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1. 发明申请

US20060169999A1 LED package frame and LED package having the same 有权
标题翻译： LED封装框架和LED封装相同
公开(公告)号：US20060169999A1
公开(公告)日：2006-08-03
申请号：US11319101
申请日：2005-12-28
申请人： Young Park , Seung Lee , Hun Hahm , Hyung Kim , Bum Kim , Young Jeong , Ho Ahn , Jung Park
发明人： Young Park , Seung Lee , Hun Hahm , Hyung Kim , Bum Kim , Young Jeong , Ho Ahn , Jung Park
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014
摘要： The invention relates to an LED package frame and an LED package incorporating the same. The LED package frame comprises an LED chip; and a heat conductive member made of a lump of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability. Also, it is possible to provide an LED package frame and a high power LED package by fixing the lead fixed to the heat conductive member without a jig.
摘要翻译：本发明涉及一种LED封装框架和一个包含该LED封装框架的LED封装件。 LED封装框架包括LED芯片; 以及由高导热性材料块制成的导热构件。导热构件在侧部具有接收部，并且安装有LED芯片。引线一端插入导热部件的接收部分，并与LED芯片电连接。电绝缘层被放置在引导件和导热构件的接收部分之间的紧密接触中以将引线与接收部分分离。通过将导线插入导热构件，可以在保持高导热性和稳定性的同时减小尺寸。此外，通过将固定在导热构件上的引线固定而不用夹具，可以提供LED封装框架和大功率LED封装。

2. 发明申请

US20060187651A1 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US20060187651A1
公开(公告)日：2006-08-24
申请号：US11136529
申请日：2005-05-25
申请人： Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Young Park , Hun Hahm , Bum Kim
发明人： Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Young Park , Hun Hahm , Bum Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.
摘要翻译：直接照明背光装置使用LED作为光源。该背光装置包括：平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案，布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体，并且布置在散射图案周围以将从下方入射的光引入透明板，使得光被透明板内部反射。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。这可以去除透明板中的LED光源上方的任何暗区，从而减小直射照明背光装置的厚度。

3. 发明申请

US20060171151A1 Side-emission typy LED package 有权
标题翻译：侧排型式LED封装
公开(公告)号：US20060171151A1
公开(公告)日：2006-08-03
申请号：US11318837
申请日：2005-12-28
申请人： Young Park , Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Hun Hahm , Bum Kim
发明人： Young Park , Hyung Kim , Jung Park , Ho Ahn , Young Jeong , Hun Hahm , Bum Kim
IPC分类号： F21V5/00
CPC分类号： H01L33/60 , F21K9/68 , H01L33/54
摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
摘要翻译：提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。下部结构具有下反射镜和透明密封构件。下部结构支持LED芯片。下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。透明密封件形成在下反射镜内部的LED芯片周围。上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

4. 发明申请

US20060146530A1 Led backlight apparatus 审中-公开
标题翻译： LED背光装置
公开(公告)号：US20060146530A1
公开(公告)日：2006-07-06
申请号：US11134430
申请日：2005-05-23
申请人： Jung Park , Hun Hahm , Ho Ahn , Bum Kim , Young Park , Hyung Kim , Young Jeong
发明人： Jung Park , Hun Hahm , Ho Ahn , Bum Kim , Young Park , Hyung Kim , Young Jeong
IPC分类号： F21V7/00
CPC分类号： G02F1/133603 , G02F1/133605
摘要： This invention relates to an LED backlight apparatus. The LED backlight apparatus comprises: a housing having an upper opening; a reflective sheet provided on a bottom inside the housing; a plurality of LED light sources arranged above the reflective sheet at a predetermined distance to emit light toward the reflective sheet; and a light source support connected to a side wall of the housing to support the LED light sources. The light sources are arranged opposite to the reflective sheet so that light beams emitted from the LED light sources reflect from the reflective sheet before entering a diffuser plate behind the LED light sources from the reflective sheet, thereby potentially reducing the thickness of the backlight apparatus while ensuring a distance for the light beams to sufficiently mix together before entering the differ plate.
摘要翻译：本发明涉及一种LED背光装置。 LED背光装置包括：具有上开口的壳体; 设置在所述壳体内的底部的反射片; 多个LED光源，以预定距离布置在反射片上方，以向反射片发射光; 以及连接到壳体的侧壁以支撑LED光源的光源支撑件。光源与反射片相对布置，使得从LED光源发射的光束从反射片反射到反射片之后，从LED反射片进入漫射板后面，从而潜在地减小背光装置的厚度，同时确保在进入不同板之前使光束充分混合在一起的距离。

