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1. 发明授权

US08444906B2 Method of cutting substrate 有权
标题翻译：基材切割方法
公开(公告)号：US08444906B2
公开(公告)日：2013-05-21
申请号：US12731479
申请日：2010-03-25
申请人： Hyun-Chul Lee , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
发明人： Hyun-Chul Lee , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
IPC分类号： C03B33/02 , B23K26/36
CPC分类号： C03B33/082 , B23K26/082 , B23K26/40 , B23K2103/50 , C03B33/033 , C03B33/076 , G02F1/133351 , H01L51/56 , H01L2251/566 , Y10T225/12 , Y10T225/321
摘要： A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
摘要翻译：基板切割方法包括以下步骤：沿着切割线对准包括两个或更多个基板的面板，沿着切割线在所述面板的各个基板中形成凹槽线，通过沿着切割线振荡相应的紫外线UV激光束，以及沿着凹槽线切割面板，通过向面板施加力。

2. 发明申请

US20100243623A1 METHOD OF CUTTING SUBSTRATE 有权
标题翻译：切割基板的方法
公开(公告)号：US20100243623A1
公开(公告)日：2010-09-30
申请号：US12731479
申请日：2010-03-25
申请人： Hyun-Chul LEE , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
发明人： Hyun-Chul LEE , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
IPC分类号： B23K26/38
CPC分类号： C03B33/082 , B23K26/082 , B23K26/40 , B23K2103/50 , C03B33/033 , C03B33/076 , G02F1/133351 , H01L51/56 , H01L2251/566 , Y10T225/12 , Y10T225/321
摘要： A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
摘要翻译：基板切割方法包括以下步骤：沿着切割线对准包括两个或更多个基板的面板，沿着切割线在所述面板的各个基板中形成凹槽线，通过沿着切割线振荡相应的紫外线UV激光束，以及沿着凹槽线切割面板，通过向面板施加力。

3. 发明授权

US09174307B2 Substrate cutting apparatus and method for cutting substrate using the same 有权
标题翻译：基板切割装置及其使用方法
公开(公告)号：US09174307B2
公开(公告)日：2015-11-03
申请号：US12805004
申请日：2010-07-07
申请人： Hyun-Chul Lee , Won-Kyu Lim , Joon-Hyung Kim , Jae-Seok Park , Cheol-Lae Roh
发明人： Hyun-Chul Lee , Won-Kyu Lim , Joon-Hyung Kim , Jae-Seok Park , Cheol-Lae Roh
IPC分类号： B29C35/08 , B23K26/08 , B23K26/06 , B23K26/073 , B23K26/14 , B23K26/30 , C03B33/04 , C03B33/09
CPC分类号： B23K26/082 , B23K26/06 , B23K26/0604 , B23K26/0624 , B23K26/0738 , B23K26/0853 , B23K26/142 , B23K26/144 , B23K26/40 , B23K26/60 , C03B33/04 , C03B33/091 , C03B33/093
摘要： A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.
摘要翻译：一种基板切割装置，包括：被配置为支撑基板的台，配置成朝向基板发射第一激光束的第一激光发生器，作为短脉冲激光束的第一激光束，以及设置在光束路径上的光束摆动单元所述光束摆动单元被配置为使所述第一激光束在所述基板上的预定光照射部分中摆动，所述基板上的所述光照射部分包括曲线部分和直线部分中的至少一个。

4. 发明授权

US08520182B2 Flat panel display and manufacturing method thereof 有权
标题翻译：平板显示及其制造方法
公开(公告)号：US08520182B2
公开(公告)日：2013-08-27
申请号：US12946789
申请日：2010-11-15
申请人： Hyun-Chul Lee , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee , Jang-Hwan Shin
发明人： Hyun-Chul Lee , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee , Jang-Hwan Shin
IPC分类号： G02F1/1333
CPC分类号： G02F1/1339 , G02F1/1333 , G02F1/133351 , G02F2001/133302 , H01L51/524 , H01L2251/566 , H05B33/10
摘要： A flat panel display is disclosed. In one embodiment, the display includes i) a first substrate including a display area, wherein at least one display element is formed in the display area, ii) a second substrate covering the display area and connected to the first substrate, iii) a sealant formed between the first and second substrates. In one embodiment, the first substrate and the second substrate comprise a first cut surface and a second cut surface, respectively. Further, each of the first cut surface and the second cut surface has a plurality of corners each of which is concave from the perspective of the display area.
摘要翻译：公开了一种平板显示器。在一个实施例中，显示器包括i）包括显示区域的第一基板，其中至少一个显示元件形成在显示区域中，ii）覆盖显示区域并连接到第一基板的第二基板，iii）密封剂形成在第一和第二基板之间。在一个实施例中，第一基板和第二基板分别包括第一切割表面和第二切割表面。此外，从显示区域的角度看，第一切割面和第二切割面各自具有多个角部，每个角部都是凹形的。

