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    • 2. 发明授权
    • Method for forming GaN semiconductor single crystal substrate and GaN diode with the substrate
    • 用于形成GaN半导体单晶衬底和具有衬底的GaN二极管的方法
    • US06177292B1
    • 2001-01-23
    • US08985440
    • 1997-12-05
    • Chang-Hee HongSun Tae Kim
    • Chang-Hee HongSun Tae Kim
    • H01L2120
    • C30B23/02B82Y20/00C30B29/406H01L21/02381H01L21/0242H01L21/02458H01L21/0254H01L21/02576H01L21/02579H01L21/0262H01L21/02658H01L21/02664H01L33/007H01L33/0079H01S5/0206H01S5/305H01S5/34333H01S2301/173
    • Method for forming a single crystal GaN semiconductor substrate and a GaN diode with the substrate is disclosed which forms in a short time period, has a low crystal defect concentration and allows forming a size large enough to fabricate an optical device, the method including either the steps of fast growth of a GaN group material on an oxide substrate to a thickness without cracking and subjecting to mechanical polish to remove a portion of the oxide substrate, and growing GaN again on the grown GaN layer and complete removal of the remaining oxide substrate to obtain a GaN film, or the steps of separating the oxide substrate from the GaN layer utilizing cooling to obtain a GaN film, grown GaN on the GaN film to a predetermined thickness to form a GaN bulk single crystal and mirror polishing it to form the GaN single crystal substrate, whereby a defectless GaN single crystal substrate of a size required for fabrication of an optical device can be obtained within a short time period because fast homoeptaxial growth of a GaN film is allowed.
    • 公开了在短时间内形成单晶GaN半导体衬底和GaN二极管的方法,其具有低晶体缺陷浓度并且允许形成足够大的尺寸以制造光学器件,该方法包括 将GaN基材料在氧化物基板上快速生长成不破裂的厚度并经受机械抛光以去除一部分氧化物基板的步骤,并且在生长的GaN层上再次生长GaN并完全去除剩余的氧化物基板 获得GaN膜,或者利用冷却从氮化镓层分离氧化物衬底以获得GaN膜,在GaN膜上生长GaN至预定厚度以形成GaN体单晶并进行镜面抛光以形成GaN 单晶衬底,由此可以在短时间内获得具有制造光学器件所需尺寸的无缺陷GaN单晶衬底 因为允许GaN薄膜的快速同轴生长。