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1. 发明授权

US10492344B2 Power module 有权
公开(公告)号：US10492344B2
公开(公告)日：2019-11-26
申请号：US15705271
申请日：2017-09-15
申请人： Industrial Technology Research Institute
发明人： Chun-Kai Liu , Yu-Lin Chao
IPC分类号： H05K7/20 , H05K7/14 , H05K1/02 , H01L23/473 , H01L25/07
CPC分类号： H05K7/20927 , H01L23/473 , H01L25/07 , H05K1/028 , H05K7/1432 , H05K7/20918
摘要： A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

2. 发明授权

US09915184B2 Waste heat exchanger 有权
公开(公告)号：US09915184B2
公开(公告)日：2018-03-13
申请号：US14571118
申请日：2014-12-15
申请人： Industrial Technology Research Institute
发明人： Wei-Kuo Han , Chun-Kai Liu
IPC分类号： F28D21/00 , F01N5/02 , F28F1/40 , F28F1/42 , F28D7/10 , F28F1/04
CPC分类号： F01N5/025 , F28D7/10 , F28D21/0003 , F28F1/04 , F28F1/40 , F28F1/42
摘要： A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.

3. 发明申请

US20180040798A1 STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF 审中-公开
公开(公告)号：US20180040798A1
公开(公告)日：2018-02-08
申请号：US15721743
申请日：2017-09-30
申请人： Industrial Technology Research Institute
发明人： Li-Ling Liao , Ming-Ji Dai , Chun-Kai Liu , Cheng-Heng Kao , Cheng-Chieh Li , Jeffrey Snyder , Fivos Drymiotis
IPC分类号： H01L35/32 , H01L35/34
CPC分类号： H01L35/32 , H01L35/08 , H01L35/34
摘要： A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

4. 发明授权

US09418921B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US09418921B2
公开(公告)日：2016-08-16
申请号：US14965909
申请日：2015-12-11
申请人： Industrial Technology Research Institute
发明人： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
IPC分类号： H01L23/34 , H01L23/495 , H01L25/18 , H01L25/07 , H01L23/498
CPC分类号： H01L23/49575 , H01L23/13 , H01L23/3735 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/49861 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/072 , H01L25/18 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2224/83447 , H01L2924/00014 , H01L2224/291 , H01L2924/014
摘要： A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
摘要翻译：功率模块包括第一衬底，至少两个功率元件，至少一个第一导电结构和至少一个引线框架。第一基板包括电介质框架，两个第一扇出电路结构层和两个电介质板。两个第一扇出电路结构层分别设置在电介质框架的两个相对表面上，两个电介质板分别设置在两个第一扇出电路结构层上，每个电介质板具有至少一个开口，并且开口和相应的第一扇出电路结构层形成凹陷。两个功率元件分别嵌入两个凹面。两个功率元件通过第一导电结构彼此电连接。设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。

5. 发明申请

US20160172285A1 POWER MODULE 有权
标题翻译：电源模块
公开(公告)号：US20160172285A1
公开(公告)日：2016-06-16
申请号：US14965909
申请日：2015-12-11
申请人： Industrial Technology Research Institute
发明人： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
IPC分类号： H01L23/495 , H01L25/07 , H01L23/498 , H01L25/18
CPC分类号： H01L23/49575 , H01L23/13 , H01L23/3735 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/49861 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/072 , H01L25/18 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2224/83447 , H01L2924/00014 , H01L2224/291 , H01L2924/014
摘要： A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
摘要翻译：功率模块包括第一衬底，至少两个功率元件，至少一个第一导电结构和至少一个引线框架。第一基板包括电介质框架，两个第一扇出电路结构层和两个电介质板。两个第一扇出电路结构层分别设置在电介质框架的两个相对表面上，两个电介质板分别设置在两个第一扇出电路结构层上，每个电介质板具有至少一个开口，并且开口和相应的第一扇出电路结构层形成凹陷。两个功率元件分别嵌入两个凹面。两个功率元件通过第一导电结构彼此电连接。设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。

