专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2015091606A 超短パルスレーザでの透明材料処理有权
公开(公告)号：JP2015091606A
公开(公告)日：2015-05-14
申请号：JP2014258750
申请日：2014-12-22
申请人： IMRA AMERICA INC
发明人： BOVATSEK JAMES MICHAEL , ARAI ALAN Y , YOSHINO FUMIYO
IPC分类号： B23K26/53 , B23K26/067 , B23K26/364 , C03B33/09
摘要：【課題】透明材料をスクライビングないし溶接する方法を提供する。【解決手段】透明材料をスクライブするため、材料を横切るレーザビームのシングルパスで多重スクライブ造作を創るために、超短レーザパルスを使用し、該スクライブ造作の少なくとも一つは材料の表面下に形成され、クリーンな割断を可能にする。透明材料を溶接するための方法は、局在化された加熱を通して接合を創り出すために、超短レーザパルスを使用する。超短パルス持続時間は、レーザ放射の非線形吸収を起こし、レーザの高繰り返し率は、材料内に熱のパルスからパルスへの蓄積を起こす。レーザは材料の界面近くに集光され、溶接されるための領域に高エネルギーフルーエンスを生成し、材料の残部への損傷を最小化し、きれいな溶接線を可能にする。【選択図】図1a

2. 发明专利

JP2013031879A Processing of transparent material by ultra-short pulse laser 有权
标题翻译：通过超短脉冲激光加工透明材料
公开(公告)号：JP2013031879A
公开(公告)日：2013-02-14
申请号：JP2012194091
申请日：2012-09-04
申请人： Imra America Inc , イムラアメリカインコーポレイテッド
发明人： BOVATSEK JAMES MICHAEL , ARAI ALAN Y , YOSHINO FUMIYO
IPC分类号： B23K26/36 , B23K26/00 , B23K26/04 , B23K26/40 , B28D5/00 , B41M5/26 , C03B23/203 , C03B33/09 , C03C23/00
摘要： PROBLEM TO BE SOLVED: To provide a method for scribing or welding a transparent material.SOLUTION: Ultra-short laser pulse is used for scribing a transparent material and to create a multiple scribe features by the single pass of the laser beam across the material, and at least one of the scribe features is formed below the surface of the material to enable the clean cleavage. In the method for welding the transparent material, the ultra-short laser pulse is used to create the joining through the localized heating. The ultra-short pulse duration time causes the nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes the pulse-to-pulse accumulation of the heat in the material. The laser is converged in the vicinity of an interface of the material, and generates the high energy fluence in the region to be welded, minimize the damage on a remaining portion of the material, and enables a beautiful weld line.
摘要翻译：要解决的问题：提供一种用于划线或焊接透明材料的方法。
解决方案：超短激光脉冲用于划线透明材料，并通过激光束穿过材料的单次通过形成多个划痕特征，并且至少一个划线特征形成在该材料能够清洁切割。在用于焊接透明材料的方法中，超短激光脉冲用于通过局部加热产生接合。超短脉冲持续时间导致激光辐射的非线性吸收，并且激光的高重复率导致材料中的热脉冲到脉冲的积累。激光器会聚在材料界面附近，并在待焊接的区域产生高能量通量，最大限度地减少材料剩余部分的损伤，从而实现美观的焊接线。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2008062263A Transparent material processing with ultrashort pulse laser 有权
标题翻译：透明材料加工与ULTRASH脉冲激光
公开(公告)号：JP2008062263A
公开(公告)日：2008-03-21
申请号：JP2006241654
申请日：2006-09-06
申请人： Imra America Inc , イムラアメリカインコーポレイテッド
发明人： BOVATSEK JAMES MICHAEL , ARAI ALAN Y , YOSHINO FUMIYO
IPC分类号： B23K26/00 , B23K26/32 , B29C65/16 , C03B23/20 , C03B33/09 , C04B41/91
CPC分类号： B29C65/1638 , B23K26/0057 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1648 , B29C65/1654 , B29C65/1696 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73366 , B29C66/836 , B29K2995/0026 , B29K2033/12 , B29K2069/00
摘要： PROBLEM TO BE SOLVED: To provide a method for scribing or welding transparent materials. SOLUTION: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于划线或焊接透明材料的方法。解决方案：一种用于划线透明材料的方法使用超短激光脉冲来产生多个刻划特征，其中激光束通过材料的单次通过，其中至少一个划线特征形成在材料表面下方。这样可以清洁透明材料。用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。超短脉冲持续时间导致激光辐射的非线性吸收，并且激光器的高重复率导致材料内的脉冲 - 脉冲积累的热量。激光聚焦在材料界面附近，在待焊接的区域产生高能量通量。这可以最大限度地减少对其余材料的损坏，并能实现细焊缝。版权所有（C）2008，JPO＆INPIT

