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1. 发明公开

EP2410344A3 Method for manufacturing an accelerometer 审中-公开
标题翻译：韦尔法罕zur Herstellung eines Beschleunigungssensors
公开(公告)号：EP2410344A3
公开(公告)日：2014-01-22
申请号：EP11171126.3
申请日：2000-03-16
申请人： ION Geophysical Corporation
发明人： Selvakumar, Arjun , Goldberg, Howard D. , Yu, Duli , Schmidt, Martin , Marsh, James L. , Ip, Matthew , Fung, Bing-Fai , Simon, Philip
IPC分类号： G01P15/13 , G01P15/08 , G01P15/125 , B81B3/00 , G01P1/02 , G01P1/00 , B81B7/00 , G01D11/24 , B81C1/00
CPC分类号： G01P1/023 , B81B3/001 , B81B3/0072 , B81B7/0016 , B81B2201/0235 , G01D11/245 , G01D18/008 , G01N2001/021 , G01P15/0802 , G01P15/13 , G01P21/00 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/186 , H01L2224/48472 , H01L2924/0002 , H01L2924/00
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
摘要翻译：一种获取环境信息测量的系统。 5系统（100）利用传感器（205），前端电路（310），环路滤波器（315），开关控制器（206）和再生环路控制电路，以提供可靠的数据测量，同时提供强大的系统行为。该系统还包括用于模拟传感器（205）的操作并测试前端电路（310）和环路滤波器（315）的操作的传感器模拟器（330）。

2. 发明公开

EP1510864A3 Merged-mask micro-machining process 有权
标题翻译： Mikromechanisches Herstellungsverfahren mitÜberblendetenMasken
公开(公告)号：EP1510864A3
公开(公告)日：2008-01-23
申请号：EP04026039.0
申请日：2000-07-13
申请人： ION Geophysical Corporation
发明人： Yu, Lianzhong , Ried, Robert P. , Goldberg, Howard D. , Yu, Duli
IPC分类号： G01P9/04 , G01P15/135 , G02B26/00 , C23F1/00 , G03F7/26 , G03F7/00
CPC分类号： G02B26/0816 , B81B2201/042 , B81C1/00396 , B81C2201/0132 , B81C2201/0133 , B81C2203/0109 , C23F1/02
摘要： The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.
摘要翻译：本发明提供了用于一般地制造微机械装置和特别是用于光学扫描装置的镜面组件的合并掩模工艺。一种制造三维结构的方法，包括：提供衬底，将第一掩蔽材料层施加到所述衬底上，将第二掩蔽材料层施加到所述第一掩模材料的所述层上，将所述第二掩模材料的所述层掩模材料，将第三掩模材料层施加到未被第二掩模材料的图案化层覆盖的部分上，第三掩模材料的层至少与第一和第二掩模材料的层的组合厚度一样厚掩模材料，图案化第一和第三掩模材料的层，蚀刻衬底的暴露部分，蚀刻第一和第三掩模材料的层的暴露部分并蚀刻衬底的暴露部分。

3. 发明授权

EP2264468B1 Merged-mask micro-machining process 有权
标题翻译：所述的微机械的制造方法与交叉衰落掩模
公开(公告)号：EP2264468B1
公开(公告)日：2013-07-03
申请号：EP10012678.8
申请日：2000-07-13
申请人： ION Geophysical Corporation
发明人： Yu, Lianzhong , Goldberg, Howard D. , Ried, Robert P. , Yu, Duli
IPC分类号： G02B26/08 , C23F1/02 , G03F7/26 , G03F7/00 , B81C1/00
CPC分类号： G02B26/0816 , B81B2201/042 , B81C1/00396 , B81C2201/0132 , B81C2201/0133 , B81C2203/0109 , C23F1/02

