

10. 发明授权

US08021756B2 Microlens array 有权
标题翻译：微透镜阵列
公开(公告)号：US08021756B2
公开(公告)日：2011-09-20
申请号：US12547136
申请日：2009-08-25
申请人： Ichiro Suehiro , Hiroyuki Katayama , Kouji Akazawa , Hideyuki Usui
发明人： Ichiro Suehiro , Hiroyuki Katayama , Kouji Akazawa , Hideyuki Usui
IPC分类号： B32B9/04
CPC分类号： B29D11/00365 , G02B1/041 , G02B3/0031 , Y10T428/31663 , C08L83/14
摘要： The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.
摘要翻译：本发明提供一种微透镜阵列，其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成，其中硅化合物由下式（I）表示：其中R1和R2各自独立地表示烷基，环烷基，烯基，炔基或芳基，其中多个R 1相同或不同，多个R 2相同或不同; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

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