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1. 发明申请

WO2017112047A1 MULTI-REFERENCE INTEGRATED HEAT SPREADER (IHS) SOLUTION 审中-公开
标题翻译：多参考集成式散热器（IHS）解决方案
公开(公告)号：WO2017112047A1
公开(公告)日：2017-06-29
申请号：PCT/US2016/056887
申请日：2016-10-13
申请人： INTEL CORPORATION
发明人： CHOUDHURY, Arnab , BEATTY, John , CHOUDHARY, Prakriti
IPC分类号： H01L23/367 , H01L23/373
CPC分类号： H01L23/3675 , H01L21/4871 , H01L21/4882 , H01L23/10 , H01L23/3735 , H01L23/42 , H01L23/433 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/16145 , H01L2224/16227 , H01L2224/27334 , H01L2224/27848 , H01L2224/29019 , H01L2224/29021 , H01L2224/29022 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/29118 , H01L2224/2912 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29172 , H01L2224/29176 , H01L2224/2918 , H01L2224/29181 , H01L2224/29184 , H01L2224/29187 , H01L2224/2919 , H01L2224/29294 , H01L2224/293 , H01L2224/32058 , H01L2224/32245 , H01L2224/32257 , H01L2224/48145 , H01L2224/48227 , H01L2224/73253 , H01L2224/83191 , H01L2224/83193 , H01L2224/83201 , H01L2224/8321 , H01L2224/83801 , H01L2224/83825 , H01L2224/92225 , H01L2924/10253 , H01L2924/10329 , H01L2924/1304 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/1579 , H01L2924/16153 , H01L2924/16251 , H01L2924/1659 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00014 , H01L2924/0532 , H01L2924/01004 , H01L2924/0103 , H01L2924/014 , H01L2924/0665 , H01L2924/01048 , H01L2924/01072 , H01L2924/00012
摘要： Methods, systems, and apparatuses that assist with cooling semiconductor packages, such as multi-chip packages (MCPs) are described. A semiconductor package includes a component on a substrate. The component can include one or more semiconductor dies. The package can also include a multi-reference integrated heat spreader (IHS) solution (also referred to as a smart IHS solution), where the smart IHS solution includes a smart IHS lid. The smart IHS lid includes a cavity formed in a central region of the smart lid. The smart IHS lid can be on the component, such that the cavity corresponds to the component. A first thermal interface material layer (TIM- layer 1) can be on the component. An individual IHS lid (IHS slug) can be on the TIM-layer 1. The IHS slug can be inserted into the cavity. Furthermore, an intermediate thermal interface material layer (TIM-1A layer) can be between the IHS slug and the cavity.
摘要翻译：描述了辅助冷却诸如多芯片封装（MCP）之类的半导体封装的方法，系统和设备。半导体封装包括衬底上的部件。该组件可以包括一个或多个半导体管芯。该套件还可以包括多参考集成散热器（IHS）解决方案（也称为智能IHS解决方案），其中智能IHS解决方案包括智能IHS盖。智能IHS盖包括形成在智能盖的中心区域中的空腔。智能IHS盖可以位于组件上，使得腔对应于组件。第一热界面材料层（TIM-层1）可以在该部件上。一个单独的IHS盖（IHS塞）可以在TIM层1上.IHS塞可以插入到腔中。此外，中间热界面材料层（TIM-1A层）可以位于IHS段塞和腔之间。

2. 发明申请

WO2017171889A1 SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTION FOR 3D PACKAGING 审中-公开
标题翻译：用于实现3D包装的热解决方案的系统，方法和装置
公开(公告)号：WO2017171889A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025779
申请日：2016-04-02
申请人： INTEL CORPORATION
发明人： MUTHUR SRINATH, Purushotham Kaushik , MALATKAR, Pramod , AGRAHARAM, Sairam , JHA, Chandra M. , CHOUDHURY, Arnab , RARAVIKAR, Nachiket R.
IPC分类号： H01L23/12 , H01L23/48
摘要： In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces therein; a first layer functional silicon die electrically interfaced to the electrical traces of the substrate layer, the first layer functional silicon die having a first thermal pad integrated thereupon; a second layer functional silicon die positioned above the first layer functional silicon die, the second layer functional silicon die having a second thermal pad integrated thereupon; and a conductivity layer positioned between the first layer functional silicon die and the second layer functional silicon die, wherein the conductivity layer is to: (i) electrically join the second layer functional silicon die to the first layer functional silicon die and (ii) bond the first thermal pad of the first layer functional silicon die to the second thermal pad of the second layer functional silicon die via solder. Other related embodiments are disclosed.
摘要翻译：根据所公开的实施例，提供了用于实现3D封装的热解决方案的方法，系统和设备。例如，根据一个实施例，存在一种设备，其中具有：其中具有电迹线的衬底层; 与所述衬底层的电迹线电接合的第一层功能硅芯片，所述第一层功能硅芯片具有集成在其上的第一热衬垫; 位于所述第一层功能硅晶粒上方的第二层功能硅晶粒，所述第二层功能硅晶粒具有集成于其上的第二导热垫; 以及位于所述第一层功能硅管芯和所述第二层功能硅管芯之间的导电层，其中所述导电层用于：（i）将所述第二层功能硅管芯电连接到所述第一层功能硅管芯和（ii）第一层功能硅的第一导热焊盘通过焊料与第二层功能硅芯片的第二导热焊盘相接合。披露了其他相关的实施例。

