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    • 2. 发明申请
    • MODULAR LASER PROCESSING ENCLOSURE AND SYSTEM
    • 模块激光加工外壳和系统
    • WO2017079409A1
    • 2017-05-11
    • PCT/US2016/060282
    • 2016-11-03
    • IPG PHOTONICS CORPORATION
    • DALLAROSA, Joseph,AMAR, Benjamin,LABBE, Mark,
    • H05K5/03H01S3/02B23K26/12
    • B23K26/352B23K26/0084B23K26/1224B23K26/125B23K26/21B23K26/34B23K26/38B23K26/382B23K37/047
    • A modular laser processing enclosure includes an enclosure housing defining a laser processing area. The enclosure housing includes a top defining a top laser processing access opening providing access to the laser processing area and at least two sides defining side laser processing access openings providing access to the laser processing area. The side laser processing access openings may be located proximate the top of the enclosure housing. The enclosure may further include at least one plate configured to cover any one of the laser processing access openings. Optionally, at least one laser processing head may be configured to be mounted to any one of the laser processing access openings and/or a least one part handling mechanism may be provided to access the laser processing area through any one of the laser processing access openings for delivering parts to and/or from the laser processing area.
    • 模块化激光加工外壳包括限定激光加工区域的外壳外壳。 外壳壳体包括限定顶部激光加工进入开口的顶部,所述顶部激光加工进入开口提供通向激光加工区域的入口,并且至少两个侧面限定提供进入激光加工区域的侧部激光加工进入开口。 侧面激光加工进入开口可以位于封闭壳体的顶部附近。 外壳可以进一步包括至少一个板,其被配置为覆盖激光加工进入开口中的任何一个。 可选地,至少一个激光加工头可以被构造成安装到激光加工进入开口中的任何一个,和/或可以提供至少一个零件加工机构以通过激光加工进入开口中的任何一个进入激光加工区域 用于向激光加工区和/或从激光加工区传送零件。