专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP0139233A1 Method for conditioning a surface of a dielectric substrate for electroless plating 失效
标题翻译：一种用于调节方法用于化学镀的电介质基板的表面上。
公开(公告)号：EP0139233A1
公开(公告)日：1985-05-02
申请号：EP84111285.7
申请日：1984-09-21
申请人： International Business Machines Corporation
发明人： Bupp, James R. , Lemon, Gary Kevin , Markovich, Voya , Sambucetti, Carlos J. , Tisdale, Stephen L. , Trevitt, Donna J.
IPC分类号： C23C18/24 , C23C18/38
CPC分类号： C23C18/28 , H05K3/381
摘要： @ Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H 2 SO 4 and a multi-functional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCI.
The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.
摘要翻译：用于化学镀的金属，显色法：如铜，到其它非导电基底的表面。该方法包括使表面接触到在wässrige组合物包含H 2 SO 4和多官能团的阳离子共聚物含有至少两个可用的阳离子部分，然后通过用含有氯化钯，氯化亚锡和盐酸的胶体溶液处理它们活化表面。本发明的方法是在过程中对玻璃，塑料的热塑性和热固性树脂，环氧树脂在基板上制作的金属电路是特别有用的：如卡和板。因此，该方法被应用于在已经经历了镀铜，并且由于故障已被拒绝的再加工基板。

2. 发明公开

EP0664664A1 Depositing a conductive metal onto a substrate 失效
标题翻译： Abscheidung einesleitfähigenMetalls auf einem Substrat。
公开(公告)号：EP0664664A1
公开(公告)日：1995-07-26
申请号：EP94120167.5
申请日：1994-12-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Jimarez, Lisa Jeanine , Lawrence, William Howell , Markovich, Voya Rista , Owen, Robert John , Sambucetti, Carlos J.
IPC分类号： H05K3/38 , C23C18/22
CPC分类号： H05K3/38 , C23C18/22 , H05K3/181 , H05K3/381 , H05K2203/1105 , H05K2203/1152
摘要： A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:
R a = 1.25 - 2.0 µm (0.05 - 0.08 mil),
R max = 5.0 - 13.75 µm (0.20 - 0.55 mil),
S m = 25 - 75 µm (1.00 - 3.00 mil),
R p = 5 - 8.75 µm (0.20 - 0.35 mil), and
surface area = 562.5 - 781.25 µm² (0.90 - 1.20 square mils) wherein Ra is the average roughness and the arithmetic mean of the departures from horizontal mean line profile; R max is the maximum peak-to-valley height;
S m is the mean spacing between high spots at the mean line; R p is the maximum profile height from the mean line;
and surface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer.
The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate. The substrate surface is seeded to render it active for electroless plating thereon; and then a metal from an electroless plating bath is plated thereon. In another method, the dielectric substrate is seeded to render it active for electroless plating thereon. A metal is then plated thereon from an electroless plating bath. The plated metal is subjected to temperature of at least about 100°C for a time sufficient to increase the adhesion of the metal to the substrate.
摘要翻译：提供了一种在电介质基片上沉积导电金属的方法。该方法包括获得具有以下参数的具有粗糙表面的金属片：Ra =1.25-2.0μm（0.05-0.08密耳），Rmax = 5.0-13.75μm（0.20-0.55密耳），Sm = 25-75 （1.00-300密耳），Rp =5-8.75μm（0.20-0.35密耳），表面积=562.5-781.25μm2（0.90-1.20平方密耳）其中Ra是平均粗糙度，与水平平均线轮廓偏离的算术平均值; Rmax是最大峰谷高度; Sm是平均线上高点之间的平均间距; Rp是距平均线的最大轮廓高度; 并且表面积是使用Talysurf S-120轮廓仪从每次测量的表面轮廓下的面积。通过将金属板的粗糙表面压在基板的表面上，然后从基板上去除，将薄片层压到电介质基片表面上。将基材表面接种以使其活性以在其上进行无电镀; 然后将来自化学镀浴的金属镀在其上。在另一种方法中，将电介质基底接种以使其在其上进行无电镀。然后将金属从化学镀浴镀在其上。使电镀金属经受至少约100℃的温度足以增加金属与基底的粘附性的时间。

