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1. 发明公开

EP2773792A4 LINEAR SCANNING SPUTTERING SYSTEM AND METHOD 有权
标题翻译：不孕不育麻醉麻醉线虫ABTASTUNG的SPUTTERSYSTEM
公开(公告)号：EP2773792A4
公开(公告)日：2015-04-22
申请号：EP12866275
申请日：2012-11-02
申请人： INTEVAC INC , BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
发明人： BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
IPC分类号： C23C14/35
CPC分类号： H01J37/3455 , C23C14/35 , C23C14/56 , H01J37/32779 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3452

2. 发明专利

SG11201401977UA LINEAR SCANNING SPUTTERING SYSTEM AND METHOD 未知
公开(公告)号：SG11201401977UA
公开(公告)日：2014-05-29
申请号：SG11201401977U
申请日：2012-11-02
申请人： INTEVAC INC , BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
发明人： BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
IPC分类号： C23C14/35
摘要： A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.

3. 发明申请

WO2013109333A4 LINEAR SCANNING SPUTTERING SYSTEM AND METHOD 审中-公开
标题翻译：线性扫描溅射系统和方法
公开(公告)号：WO2013109333A4
公开(公告)日：2013-10-31
申请号：PCT/US2012063432
申请日：2012-11-02
申请人： INTEVAC INC , BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
发明人： BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
IPC分类号： C23C14/35
CPC分类号： H01J37/3455 , C23C14/35 , C23C14/56 , H01J37/32779 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3452
摘要： A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.
摘要翻译：一种溅射系统，其具有带有入口和出口的处理室，以及位于处理室的壁上的溅射靶。可移动的磁体布置被定位在溅射靶之后并且在靶之后往复滑动。输送机以恒定速度连续输送衬底经过溅射靶，使得在任何给定时间，多个衬底面对前缘和后缘之间的靶。可移动磁体装置的滑动速度至少比传送机的恒定速度快几倍。旋转区域被限定在目标的前缘和后缘后面，其中磁体装置在其进入旋转区域时减速并且随着其在旋转区域内反向滑动的方向而加速。

4. 发明申请

WO2013109333A3 LINEAR SCANNING SPUTTERING SYSTEM AND METHOD 审中-公开
公开(公告)号：WO2013109333A3
公开(公告)日：2013-09-06
申请号：PCT/US2012063432
申请日：2012-11-02
申请人： INTEVAC INC , BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
发明人： BROWN DAVID WARD , SHAH VINAY , PEDERSON TERRY , BLUCK TERRY
IPC分类号： C23C14/35
CPC分类号： H01J37/3455 , C23C14/35 , C23C14/56 , H01J37/32779 , H01J37/32899 , H01J37/3405 , H01J37/3417 , H01J37/3452
摘要： A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.

5. 发明公开

EP2777069A4 SUBSTRATE PROCESSING SYSTEM AND METHOD 审中-公开
标题翻译：基板处理系统及方法
公开(公告)号：EP2777069A4
公开(公告)日：2015-01-14
申请号：EP12847303
申请日：2012-11-08
申请人： INTEVAC INC , PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
发明人： PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
IPC分类号： H01L21/677 , H01L21/68 , H01L21/683 , H01L31/18
CPC分类号： H01L21/6833 , H01L21/26506 , H01L21/67745 , H01L21/6776 , H01L21/681 , H01L21/6831 , H01L31/1876 , H02N13/00 , Y02E10/50 , Y02P70/521
摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

6. 发明专利

SG11201402177XA SUBSTRATE PROCESSING SYSTEM AND METHOD 未知
公开(公告)号：SG11201402177XA
公开(公告)日：2014-06-27
申请号：SG11201402177X
申请日：2012-11-08
申请人： INTEVAC INC , PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
发明人： PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
IPC分类号： H01L21/677 , H01L21/687
摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

7. 发明申请

WO2013070978A4 SUBSTRATE PROCESSING SYSTEM AND METHOD 审中-公开
标题翻译：基板加工系统及方法
公开(公告)号：WO2013070978A4
公开(公告)日：2013-09-26
申请号：PCT/US2012064241
申请日：2012-11-08
申请人： INTEVAC INC , PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
发明人： PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
IPC分类号： H01L21/677 , H01L21/687
CPC分类号： H01L21/6833 , H01L21/26506 , H01L21/67745 , H01L21/6776 , H01L21/681 , H01L21/6831 , H01L31/1876 , H02N13/00 , Y02E10/50 , Y02P70/521
摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers.
摘要翻译：用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。提供两个轨道组件，一个在处理区域的每一侧。两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。拾取头组件将晶片从传送器装载到卡盘组件上。拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。