3. 发明申请

WO2018125027A1 COUPLING A MAGNET WITH A MEMS DEVICE 审中-公开
公开(公告)号：WO2018125027A1
公开(公告)日：2018-07-05
申请号：PCT/US2016/068635
申请日：2016-12-27
申请人： INTEL CORPORATION
发明人： YAZZIE, Kyle , PRAKASH, Anna M. , RAMALINGAM, Suriyakala , WANG, Liwei , STARKSTON, Robert , CHOUDHURY, Arnab , IYER, Sandeep S. , ABEBAW, Amanuel M. , LABANOK, Nick
IPC分类号： H01L43/02 , H01L43/10 , H01L43/08
摘要： Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

4. 发明申请

WO2017052848A1 THERMAL MANAGEMENT SOLUTIONS FOR MICROELECTRONIC DEVICES USING JUMPING DROPS VAPOR CHAMBERS 审中-公开
标题翻译：微型电子设备的热管理解决方案使用跳槽式蒸汽灭菌器
公开(公告)号：WO2017052848A1
公开(公告)日：2017-03-30
申请号：PCT/US2016/047314
申请日：2016-08-17
申请人： INTEL CORPORATION
发明人： EID, Feras , CHOUDHURY, Arnab
IPC分类号： H01L23/46 , H01L23/427 , H01L23/367
CPC分类号： H01L23/427 , H01L21/4878 , H01L21/4882 , H01L23/3675 , H01L23/373 , H01L23/433 , H01L25/0652 , H01L2224/16225 , H01L2224/73253
摘要： A thermal management solution may be provided for a microelectronic system, wherein a jumping drops vapor chamber is utilized between at least one microelectronic device and an integrated heat spreader. The microelectronic system may comprise a microelectronic device attached by an active surface thereof to a microelectronic substrate. The integrated heat spreader, having a first surface and an opposing second surface, is also attached to the microelectronic substrate with a jumping drops vapor chamber disposed between a back surface of the microelectronic device and the integrated heat spreader second surface. The jumping drops vapor chamber may comprise a vapor space defined by a hydrophilic evaporation surface on the microelectronic device back surface, a hydrophobic condensation surface on the integrated heat spreader second surface, and at least one sidewall extending between the hydrophilic evaporation surface and the hydrophobic condensation surface with a working fluid disposed within the vapor space.
摘要翻译：可以为微电子系统提供热管理解决方案，其中在至少一个微电子器件和集成散热器之间利用跳跃液滴蒸气室。微电子系统可以包括通过其有源表面附着到微电子衬底的微电子器件。具有第一表面和相对的第二表面的集成散热器也通过设置在微电子器件的后表面和集成散热器第二表面之间的跳跃液滴蒸气室附接到微电子衬底。跳跃液滴蒸气室可以包括由微电子器件背表面上的亲水蒸发表面，集成散热器第二表面上的疏水性冷凝表面和在亲水蒸发表面和疏水性冷凝物之间延伸的至少一个侧壁限定的蒸汽空间表面具有设置在蒸气空间内的工作流体。

5. 发明申请

WO2017112039A1 COOLING OF ELECTRONICS USING FOLDED FOIL MICROCHANNELS 审中-公开
标题翻译：电子冷却用折叠箔微通道
公开(公告)号：WO2017112039A1
公开(公告)日：2017-06-29
申请号：PCT/US2016/056677
申请日：2016-10-12
申请人： INTEL CORPORATION
发明人： CHOUDHURY, Arnab , NARDI, Patrick , LABANOK, Nick , LOFGREEN, Kelly P.
IPC分类号： H05K7/20 , H01L23/367 , G06F1/20
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L21/4878 , H01L21/4882 , H01L23/053 , H01L23/3672 , H01L24/32 , H01L2224/32245
摘要： Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.
摘要翻译：实施例通常涉及使用折叠的箔微通道冷却电子器件。一种装置的实施例包括半导体管芯; 衬底，所述半导体管芯与所述衬底耦合; 以及用于半导体管芯的冷却设备，其中冷却设备包括折叠的箔预成形件，折叠的箔形成多个微通道以及流体冷却剂系统以引导流体冷却剂通过折叠箔的微通道。

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