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    • 5. 发明申请
    • FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARABLE CHIPS
    • 微流芯片包装的制造或组装与可分离的CHIPS
    • WO2014207619A1
    • 2014-12-31
    • PCT/IB2014/062346
    • 2014-06-18
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONIBM RESEARCH GMBH
    • DELAMARCHE, EmmanuelTEMIZ, Yuksel
    • B01L3/00B81C1/00G01N33/487
    • B01L3/502707B01L2300/044B01L2300/0627B01L2300/0816B01L2300/0883B01L2300/0887B81C1/00888G01N33/487
    • The present invention is notably directed to methods of fabrication of a microfluidic chip package or assembly (1), comprising: providing (S1) a substrate (10, 30) having at least one block (14, 14a) comprising one or more microfluidic structures on a face (F) of the substrate; partially cutting (S2) into the substrate to obtain partial cuts (10c), such that a residual 6 thickness of the substrate at the level of the partial cuts (10c) enables singulation of said at least one block (14, 14a); cleaning (S4) said at least one block; and applying (S5 – S7) a cover-film (62) to cover said at least one block (14, 14a), whereby at least one covered block is obtained, the applied cover film still enabling singulation of each covered block, wherein each covered block corresponds to a microfluidic chip after singulation. The present invention is further directed to microfluidic chips, packing or assembly, obtainable with such 12 methods.
    • 本发明特别涉及制造微流体芯片封装或组件(1)的方法,包括:(S1)具有至少一个包含一个或多个微流体结构的块(14,14a)的衬底(10,30) 在基材的表面(F)上; 部分切割(S2)到基板中以获得部分切割(10c),使得在部分切口(10c)的水平处的基板的残余6厚度使得能够对所述至少一个块(14,14a)进行分割; 清洁(S4)至少一块; 以及施加(S5-S7)覆盖膜(62)以覆盖所述至少一个块(14,14a),由此获得至少一个覆盖块,所施加的覆盖膜仍然能够对每个被覆盖的块进行分割,其中每个 覆盖块对应于分离后的微流体芯片。 本发明进一步涉及可用这种12种方法获得的微流控芯片,包装或组装。