5. 发明申请

US20110163662A1 Organic light-emitting display device and method of manufacturing the same 有权
标题翻译：有机发光显示装置及其制造方法
公开(公告)号：US20110163662A1
公开(公告)日：2011-07-07
申请号：US12929152
申请日：2011-01-04
申请人： Won-Kyu Lim , Hyun-Chul Lee , Jae-Seok Park , Cheol-Lae Roh , Jang-Hwan Shin , Yong-Jin Lee
发明人： Won-Kyu Lim , Hyun-Chul Lee , Jae-Seok Park , Cheol-Lae Roh , Jang-Hwan Shin , Yong-Jin Lee
IPC分类号： H01J1/62 , H01J9/26
CPC分类号： H01L51/524 , H01L27/3276 , H01L51/5246 , H01L51/525
摘要： An organic light-emitting display device includes a first substrate including an organic light-emitting diode and a plurality of electrodes connected to the organic light-emitting diode, the plurality of electrodes extending on the first substrate along a first direction toward an edge of the first substrate, a second substrate connected to the first substrate, the second substrate being shorter than the first substrate and exposing a portion of the plurality of electrodes on the first substrate, a sealing material disposed between the first substrate and the second substrate to surround the organic light-emitting diode, and an electrode protecting layer partially covering the exposed portion of the plurality of electrodes on the first substrate, a first side of the electrode protecting layer being between the first substrate and the second substrate, and a second side of the electrode protecting layer protruding beyond the second substrate.
摘要翻译：一种有机发光显示装置，具备包括有机发光二极管的第一基板和连接到所述有机发光二极管的多个电极，所述多个电极沿着第一方向朝向所述有机发光二极管的边缘延伸，第一基板，连接到第一基板的第二基板，第二基板比第一基板短，并且暴露第一基板上的多个电极的一部分，设置在第一基板和第二基板之间的密封材料，有机发光二极管和部分地覆盖第一基板上的多个电极的暴露部分的电极保护层，电极保护层的第一侧在第一基板和第二基板之间，第二面电极保护层突出超过第二基板。

6. 发明授权

US08957582B2 Organic light-emitting display device and method of manufacturing the same 有权
标题翻译：有机发光显示装置及其制造方法
公开(公告)号：US08957582B2
公开(公告)日：2015-02-17
申请号：US12929152
申请日：2011-01-04
申请人： Won-Kyu Lim , Hyun-Chul Lee , Jae-Seok Park , Cheol-Lae Roh , Jang-Hwan Shin , Yong-Jin Lee
发明人： Won-Kyu Lim , Hyun-Chul Lee , Jae-Seok Park , Cheol-Lae Roh , Jang-Hwan Shin , Yong-Jin Lee
IPC分类号： H01J1/62 , H01J9/26 , H01L51/52 , H01L27/32
CPC分类号： H01L51/524 , H01L27/3276 , H01L51/5246 , H01L51/525
摘要： An organic light-emitting display device includes a first substrate including an organic light-emitting diode and a plurality of electrodes connected to the organic light-emitting diode, the plurality of electrodes extending on the first substrate along a first direction toward an edge of the first substrate, a second substrate connected to the first substrate, the second substrate being shorter than the first substrate and exposing a portion of the plurality of electrodes on the first substrate, a sealing material disposed between the first substrate and the second substrate to surround the organic light-emitting diode, and an electrode protecting layer partially covering the exposed portion of the plurality of electrodes on the first substrate, a first side of the electrode protecting layer being between the first substrate and the second substrate, and a second side of the electrode protecting layer protruding beyond the second substrate.
摘要翻译：一种有机发光显示装置，具备包括有机发光二极管的第一基板和连接到所述有机发光二极管的多个电极，所述多个电极沿着第一方向朝向所述有机发光二极管的边缘延伸，第一基板，连接到第一基板的第二基板，第二基板比第一基板短，并且暴露第一基板上的多个电极的一部分，设置在第一基板和第二基板之间的密封材料，有机发光二极管和部分地覆盖第一基板上的多个电极的暴露部分的电极保护层，电极保护层的第一侧在第一基板和第二基板之间，第二面电极保护层突出超过第二基板。