3. 发明公开

EP0328944A3 Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon 失效
标题翻译：调节用于金属的后续选择性沉积的非导电基板
公开(公告)号：EP0328944A3
公开(公告)日：1990-01-31
申请号：EP89101763.4
申请日：1989-02-02
申请人： International Business Machines Corporation
发明人： Johnson, Robert W. , Lawrence, William H. , Lemon, Gary K. , Magnuson, Roy H. , Markovich, Voya R. , Parsons, Ralph E. , Sambucetti, Carlos J.
IPC分类号： H05K3/18 , C23C18/16
CPC分类号： H05K3/181 , H05K3/0023 , H05K3/184 , H05K3/381 , H05K2203/0716 , H05K2203/1152 , H05K2203/122 , H05K2203/1407
摘要： A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

4. 发明授权

EP0221265B1 Process for determining the plating activity of an electroless plating bath 失效
标题翻译：确定电镀镀层的镀层活性的方法
公开(公告)号：EP0221265B1
公开(公告)日：1990-01-24
申请号：EP86111281.1
申请日：1986-08-14
申请人： International Business Machines Corporation
发明人： Amelio, William J. , Markovich, Voya , Sambucetti, Carlos J. , Trevitt, Donna J.
IPC分类号： C23C18/40 , C25F3/02
CPC分类号： C23C18/1683 , C23C18/32 , C23C18/405 , C23C18/42

5. 发明公开

EP0328944A2 Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon 失效
标题翻译： Konditionieren eines nichtleitfähigenSubstratsfüreine nachfolgende Metallabscheidung。
公开(公告)号：EP0328944A2
公开(公告)日：1989-08-23
申请号：EP89101763.4
申请日：1989-02-02
申请人： International Business Machines Corporation
发明人： Johnson, Robert W. , Lawrence, William H. , Lemon, Gary K. , Magnuson, Roy H. , Markovich, Voya R. , Parsons, Ralph E. , Sambucetti, Carlos J.
IPC分类号： H05K3/18 , C23C18/16
CPC分类号： H05K3/181 , H05K3/0023 , H05K3/184 , H05K3/381 , H05K2203/0716 , H05K2203/1152 , H05K2203/122 , H05K2203/1407
摘要： A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.
摘要翻译：通过以粗糙的形式提供基底的至少一个主表面，使该表面与钯/锡催化剂接触来调节非导电基底以随后选择性沉积其上的金属，通过使用碱性氢氧化物溶液，将感光组合物层压到主表面，并将光敏组合物以预定图案曝光于光化学光，然后显影以提供预定图案。

6. 发明公开

EP0480194A3 High performance metal cone contact 失效
标题翻译：高性能金属锥接触
公开(公告)号：EP0480194A3
公开(公告)日：1993-08-04
申请号：EP91115460.7
申请日：1991-09-12
申请人： International Business Machines Corporation
发明人： Datta, Madhav , King, David E. , Knight, Alan D. , Sambucetti, Carlos J.
IPC分类号： H05K1/00 , H05K3/00 , H01R23/72 , H01R13/24 , C23F1/02 , H05K3/38
CPC分类号： H05K3/07 , H01L2924/0002 , H01R13/03 , H01R13/22 , H01R43/16 , H05K3/064 , H05K3/383 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2203/0369 , Y10T29/49222 , H01L2924/00
摘要： An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.