4. 发明公开

EP2410344A2 Method for manufacturing an accelerometer 审中-公开
标题翻译：韦尔法罕zur Herstellung eines Beschleunigungssensors
公开(公告)号：EP2410344A2
公开(公告)日：2012-01-25
申请号：EP11171126.3
申请日：2000-03-16
申请人： ION Geophysical Corporation
发明人： Selvakumar, Arjun , Goldberg, Howard D. , Yu, Duli , Schmidt, Martin , Marsh, James L. , Ip, Matthew , Fung, Bing-Fai , Simon, Philip
IPC分类号： G01P15/13 , G01P15/08 , G01P15/125 , B81B3/00 , G01P1/02 , G01P1/00 , B81B7/00 , G01D11/24
CPC分类号： G01P1/023 , B81B3/001 , B81B3/0072 , B81B7/0016 , B81B2201/0235 , G01D11/245 , G01D18/008 , G01N2001/021 , G01P15/0802 , G01P15/13 , G01P21/00 , G01V1/047 , G01V1/053 , G01V1/104 , G01V1/181 , G01V1/186 , H01L2224/48472 , H01L2924/0002 , H01L2924/00
摘要： An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).
摘要翻译：一种用于测量地震数据的加速度计（305）。加速度计（305）包括用于在真空密封过程中使用的集成通气孔和用于减小盖子晶片弯曲的平衡金属图案。加速度计（305）还包括用于将结合压力隔离到加速度计（305）的指定区域的顶盖挤压框架凹部（405）和底盖压力框架凹部（420）。加速度计（305）被真空密封并且包括平衡金属图案（730），以防止加速度计（305）的性能下降。在加速度计（305）上执行切割处理以隔离加速度计（305）的电引线。加速度计（305）还包括过冲保护缓冲器（720）和图案化金属电极，以在加速度计（305）的操作期间减小静摩擦力。

5. 发明授权

EP1510864B1 Merged-mask micro-machining process 有权
标题翻译：所述的微机械的制造方法与交叉衰落掩模
公开(公告)号：EP1510864B1
公开(公告)日：2010-11-03
申请号：EP04026039.0
申请日：2000-07-13
申请人： ION Geophysical Corporation
发明人： Yu, Lianzhong , Ried, Robert P. , Goldberg, Howard D. , Yu, Duli
IPC分类号： G01P9/04 , G01P15/135 , G02B26/00 , C23F1/00 , G03F7/26 , G03F7/00
CPC分类号： G02B26/0816 , B81B2201/042 , B81C1/00396 , B81C2201/0132 , B81C2201/0133 , B81C2203/0109 , C23F1/02

6. 发明公开

EP2136215A2 Accelerometer with folded beams 审中-公开
标题翻译：用弯曲的悬挂梁加速度计
公开(公告)号：EP2136215A2
公开(公告)日：2009-12-23
申请号：EP09011656.7
申请日：2001-06-21
申请人： ION Geophysical Corporation
发明人： Selvakumar, Arjun , Yu, Duli , Yu, Lianzhong , Jones, Ben W (D)
IPC分类号： G01P15/08 , G01P15/125 , G01P15/00 , H01L21/20 , H01L21/762 , B81C1/00 , B81B3/00
CPC分类号： G01V1/181 , B81B3/0072 , B81B7/0016 , B81B2201/0235 , B81B2203/0109 , B81B2203/0163 , B81B2203/053 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilient folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405).
The folded beams include circular cutouts so as to provide stress relief at connections between foot and leg positions of each folded beam.

