专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050285695A1 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US20050285695A1
公开(公告)日：2005-12-29
申请号：US10880637
申请日：2004-06-29
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H01P3/08 , H01P5/02
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.
摘要翻译：描述传输线阻抗匹配以匹配传输信号迹线上的阻抗不连续性。该装置包括发送信号跟踪和非传输迹线。发送信号迹线具有阻抗不连续性，第一长度和预定的第一宽度。在与阻抗不连续性对应的区域处，将非传输迹线布置在发射信号迹线附近。非透射迹线具有基本上小于发射信号迹线的第一长度的第二长度。此外，非传输轨迹被配置为在存在传输信号迹线上的电流的情况下电磁耦合到传输信号迹线，以在传输信号迹线上提供匹配的阻抗。

2. 发明申请

US20080131997A1 INTEGRATED CIRCUIT PACKAGE WITH CHIP-SIDE SIGNAL CONNECTIONS 有权
标题翻译：集成电路封装与芯片信号连接
公开(公告)号：US20080131997A1
公开(公告)日：2008-06-05
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/71
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

3. 发明授权

US07345359B2 Integrated circuit package with chip-side signal connections 有权
标题翻译：具有芯片侧信号连接的集成电路封装
公开(公告)号：US07345359B2
公开(公告)日：2008-03-18
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L23/02
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括用于在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

4. 发明申请

US20050194669A1 Integrated circuit package with chip-side signal connections 有权
标题翻译：具有芯片侧信号连接的集成电路封装
公开(公告)号：US20050194669A1
公开(公告)日：2005-09-08
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/60 , H01L23/02 , H01L23/498 , H01L23/538 , H01L23/552 , H05K1/14
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

5. 发明申请

US20050063137A1 VERTICAL CAPACITOR APPARATUS, SYSTEMS, AND METHODS 失效
标题翻译：垂直电容器装置，系统和方法
公开(公告)号：US20050063137A1
公开(公告)日：2005-03-24
申请号：US10669678
申请日：2003-09-24
申请人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
发明人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
IPC分类号： H01G2/06 , H01G4/06 , H01G4/228 , H01G4/30 , H01G4/40 , H01G7/00
CPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/40 , Y10T29/435
摘要： An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.
摘要翻译：一种装置和系统及其制造方法可以包括由电介质层分开的多个垂直取向的板，其中垂直定向的板包括联接到板的底侧的多个端子。

6. 发明授权

US07611924B2 Integrated circuit package with chip-side signal connections 有权
标题翻译：具有芯片侧信号连接的集成电路封装
公开(公告)号：US07611924B2
公开(公告)日：2009-11-03
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/00
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译：本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。

7. 发明授权

US07432779B2 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US07432779B2
公开(公告)日：2008-10-07
申请号：US11709972
申请日：2007-02-22
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H03H7/38
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译：传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续的区域处的传输信号迹线附近。

8. 发明授权

US07218183B2 Transmission line impedance matching 有权
标题翻译：传输线阻抗匹配
公开(公告)号：US07218183B2
公开(公告)日：2007-05-15
申请号：US11352182
申请日：2006-02-10
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
IPC分类号： H03H7/38
CPC分类号： H01P3/081 , H01P3/08 , H01P5/02
摘要： Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.
摘要翻译：传输线阻抗匹配，用于匹配传输信号迹线上的阻抗不连续性，其中一个或多个非传输迹线布置在对应于阻抗不连续的区域处的传输信号迹线附近。

9. 发明申请

US20050087877A1 Differential signal traces coupled with high permittivity material 审中-公开
标题翻译：差分信号迹线耦合高介电常数材料
公开(公告)号：US20050087877A1
公开(公告)日：2005-04-28
申请号：US10690928
申请日：2003-10-22
申请人： Dong-Ho Han , Joong-Ho Kim , Jiangqi He , Hyunjun Kim
发明人： Dong-Ho Han , Joong-Ho Kim , Jiangqi He , Hyunjun Kim
IPC分类号： H05K1/02 , H05K1/16 , H05K3/28 , H01L23/48 , H01L23/52
CPC分类号： H05K1/024 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09236 , H05K2201/09881
摘要： In some embodiments, an apparatus includes a substrate and a pair of signal traces formed on the substrate. The signal traces may be spaced apart from each other. The apparatus may also include a filler material on the substrate and between the signal traces. The filler material may have a dielectric constant that is higher than a dielectric constant of a material of which the substrate is formed.
摘要翻译：在一些实施例中，装置包括衬底和形成在衬底上的一对信号迹线。信号迹线可以彼此间隔开。该装置还可以在衬底上和信号迹线之间包括填充材料。填充材料可以具有高于形成衬底的材料的介电常数的介电常数。

10. 发明授权

US07352557B2 Vertical capacitor apparatus, systems, and methods 有权
标题翻译：立式电容器，系统和方法
公开(公告)号：US07352557B2
公开(公告)日：2008-04-01
申请号：US11082341
申请日：2005-03-17
申请人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
发明人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
IPC分类号： H01G4/06
CPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/40 , Y10T29/435
摘要： An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.
摘要翻译：一种装置和系统及其制造方法可以包括由电介质层分开的多个垂直取向的板，其中垂直定向的板包括联接到板的底侧的多个端子。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式