7. 发明授权

EP0139233B1 Method for conditioning a surface of a dielectric substrate for electroless plating 失效
标题翻译：用于调节用于电镀的电介质基板的表面的方法
公开(公告)号：EP0139233B1
公开(公告)日：1987-05-27
申请号：EP84111285.7
申请日：1984-09-21
申请人： International Business Machines Corporation
发明人： Bupp, James R. , Lemon, Gary Kevin , Markovich, Voya , Sambucetti, Carlos J. , Tisdale, Stephen L. , Trevitt, Donna J.
IPC分类号： C23C18/24 , C23C18/38
CPC分类号： C23C18/28 , H05K3/381

8. 发明公开

EP0805616A1 Electrically conductive compositions 失效
标题翻译： ElektrischleitfähigeZusammensetzungen
公开(公告)号：EP0805616A1
公开(公告)日：1997-11-05
申请号：EP96303162.0
申请日：1996-05-03
申请人： International Business Machines Corporation
发明人： Saraf, Ravi F. , Roldan, Judith Marie , Gaynes, Michael Anthony , Booth, Richard Benton , Ostrander, Stephen Paul , Cooper, Emanuel I. , Sambucetti, Carlos J.
IPC分类号： H05K3/32 , H01B1/22
CPC分类号： H01B1/22 , H05K3/321 , H05K3/361 , H05K2201/0129 , H05K2201/096 , H05K2201/10689 , H05K2203/0783
摘要： An electrically conductive paste composition which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses electrically conductive composite compositions which include the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
摘要翻译：公开了一种包含热塑性聚合物，导电金属粉末和有机溶剂系统的导电糊剂组合物。本发明还包括包含上述热塑性和金属的导电复合组合物，其中基于复合材料的总体积，金属占体积的至少约30体积％。复合材料在高温下由糊状物形成。该糊剂用于涉及在将糊状物转化为复合物的工艺条件下电连接电气和电子部件的方法。

9. 发明授权

EP0328944B1 Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon 失效
标题翻译：调节用于后续金属沉积在非导电性基板。
公开(公告)号：EP0328944B1
公开(公告)日：1994-08-31
申请号：EP89101763.4
申请日：1989-02-02
申请人： International Business Machines Corporation
发明人： Johnson, Robert W. , Lawrence, William H. , Lemon, Gary K. , Magnuson, Roy H. , Markovich, Voya R. , Parsons, Ralph E. , Sambucetti, Carlos J.
IPC分类号： H05K3/18 , C23C18/16
CPC分类号： H05K3/181 , H05K3/0023 , H05K3/184 , H05K3/381 , H05K2203/0716 , H05K2203/1152 , H05K2203/122 , H05K2203/1407

10. 发明公开

EP0480194A2 High performance metal cone contact 失效
标题翻译： Hochleistungsfähigerkonischer Metallkontakt。
公开(公告)号：EP0480194A2
公开(公告)日：1992-04-15
申请号：EP91115460.7
申请日：1991-09-12
申请人： International Business Machines Corporation
发明人： Datta, Madhav , King, David E. , Knight, Alan D. , Sambucetti, Carlos J.
IPC分类号： H05K1/00 , H05K3/00 , H01R23/72 , H01R13/24 , C23F1/02 , H05K3/38
CPC分类号： H05K3/07 , H01L2924/0002 , H01R13/03 , H01R13/22 , H01R43/16 , H05K3/064 , H05K3/383 , H05K3/4007 , H05K2201/0367 , H05K2201/0373 , H05K2203/0369 , Y10T29/49222 , H01L2924/00
摘要： An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.
摘要翻译：公开了一种包括制造该装置的方法的电互连。互连包括两个接触表面，其中至少一个接触表面设置有至少一个预定尺寸和位置的固体金属锥形突起。不是必须永久地共同接合，所以当需要时，接触表面是可附接的和可拆卸的。一个接触表面上的锥形突起通过在第二接触表面上以相互啮合的结构擦拭或者通过接触作为基本上平坦的接触垫的第二接触表面来进行欧姆接触。在本发明中的互连是至少一个具有单个锥形突起的接触件和另一接触件的组合，可选地具有各自的锥形突出部。锥形凸起通过在中性盐溶液中的电化学机械加工形成金属，任选地在连续的箔中。锥形突起也可选地形成在接触销的头部上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式