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1. 发明申请

WO2017058446A1 INTEGRATION OF MILLIMETER WAVE ANTENNAS IN REDUCED FORM FACTOR PLATFORMS 审中-公开
标题翻译：在减少形式因子平台中整合波浪天线
公开(公告)号：WO2017058446A1
公开(公告)日：2017-04-06
申请号：PCT/US2016/049482
申请日：2016-08-30
申请人： INTEL CORPORATION
发明人： TANG, Min Keen , YEPES, Ana , MICHAELI, Yaniv , SOFFER, Menashe
IPC分类号： H01Q9/04 , H01Q1/22 , H01Q5/20
CPC分类号： H01Q1/2266 , H01Q9/0407 , H01Q21/28
摘要： Generally, this disclosure provides systems, devices and methods for integration of millimeter wave antennas in platforms with reduced form factors while maintaining or improving antenna gain. An antenna assembly may include a first planar substrate; a ground plane disposed on the first planar substrate; a second planar substrate disposed on the ground plane; and an antenna radiation element disposed on the second planar substrate. The antenna radiation element may be configured to transmit a signal in the millimeter wave frequency region. The assembly may also include a via to provide a conductive path for the signal from a microstrip feed line, beneath the first planar substrate, to the antenna radiation element. The assembly may further include a dielectric layer disposed on the antenna radiation element to provide increased antenna gain under conditions of reduced air gap between the antenna radiation element and a structural element of an enclosing platform.
摘要翻译：通常，本公开提供用于在减小形状因子的平台中将毫米波天线集成在一起，同时保持或改善天线增益的系统，装置和方法。天线组件可以包括第一平面基板; 设置在所述第一平面基板上的接地平面; 设置在接地平面上的第二平面基板; 以及设置在第二平面基板上的天线辐射元件。天线辐射元件可以被配置为传输毫米波频率区域中的信号。组件还可以包括通孔，以提供用于来自第一平面衬底下面的微带馈电线的信号到天线辐射元件的导电路径。组件还可以包括设置在天线辐射元件上的介电层，以在天线辐射元件和封闭平台的结构元件之间的减小的空气间隙的条件下提供增加的天线增益。

2. 发明申请

WO2018222187A1 MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING 审中-公开
公开(公告)号：WO2018222187A1
公开(公告)日：2018-12-06
申请号：PCT/US2017/035273
申请日：2017-05-31
申请人： INTEL CORPORATION
发明人： WENG, Li-Sheng , CHEN, Chung-Hao , MATAYABAS, JR., James C. , TANG, Min Keen
IPC分类号： H01L23/552 , H01L23/00
摘要： A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

3. 发明申请

WO2018111455A1 INTEGRATED CIRCUIT PACKAGE INCLUDING FLOATING PACKAGE STIFFENER 审中-公开
公开(公告)号：WO2018111455A1
公开(公告)日：2018-06-21
申请号：PCT/US2017/060784
申请日：2017-11-09
申请人： INTEL CORPORATION
发明人： CHEN, Chung-Hao , TANG, Min Keen , WENG, Li-Sheng
IPC分类号： H01L23/66
CPC分类号： H05K1/0216 , G06F1/1698 , H05K1/0243 , H05K3/0061
摘要： Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more integrated circuits (ICs); a metallic structure that encircles the one or more ICs without being in contact with the one or more ICs, wherein the metallic structure is without an electrical ground; and a conductive epoxy layer disposed below and in contact with the metallic structure, wherein the conductive epoxy is to reduce an electromagnetic field induced by the metallic structure in response to a presence of a wireless signal that operates at approximately a resonant frequency associated with the metallic structure.

4. 发明申请

WO2016209529A1 ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING 审中-公开
标题翻译：用于电子设备耦合的静电放电
公开(公告)号：WO2016209529A1
公开(公告)日：2016-12-29
申请号：PCT/US2016/034343
申请日：2016-05-26
申请人： INTEL CORPORATION
发明人： KONG, Jackson Chung Peng , CHEN, Kuan-Yu , CHEAH, Bok Eng , KOH, Boon Ping , TANG, Min Keen , HECK, Howard L. , OOI, Kooi Chi
IPC分类号： H01R13/648 , H01R13/652 , H01R13/22
CPC分类号： H01R13/6485 , H05K9/0067
摘要： In one example an electronic device comprises a housing, a receptacle in the housing comprising an opening at a distal end to receive a plug, a data connector positioned in the receptacle to provide a communication connection, and an electrostatic conductor assembly positioned proximate the opening in the receptacle, wherein the electrostatic conductor assembly comprises a dedicated discharge path and a conductive pin mounted on a retention latch and moveable between a first position in which the conductive pin is in electrical contact with the data connector and a second position in which the conductive pin is not in electrical contact with the data connector. Other examples may be described.
摘要翻译：在一个示例中，电子设备包括壳体，壳体中的插座，包括在远端处的接收插头的开口，位于插座中的数据连接器以提供通信连接，以及定位在开口附近的静电导体组件插座，其中所述静电导体组件包括专用放电路径和安装在保持闩锁上的导电针，并且可在所述导电针与所述数据连接器电接触的第一位置和在所述第二位置之间移动的第二位置，不与数据连接器电接触。可以描述其他示例。

5. 发明申请

WO2016118276A1 ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING 审中-公开
标题翻译：用于电子设备耦合的静电放电
公开(公告)号：WO2016118276A1
公开(公告)日：2016-07-28
申请号：PCT/US2015/066853
申请日：2015-12-18
申请人： INTEL CORPORATION
发明人： KONG, Jackson Chung Peng , CHEAH, Bok Eng , HECK, Howard, L. , CHEN, Kuan-Yui , KOH, Boon Ping , TANG, Min Keen , OOI, Kooi Chi
IPC分类号： H01R13/648 , H01R24/60
CPC分类号： H01R13/6485 , H01R24/66 , H01R2107/00
摘要： In one example an electronic device comprises a housing. A receptacle in the housing comprising an opening at a distal end to receive a plug and an electrostatic conductor assembly positioned proximate the opening in the receptacle, wherein the electrostatic conductor assembly is coupled to a dedicated electrical discharge path. Other examples may be described.
摘要翻译：在一个示例中，电子设备包括壳体。壳体中的容器包括在远端处的开口，用于容纳插头和邻近插座中的开口定位的静电导体组件，其中静电导体组件耦合到专用放电路径。可以描述其他示例。

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