4. 发明专利

DE102006042280A1 Transparent material scribing comprises using single scan of focused beam of ultrashort laser pulses to simultaneously create surface groove in material and modified region(s) within bulk of material 未知
公开(公告)号：DE102006042280A1
公开(公告)日：2007-06-06
申请号：DE102006042280
申请日：2006-09-08
申请人： IMRA AMERICA INC
发明人： BOVATSEK JAMES MICHAEL , ARAI ALAN Y , YOSHINO FUMIYO
IPC分类号： B23K26/06 , B23K26/24 , B23K26/36 , B29C65/16 , H01L21/301
摘要： Scribing a transparent material comprises using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a surface groove in the material and modified region(s) within the bulk of the material. Independent claims are also included for: (1) a transparent material scribed at >=2 points in a depth direction by a single scan of a focused beam of ultrashort laser pulses; (2) a method for welding transparent materials; (3) a method for creating a raised ridge at the interface between two opposed surfaces to be welded to fill a gap that cannot be bridged by welding alone; (4) an optical system for welding transparent materials comprising a laser system that produces a beam of ultrashort laser pulses; and a focusing component; (5) a method for generating visible patterns of laser-modified features below the surface of a transparent material; and (6) a method of controlling the visibility of laser-induced sub-surface markings in a transparent material.

5. 发明申请

WO2006079083A9 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A9
公开(公告)日：2006-09-28
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： H01S3/10
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

6. 发明申请

WO2009114375A2 TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开
标题翻译：具有ULTRASH脉冲激光的透明材料加工
公开(公告)号：WO2009114375A2
公开(公告)日：2009-09-17
申请号：PCT/US2009036126
申请日：2009-03-05
申请人： IMRA AMERICA INC , ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
发明人： ARAI ALAN Y , CHO GYU C , XU JINGZHOU , YOSHINO FUMIYO , ZHANG HAIBIN , BOVATSEK JAMES
IPC分类号： H01L21/027
CPC分类号： B23K26/0624 , B23K26/0057 , B23K26/006 , B23K26/0087 , B23K26/0676 , B23K26/083 , B23K26/0869 , B23K26/21 , B23K26/324 , B23K26/359 , B23K26/364 , B23K26/40 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2203/50 , B23K2203/54 , B28D5/00 , B28D5/0011 , B29C65/1606 , B29C65/1612 , B29C65/1619 , B29C65/1629 , B29C65/1635 , B29C65/1638 , B29C65/1654 , B29C65/1658 , B29C65/1687 , B29C65/38 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73161 , B29C66/73366 , B29C66/73921 , B29C66/836 , B29C66/952 , B29K2995/0026 , B41M5/26 , B41M5/262 , B41M5/267 , C03B23/006 , C03B33/102 , C03C23/0025 , H01L21/268 , H01L21/78 , B29K2069/00
摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.
摘要翻译：公开了用于光学透明材料的超短脉冲激光加工的方法，装置和系统，例如在划线，标记，焊接和接合中的应用。例如，超短激光脉冲通过激光束穿过材料产生一次划线特征，其中至少一个划线特征形成在材料表面下方。稍微修改超短脉冲激光加工条件会产生次表面痕迹。正确布置时，这些标记在正确对齐的照明下清晰可见。还可以通过激光参数的控制来形成反射标记。可以使用玻璃以外的透明材料。用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

7. 发明申请

WO2006079083A3 LASER MATERIAL MICROMACHINING WITH GREEN FEMTOSECOND PULSES 审中-公开
标题翻译：激光材料MICROMACHINING与绿色FEMTOSECOND脉冲
公开(公告)号：WO2006079083A3
公开(公告)日：2007-11-01
申请号：PCT/US2006002531
申请日：2006-01-23
申请人： IMRA AMERICA INC , BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
发明人： BOVATSEK JAMES , ARAI ALAN Y , SHAH LAWRENCE , YOSHINO FUMIYO
IPC分类号： B23K26/36
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/364 , B23K26/40 , B23K2203/172 , B23K2203/30 , B23K2203/42 , B23K2203/50 , C03B33/0222 , H01S3/0057
摘要： Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.
摘要翻译：本文所述的系统的各种实施例涉及使用超短可见激光脉冲的微加工材料。在一些实施例中，超短激光脉冲可以是绿色的并且具有在约500至550纳米之间的波长。另外，在某些实施例中，脉冲可以具有小于1皮秒的脉冲持续时间。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式