5. 发明申请

US20060083021A1 Large size backlight apparatus reduced in thickness 失效
标题翻译：大尺寸背光设备厚度减小
公开(公告)号：US20060083021A1
公开(公告)日：2006-04-20
申请号：US11060286
申请日：2005-02-18
申请人： Young Jeong , Hyung Kim , Jung Park , Ho Ahn , Young Park , Bum Kim , Hun Hahm
发明人： Young Jeong , Hyung Kim , Jung Park , Ho Ahn , Young Park , Bum Kim , Hun Hahm
IPC分类号： F21V7/04
CPC分类号： G02B6/0021 , G02B6/0036 , G02B6/0055 , G02B6/0061 , G02B6/0068 , G02B6/0076
摘要： The present invention relates to a backlight apparatus used in an LCD, in which upper and lower reflective plates are installed under upper and lower transparent plates, respectively. The lower transparent plates and the lower reflective plates introduce light generated by lower light sources in upward directions and the upper transparent plate and the upper reflective plates introduce light generated by an upper light source into those areas, which are not lighted by the lower light sources. This can prevent the formation of dark areas above the lower light sources as a problem of a conventional large-sized backlight apparatus, thereby enhancing the overall uniformity of light. In this way, the backlight apparatus of the invention can be designed thin even when applied to a large-sized LCD.
摘要翻译：本发明涉及一种在LCD中使用的背光装置，其中上反射板和下反射板分别安装在上透明板和下透明板之下。下透明板和下反射板在向上方向引入由下光源产生的光，并且上透明板和上反射板将由上光源产生的光引入那些未被下光源照射的区域。这可以防止在较低光源之上形成暗区域作为常规大型背光装置的问题，从而增强光的整体均匀性。以这种方式，即使应用于大型LCD也能够将本发明的背光装置设计得很薄。

6. 发明申请

US20060157657A1 Led array circuit 审中-公开
标题翻译： LED阵列电路
公开(公告)号：US20060157657A1
公开(公告)日：2006-07-20
申请号：US11304821
申请日：2005-12-16
申请人： Young Jeong , Hun Hahm , Hyung Kim , Jung Park , Young Park , Ho Ahn , Bum Kim
发明人： Young Jeong , Hun Hahm , Hyung Kim , Jung Park , Young Park , Ho Ahn , Bum Kim
IPC分类号： G02B27/00
CPC分类号： H05B33/0821 , G02F1/133603 , Y02B20/341
摘要： Provided is an LED array circuit that has reduced power consumption and can protect an LED from a reverse voltage. The LED array circuit includes an LED pair, and an AC power source for supplying an AC voltage to the LED pair. The LED pair includes a first LED and a second LED that are connected in parallel to each other with biasing polarity connected in reverse.
摘要翻译：提供了一种LED阵列电路，其具有降低的功率消耗并且可以保护LED免受反向电压的影响。 LED阵列电路包括LED对，以及用于向LED对提供AC电压的AC电源。 LED对包括彼此并联连接的偏置极性相反的第一LED和第二LED。

7. 发明申请

US20060083019A1 Backlight apparatus reduced in thickness 失效
标题翻译：背光装置的厚度减小
公开(公告)号：US20060083019A1
公开(公告)日：2006-04-20
申请号：US11059406
申请日：2005-02-17
申请人： Hun Hahm , Hyung Kim , Jung Park , Ho Anh , Young Park , Bum Kim , Young Jeong
发明人： Hun Hahm , Hyung Kim , Jung Park , Ho Anh , Young Park , Bum Kim , Young Jeong
IPC分类号： G02F1/1335
CPC分类号： G02B6/0068 , G02B6/0016 , G02B6/0043 , G02F1/133603
摘要： The invention relates to a backlight apparatus in use for an LCD, in which a plurality of bar-shaped first LED light sources are arranged on the reflective plate to laterally emit light. A plurality of light shades are arranged above the first light sources. A transparent plate is placed above the light shades. Scattering patterns are formed in the bottom of the transparent plate in positions corresponding to the light shades. A bar-shaped second LED light source is arranged at a side of the transparent plate to emit light into the transparent plate. The light source arranged at the side of the transparent plate prevents the formation of dark areas as a problem in the prior art, thereby enhancing the entire uniformity of light. Then, the backlight apparatus can be maintained thin even when applied to a large-sized LCD.
摘要翻译：本发明涉及一种用于LCD的背光装置，其中多个条形第一LED光源被布置在反射板上以横向发光。多个浅色调布置在第一光源的上方。透明板放置在浅色调之上。散射图案形成在透明板底部的对应于浅色调的位置上。在透明板的一侧设置条状的第二LED光源，以将光发射到透明板中。布置在透明板一侧的光源防止了现有技术中的黑色区域的形成，从而增强了光的整体均匀性。然后，即使应用于大型LCD也能够使背光装置保持薄型化。

