专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09455121B2 Semiconductor inspection system and methods of inspecting a semiconductor device using the same 有权
标题翻译：半导体检查系统和使用其的半导体器件的检查方法
公开(公告)号：US09455121B2
公开(公告)日：2016-09-27
申请号：US14828021
申请日：2015-08-17
申请人： Hyunwoo Kim , Wooseok Ko , Minkook Kim , Jung Hwan Kim , Yusin Yang , Sangkil Lee , Chungsam Jun
发明人： Hyunwoo Kim , Wooseok Ko , Minkook Kim , Jung Hwan Kim , Yusin Yang , Sangkil Lee , Chungsam Jun
IPC分类号： H01J37/30 , H01J37/305 , H01J37/285 , H01J37/28
CPC分类号： H01J37/3005 , H01J37/28 , H01J37/285 , H01J37/3053 , H01J2237/2812 , H01J2237/3174
摘要： A semiconductor inspection system including an ion beam milling unit configured to irradiate at least one cluster-ion beam onto a surface of a sample wafer and etch the surface of the sample wafer and an image acquisition unit configured to irradiate an electron beam onto the etched surface of the sample wafer and acquire an image of the etched surface may be provided.
摘要翻译：一种半导体检查系统，包括离子束研磨单元，其被配置为将至少一个簇离子束照射到样品晶片的表面上并蚀刻样品晶片的表面;以及图像获取单元，被配置为将电子束照射到蚀刻表面上并且可以提供蚀刻表面的图像。

2. 发明授权

US09267903B2 Methods and apparatuses for inspecting semiconductor devices using electron beams 有权
标题翻译：使用电子束检查半导体器件的方法和装置
公开(公告)号：US09267903B2
公开(公告)日：2016-02-23
申请号：US14015204
申请日：2013-08-30
申请人： Mira Park , Younghoon Sohn , Yusin Yang , Sangkil Lee , Yong Deok Jeong
发明人： Mira Park , Younghoon Sohn , Yusin Yang , Sangkil Lee , Yong Deok Jeong
IPC分类号： G01N23/225 , H01J37/28 , G01R31/305
CPC分类号： G01N23/2251 , G01R31/305 , H01J37/28 , H01J2237/2806
摘要： Methods and apparatuses for inspecting a semiconductor device using electron beam are provided. The methods may include performing detection operations on a detection target pattern N times and determining a number of detection operations which have been performed until a maximum secondary electron amount of the detection target pattern is obtained. Each of the detection operations may include irradiating the detection target pattern with an electron beam, interrupting the irradiating and detecting a secondary electron amount of the detection target pattern after a detection waiting time has elapsed since the interrupting the irradiating.
摘要翻译：提供了使用电子束检查半导体器件的方法和装置。所述方法可以包括对检测目标图案进行N次检测操作，并且确定已经执行的检测操作的数量，直到获得检测目标图案的最大二次电子量。每个检测操作可以包括用电子束照射检测对象图案，从中断照射开始经过检测等待时间后，中断照射和检测检测对象图案的二次电子量。

3. 发明申请

US20140061462A1 METHODS AND APPARATUSES FOR INSPECTING SEMICONDUCTOR DEVICES USING ELECTRON BEAMS 有权
标题翻译：用电子束检测半导体器件的方法和装置
公开(公告)号：US20140061462A1
公开(公告)日：2014-03-06
申请号：US14015204
申请日：2013-08-30
申请人： Mira PARK , Younghoon Sohn , Yusin Yang , Sangkil Lee , Yong Deok Jeong
发明人： Mira PARK , Younghoon Sohn , Yusin Yang , Sangkil Lee , Yong Deok Jeong
IPC分类号： G01N23/225
CPC分类号： G01N23/2251 , G01R31/305 , H01J37/28 , H01J2237/2806
摘要： Methods and apparatuses for inspecting a semiconductor device using electron beam are provided. The methods may include performing detection operations on a detection target pattern N times and determining a number of detection operations which have been performed until a maximum secondary electron amount of the detection target pattern is obtained. Each of the detection operations may include irradiating the detection target pattern with an electron beam, interrupting the irradiating and detecting a secondary electron amount of the detection target pattern after a detection waiting time has elapsed since the interrupting the irradiating.
摘要翻译：提供了使用电子束检查半导体器件的方法和装置。所述方法可以包括对检测目标图案进行N次检测操作，并且确定已经执行的检测操作的数量，直到获得检测目标图案的最大二次电子量。每个检测操作可以包括用电子束照射检测对象图案，从中断照射开始经过检测等待时间后，中断照射和检测检测对象图案的二次电子量。

4. 发明授权

US09579589B1 Block assembly 有权
标题翻译：块装配
公开(公告)号：US09579589B1
公开(公告)日：2017-02-28
申请号：US15218291
申请日：2016-07-25
申请人： Sangkil Lee , Youngsoon Kim
发明人： Sangkil Lee , Youngsoon Kim
IPC分类号： A63H33/04 , A63H33/10
CPC分类号： A63H33/105 , A63H33/044 , A63H33/10
摘要： The present disclosure provides a block assembly applied not only to an educational purpose for children but also to a model architecture and a simple real building, etc. In one aspect, there is provided a block assembly comprising: a plurality of first-rods, each first-rod having a first cross sectional area, wherein each first-rod is solid or hollow; a plurality of second-rods, each second-rod having a second cross sectional area larger than the first cross sectional area, wherein each second-rod is solid or hollow; a plurality of H shaped beams, each having a H shaped cross section; and at least one of first to fourth unit blocks.
摘要翻译：本公开提供了一种块组件，其不仅适用于儿童的教育目的，而且也适用于模型结构和简单的实际建筑物等。一方面，提供了一种块组件，其包括：多个第一杆，每个第一杆具有第一横截面积，其中每个第一杆是实心的或中空的; 多个第二杆，每个第二杆具有大于第一横截面积的第二横截面面积，其中每个第二杆是实心或中空的; 多个H形梁，每个具有H形横截面; 以及第一至第四单元块中的至少一个。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式