8. 发明申请

WO2013070978A3 SUBSTRATE PROCESSING SYSTEM AND METHOD 审中-公开
标题翻译：基底处理系统和方法
公开(公告)号：WO2013070978A3
公开(公告)日：2013-08-08
申请号：PCT/US2012064241
申请日：2012-11-08
申请人： INTEVAC INC , PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
发明人： PEDERSON TERRY , HIESLMAIR HENRY , CHUN MOON , PRABHAKAR VINAY , ADIBI BABAK , BLUCK TERRY
IPC分类号： H01L21/677 , H01L21/687
CPC分类号： H01L21/6833 , H01L21/26506 , H01L21/67745 , H01L21/6776 , H01L21/681 , H01L21/6831 , H01L31/1876 , H02N13/00 , Y02E10/50 , Y02P70/521
摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers.
摘要翻译：一种用于处理基板的系统具有真空外壳和处理室，该处理室被设置用于在真空外壳内部的处理区中处理晶片。提供两个导轨组件，处理区域的每一侧各有一个导轨组件。两个卡盘阵列分别在一个导轨组件上骑行，使得每个卡盘阵列悬臂在一个导轨组件上并支撑多个卡盘。所述导轨组件联接到升降机构，所述升降机构将所述导轨放置在用于处理的上部位置中，并且在降低位置用于使所述卡盘组件返回以加载新的晶片。拾取头组件将来自传送器的晶片加载到卡盘组件上。拾取头具有多个从晶片的正面拾取晶片的静电夹盘。

9. 发明专利

JP2011091361A Electrostatic chuck 审中-公开
标题翻译：静电卡
公开(公告)号：JP2011091361A
公开(公告)日：2011-05-06
申请号：JP2010149236
申请日：2010-06-30
申请人： Intevac Inc , インテヴァックインコーポレイテッド
发明人： BLUCK TERRY , PEDERSON TERRY , GRIMARD DENNIS
IPC分类号： H01L21/683 , B23Q3/15 , H02N13/00
CPC分类号： H01L21/6831
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic chuck assembly capable of reducing formation of plasma in the inside of an electrostatic chuck or its circumference, for example, in an opening penetrating the electrostatic chuck assembly, and a duct or its circumference while supplying a sufficient quantity of heat exchange gas to a substrate. SOLUTION: An isolator for a heat exchange gas conduit of this electrostatic chuck is disclosed. The isolator 300 includes a sleeve 304 and a body 308 arranged in the sleeve 304 for forming an annulus 312 for running the heat exchange gas between the sleeve 304 and itself. The body 308 is arranged in contact with a dielectric pack 111 of the electrostatic chuck, and may be supported in this position by a spring 328. A silicon seal 334 may be provided between the sleeve 304 and the pack 111 to prevent plasma from being formed in the conduit. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够减少静电卡盘或其周边内部的等离子体形成的静电卡盘组件，例如在穿过静电卡盘组件的开口以及导管或其圆周上，同时向基板供应足够量的热交换气体。解决方案：公开了一种用于该静电卡盘的热交换气体导管的隔离器。隔离器300包括套筒304和布置在套筒304中的主体308，用于形成用于在套筒304和本身之间运行热交换气体的环带312。主体308布置成与静电卡盘的电介质组111接触，并且可以通过弹簧328被支撑在该位置。硅密封件334可以设置在套筒304和包装件111之间，以防止形成等离子体在导管中。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2017085136A 基板処理システムおよび基板処理方法有权
公开(公告)号：JP2017085136A
公开(公告)日：2017-05-18
申请号：JP2016248561
申请日：2016-12-22
申请人：インテヴァックインコーポレイテッド , Intevac Inc , インテヴァックインコーポレイテッド
发明人： PEDERSON TERRY , HENRY HIESLMAIR , CHUN MOON , VINAY PRABHAKAR , ADIBI BABAK , BLUCK TERRY
IPC分类号： H01L21/677 , B65G49/07 , H01L21/265 , H01L21/683
CPC分类号： H01L21/6833 , H01L21/26506 , H01L21/67745 , H01L21/6776 , H01L21/681 , H01L21/6831 , H01L31/1876 , H02N13/00 , Y02E10/50 , Y02P70/521
摘要：【課題】基板処理システムとして、スパッタリングおよびイオン注入システムのようなシステムでは、基板の処理中にシステムは固定されているが、このような固定されたシステムは、高処理能力による処理が困難である。【解決手段】2つのレール350、355を、処理領域の両側にそれぞれ設け、2つのチャックアレイC1、C2がレール上に片持ち状に設けられ、複数のチャック352、357を支持する。レールは、処理のための上の位置およびチャックアレイを返送するための下の位置に配置する昇降機構360に連結される。これにより、1つのレールが下の位置をとるとき、チャックアレイは、他のチャックアレイの下を通過することができ、イオンビームを常に一方のチャックアレイ上に維持し、処理されたアレイがビームから抜ける前に、もう一方のアレイをアンロード/ロードし、処理位置に戻す。【選択図】図3A

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