8. 发明申请

US20060208269A1 Side-emitting LED package having scattering area and backlight apparatus incorporating the LED lens 有权
标题翻译：具有散射面积的侧面发光LED封装和并入LED透镜的背光装置
公开(公告)号：US20060208269A1
公开(公告)日：2006-09-21
申请号：US11370021
申请日：2006-03-08
申请人： Bum Kim , Hyung Kim , Ho Ahn , Young Jeong , Sung Yang
发明人： Bum Kim , Hyung Kim , Ho Ahn , Young Jeong , Sung Yang
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , G02F1/133603 , G02F1/133615 , H01L33/60 , H01L2933/0091
摘要： The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.
摘要翻译：本发明提供了一种LED封装和结合了LED透镜的背光装置。 LED封装具有底表面和从底表面围绕封装的中心轴线圆柱形延伸的光出射表面。此外，反射表面位于底表面的相对侧并且围绕中心轴对称，使得从底表面入射的光被反射到光出射表面。此外，在反射面上形成散射区域。根据本发明，通过在LED封装的反射面上施加散射材料，不需要附着反射纸，从而简化了工艺并缩短了制造时间和成本。

9. 发明申请

US20070109952A1 Lens for uniformly distributing light and optical emitting device using the same 有权
标题翻译：用于均匀分配光的透镜和使用其的发光装置
公开(公告)号：US20070109952A1
公开(公告)日：2007-05-17
申请号：US11599269
申请日：2006-11-15
申请人： Young- Jeong , Seog Lim , Bum Kim , Sung Yang
发明人： Young- Jeong , Seog Lim , Bum Kim , Sung Yang
IPC分类号： G11B7/24
CPC分类号： G02F1/133603 , F21V5/04 , F21Y2115/10 , G02B19/0014 , G02B19/0061 , G02F2001/133607 , Y10S362/80
摘要： A lens includes a convex surface formed in an outer surface thereof facing away from a light source to uniformly distribute light emitted from the light source; a concave surface concaved inward from an inner region of the convex surface, around an optical axis; and a convex portion convexed outward from a central region of the concave surface, which the optical axis intersects, in order to enhance quantity of light around the optical axis. The lens refracts light beams falling onto the respective areas thereof at different angles, thereby producing a uniform light distribution within a specific lighting range, but does not create a dark area around an optical axis.
摘要翻译：透镜包括形成在其远离光源的外表面中的凸表面，以均匀分布从光源发射的光; 围绕光轴从凸面的内部区域向内凹陷的凹面; 以及从光轴相交的凹面的中心区域向外凸出的凸部，以增强光轴周围的光量。透镜以不同的角度折射落在其各自区域上的光束，从而在特定照明范围内产生均匀的光分布，但不会在光轴周围产生暗区。

10. 发明申请

US20060011813A1 Image sensor having a passivation layer exposing at least a main pixel array region and methods of fabricating the same 有权
公开(公告)号：US20060011813A1
公开(公告)日：2006-01-19
申请号：US11044135
申请日：2005-01-27
申请人： Young Park , Ki Kim , Bum Kim , Jeong Bae , Yu Ahn , Jung Ahn , Soo Lee , Yong Lee , Sung Hwang
发明人： Young Park , Ki Kim , Bum Kim , Jeong Bae , Yu Ahn , Jung Ahn , Soo Lee , Yong Lee , Sung Hwang
IPC分类号： H01L27/00
CPC分类号： H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14645 , H01L27/14685
摘要： A CMOS image sensor with improved sensitivity includes a main pixel array region of an active pixel array region formed on a semiconductor substrate. A passivation layer is formed over the sensor, and it is at least partially removed from the main pixel array region, such that incident light being detected by the main pixel array does not pass through the passivation layer. Optical absorption and refraction caused by the material of the passivation layer are eliminated, resulting in an image sensor with improved optical sensitivity.

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