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    • 8. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20070254434A1
    • 2007-11-01
    • US11819428
    • 2007-06-27
    • Ichiro MizushimaYoshio Ozawa
    • Ichiro MizushimaYoshio Ozawa
    • H01L21/336
    • H01L27/115G11C16/0483H01L27/11521H01L29/40114H01L29/66825H01L29/7881
    • A semiconductor device includes a semiconductor substrate including an active area (AA) surrounded by an isolation insulating film, and a nonvolatile memory cell on the AA, the nonvolatile memory cell including a tunnel insulating film on the AA, a FG electrode on the tunnel insulating film, a CG electrode above the FG electrode, and an interelectrode insulating film between the FG electrode and the CG electrode, relating to a cross section in a channel width direction of the nonvolatile memory cell, dimension in the channel width direction of a top surface of the AA is shorter than dimension in the channel width direction of a bottom surface of the tunnel insulating film, and an area of a portion opposing the AA of the tunnel insulating film is smaller than an area of a portion opposing a top surface of the FG electrode of the interelectrode insulating film.
    • 一种半导体器件包括:半导体衬底,包括由隔离绝缘膜包围的有源区(AA)和在AA上的非易失性存储单元,非易失性存储单元包括AA上的隧道绝缘膜,隧道绝缘上的FG电极 薄膜,FG电极上方的CG电极以及FG电极和CG电极之间的电极间绝缘膜,涉及非易失性存储单元的沟道宽度方向上的横截面,顶表面的沟道宽度方向上的尺寸 的距离短于隧道绝缘膜的底面的沟道宽度方向上的尺寸,并且与隧道绝缘膜的AA相对的部分的面积小于与隧道绝缘膜的顶面相对的部分的面积 电极间绝缘膜的FG电极。