6. 发明申请

US20160053653A1 WASTE HEAT EXCHANGER 有权
标题翻译：废热交换器
公开(公告)号：US20160053653A1
公开(公告)日：2016-02-25
申请号：US14571118
申请日：2014-12-15
申请人： Industrial Technology Research Institute
发明人： Wei-Kuo Han , Chun-Kai Liu
IPC分类号： F01N5/02 , F25B21/04
CPC分类号： F01N5/025 , F28D7/10 , F28D21/0003 , F28F1/04 , F28F1/40 , F28F1/42
摘要： A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.
摘要翻译：废热交换器可以包括内管，外管，翅片组件和多个热电模块。内管具有多个孔。设置在内管内部的是多个入口通道和多个出口通道。多个入口通道和多个出口通道被设置成彼此对应。多个入口通道和多个出口通道连接到多个孔。流体流过多个入口和多个孔以进入出口通道。外管设置在内管的外侧。导电组件位于内管和外管之间。导电组件设置在内管的外表面和外管的内表面上。

7. 发明公开

US20240162114A1 POWER MODULE 审中-公开
公开(公告)号：US20240162114A1
公开(公告)日：2024-05-16
申请号：US18166496
申请日：2023-02-09
申请人： Industrial Technology Research Institute
发明人： Shian-Chiau Chiou , Chun-Kai Liu , Po-Kai Chiu , Chih-Ming Tzeng , Yao-Shun Chen
IPC分类号： H01L23/427 , H01L23/498
CPC分类号： H01L23/427 , H01L23/49894 , H01L24/32
摘要： A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.

8. 发明授权

US11362014B2 Power module 有权
公开(公告)号：US11362014B2
公开(公告)日：2022-06-14
申请号：US16884403
申请日：2020-05-27
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Chun-Kai Liu , Yao-Shun Chen , Po-Kai Chiu
IPC分类号： H01L23/373 , H01L23/31 , H01L23/00 , H05K7/20 , H01L23/433
摘要： A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.

9. 发明授权

US10818574B2 Plug-in type power module and subsystem thereof 有权
公开(公告)号：US10818574B2
公开(公告)日：2020-10-27
申请号：US16883470
申请日：2020-05-26
申请人： Industrial Technology Research Institute
发明人： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Ming Kaan Liang , Jiin Shing Perng
IPC分类号： H01L23/36 , H01L23/373 , H01L25/065 , H01L23/427 , H01L25/11 , H01L25/07 , H01L23/31 , H01L23/467 , H01L23/367
摘要： A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.

10. 发明申请

US20140138075A1 HEAT EXCHANGER AND SEMICONDUCTOR MODULE 审中-公开
标题翻译：热交换器和半导体模块
公开(公告)号：US20140138075A1
公开(公告)日：2014-05-22
申请号：US13853073
申请日：2013-03-29
申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
发明人： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Chi-Chuan Wang , Kun-Ying Liou
IPC分类号： F28F3/02
CPC分类号： F28F3/02 , F28D15/0233 , F28D2021/0028 , F28F3/12 , F28F2250/06 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A heat exchanger suitable for cooling a heat source is provided, wherein a bypass channel formed in the heat exchanger has a width greater than a width of other channels to reduce a flow resistance of a fluid and a pumping power for driving a system. That is, under the same pumping power loss, more fluid is driven to achieve a better heat dissipation effect. By applying the heat exchanger, electronic devices are bonded to a top of the heat exchanger through a supporting substrate. In this way, heat generated when the electronic devices are is transferred to the heat exchanger through the supporting substrate and dissipated to the outside via the heat exchanger. Since the distance of heat transfer is decreased, the thermal resistance generated by an interface between the devices is reduced to improve heat transfer efficiency and heat dissipation effect.
摘要翻译：提供了一种适于冷却热源的热交换器，其中形成在热交换器中的旁通通道的宽度大于其它通道的宽度，以减小流体的流动阻力和用于驱动系统的泵送功率。也就是说，在相同的泵浦功率损耗下，驱动更多的流体以实现更好的散热效果。通过应用热交换器，电子设备通过支撑衬底结合到热交换器的顶部。以这种方式，当电子设备通过支撑衬底传送到热交换器时产生的热量经由热交换器散发到外部。由于传热距离减小，所以由设备之间的界面产生的热阻降低，以提高传热效率和散热效果。

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