7. 发明公开

EP2136215A3 Accelerometer with folded beams 审中-公开
标题翻译： Beschleunigungsmeter mit gebogenenAufhängungsbalken
公开(公告)号：EP2136215A3
公开(公告)日：2014-01-01
申请号：EP09011656.7
申请日：2001-06-21
申请人： ION Geophysical Corporation
发明人： Selvakumar, Arjun , Yu, Duli , Yu, Lianzhong , Jones, Ben W (D)
IPC分类号： G01P15/08 , G01P15/00 , B81B3/00 , G01P15/125 , G01V1/18
CPC分类号： G01V1/181 , B81B3/0072 , B81B7/0016 , B81B2201/0235 , B81B2203/0109 , B81B2203/0163 , B81B2203/053 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilient folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405).
The folded beams include circular cutouts so as to provide stress relief at connections between foot and leg positions of each folded beam.
摘要翻译：一种加速度计，包括用于检测加速度的测量物质（1405），包括具有空腔的壳体，定位在腔体内的一个或多个弹簧质量组件（1400），其中每个弹簧质量组件（1400）包括支撑结构（1410）包括耦合到所述支撑结构（1410）的一个或多个弹性折叠梁（1415a-1415d），并且所述测量块（1405）联接到所述弹性折叠梁（1415a-1415d），其中一个或多个电极图案弹簧质量组件（1400），其中包括顶部电容器电极的顶盖晶片与测量块（1405）耦合，并且包括底部电容器电极的底盖晶片也耦合到测量块（1405）。折叠的梁包括圆形切口，以便在每个折叠梁的脚和腿部位置之间的连接处提供应力释放。

8. 发明授权

EP1890181B1 Digital optical switch apparatus and process for manufacturing same 有权
标题翻译：它们的制备数字光开关的装置和方法
公开(公告)号：EP1890181B1
公开(公告)日：2012-07-04
申请号：EP07022937.2
申请日：2002-10-18
申请人： ION Geophysical Corporation
发明人： Yu, Duli , Selvakumar, Arjun , Goldberg, Howard , Yi, Taechung
IPC分类号： G02B26/08 , G02B6/35 , B81C1/00
CPC分类号： G02B6/3518 , G02B6/3548 , G02B6/357 , G02B26/0841 , G02B2006/12104

9. 发明公开

EP2264468A3 Merged-mask micro-machining process 有权
标题翻译： Mikromechanisches Herstellungsverfahren mitüberblendetenMasken
公开(公告)号：EP2264468A3
公开(公告)日：2012-02-08
申请号：EP10012678.8
申请日：2000-07-13
申请人： ION Geophysical Corporation
发明人： Yu, Lianzhong , Goldberg, Howard D. , Ried, Robert P. , Yu, Duli
IPC分类号： G01P9/04 , G01P15/135 , G02B26/00 , C23F1/00 , G03F7/26 , G03F7/00
CPC分类号： G02B26/0816 , B81B2201/042 , B81C1/00396 , B81C2201/0132 , B81C2201/0133 , B81C2203/0109 , C23F1/02
摘要： The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.
摘要翻译：本发明提供了用于一般地制造微机械装置和特别是用于光学扫描装置的镜面组件的合并掩模工艺。一种制造三维结构的方法，包括：提供衬底，将第一掩蔽材料层施加到所述衬底上，将第二掩蔽材料层施加到所述第一掩模材料的所述层上，将所述第二掩模材料的所述层掩模材料，将第三掩模材料层施加到未被第二掩模材料的图案化层覆盖的部分上，第三掩模材料的层至少与第一和第二掩模材料的层的组合厚度一样厚掩模材料，图案化第一和第三掩模材料的层，蚀刻衬底的暴露部分，蚀刻第一和第三掩模材料的层的暴露部分并蚀刻衬底的暴露部分。

10. 发明公开

EP2264468A2 Merged-mask micro-machining process 有权
标题翻译：所述的微机械的制造方法与交叉衰落掩模
公开(公告)号：EP2264468A2
公开(公告)日：2010-12-22
申请号：EP10012678.8
申请日：2000-07-13
申请人： ION Geophysical Corporation
发明人： Yu, Lianzhong , Goldberg, Howard D. , Ried, Robert P. , Yu, Duli
IPC分类号： G01P9/04 , G01P15/135 , G02B26/00 , C23F1/00 , G03F7/26 , G03F7/00
CPC分类号： G02B26/0816 , B81B2201/042 , B81C1/00396 , B81C2201/0132 , B81C2201/0133 , B81C2203/0109 , C23F1/02
摘要： The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

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