7. 发明申请

US20110194063A1 FLAT PANEL DISPLAY AND MANUFACTURING METHOD THEREOF 有权
标题翻译：平板显示及其制造方法
公开(公告)号：US20110194063A1
公开(公告)日：2011-08-11
申请号：US12946789
申请日：2010-11-15
申请人： Hyun-Chul Lee , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee , Jang-Hwan Shin
发明人： Hyun-Chul Lee , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee , Jang-Hwan Shin
IPC分类号： G02F1/1339 , H01J1/62 , H01J9/26
CPC分类号： G02F1/1339 , G02F1/1333 , G02F1/133351 , G02F2001/133302 , H01L51/524 , H01L2251/566 , H05B33/10
摘要： A flat panel display is disclosed. In one embodiment, the display includes i) a first substrate including a display area, wherein at least one display element is formed in the display area, ii) a second substrate covering the display area and connected to the first substrate, iii) a sealant formed between the first and second substrates. In one embodiment, the first substrate and the second substrate comprise a first cut surface and a second cut surface, respectively. Further, each of the first cut surface and the second cut surface has a plurality of corners each of which is concave from the perspective of the display area.
摘要翻译：公开了一种平板显示器。在一个实施例中，显示器包括i）包括显示区域的第一基板，其中至少一个显示元件形成在显示区域中，ii）覆盖显示区域并连接到第一基板的第二基板，iii）密封剂形成在第一和第二基板之间。在一个实施例中，第一基板和第二基板分别包括第一切割表面和第二切割表面。此外，从显示区域的角度看，第一切割面和第二切割面各自具有多个角部，每个角部都是凹形的。

8. 发明授权

US08835803B2 Laser cutting method and method of manufacturing organic light-emitting device 有权
标题翻译：激光切割方法及制造有机发光装置的方法
公开(公告)号：US08835803B2
公开(公告)日：2014-09-16
申请号：US12929061
申请日：2010-12-28
申请人： Won-Kyu Lim , Hyun-Chul Lee , Alexander Voronov , Jae-Seok Park , Cheol-Lae Roh
发明人： Won-Kyu Lim , Hyun-Chul Lee , Alexander Voronov , Jae-Seok Park , Cheol-Lae Roh
IPC分类号： B23K26/00 , B23K26/16 , B23K26/40 , B23K26/38
CPC分类号： B23K26/40 , B23K26/38 , B23K2103/172 , B23K2103/30 , B23K2103/50
摘要： A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.
摘要翻译：激光切割方法包括提供多层基板，使得所述多层基板包括堆叠的第一和第二基板之间的电路图案，并且通过在所述第二基板上照射激光束来去除所述第二基板的一部分，所述激光光束相对于第二基板的上表面以倾斜角照射。

9. 发明授权

US08420156B2 Method of forming pattern and manufacturing method of organic light emitting device 有权
标题翻译：形成有机发光装置的方法和制造方法
公开(公告)号：US08420156B2
公开(公告)日：2013-04-16
申请号：US12929209
申请日：2011-01-07
申请人： Hyun-Chul Lee , Jae-Seok Park , Cheol-Lae Roh , Won-Kyu Lim
发明人： Hyun-Chul Lee , Jae-Seok Park , Cheol-Lae Roh , Won-Kyu Lim
IPC分类号： B05D1/12 , B05D1/32 , B05D5/06
CPC分类号： H01L51/0013 , C23C14/042 , C23C14/34 , H01L27/3211 , H01L27/3244 , H01L51/56
摘要： A method of forming a pattern and a method of manufacturing an organic light emitting device, the method of forming a pattern including providing an electromagnetic substrate for generating an electromagnetic field at a selectively controllable position by selectively controlling where current flows through the electromagnetic substrate; providing a patterning substrate for forming a pattern; aligning the electromagnetic substrate to a first surface of the patterning substrate; selectively applying current to the electromagnetic substrate to form the electromagnetic field at the predetermined position; providing masking powder in a vicinity of a second surface of the patterning substrate such that the masking powder reacts to the electromagnetic field; supplying a pattern forming material to the second surface of the patterning substrate; and cutting off the current to the electromagnetic substrate.
摘要翻译：一种形成图案的方法和制造有机发光器件的方法，所述方法包括提供用于通过选择性地控制电流流经所述电磁基底的电流在选择性可控位置产生电磁场的电磁基底; 提供用于形成图案的图案形成基板; 将电磁基板对准图案形成基板的第一表面; 选择性地向所述电磁基板施加电流以在所述预定位置形成所述电磁场; 在所述构图衬底的第二表面附近提供掩蔽粉末，使得所述掩蔽粉末对所述电磁场起反应; 向所述图案化衬底的第二表面提供图案形成材料; 并切断到电磁基板的电流。

10. 发明申请

US20110155705A1 Laser cutting method and method of manufacturing organic light-emitting device 有权
标题翻译：激光切割方法及制造有机发光装置的方法
公开(公告)号：US20110155705A1
公开(公告)日：2011-06-30
申请号：US12929061
申请日：2010-12-28
申请人： Won-Kyu Lim , Hyun-Chul Lee , Alexander Voronov , Jae-Seok Park , Cheol-Lae Roh
发明人： Won-Kyu Lim , Hyun-Chul Lee , Alexander Voronov , Jae-Seok Park , Cheol-Lae Roh
IPC分类号： B23K26/38
CPC分类号： B23K26/40 , B23K26/38 , B23K2103/172 , B23K2103/30 , B23K2103/50
摘要： A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.
摘要翻译：激光切割方法包括提供多层基板，使得所述多层基板包括堆叠的第一和第二基板之间的电路图案，并且通过在所述第二基板上照射激光束来去除所述第二基板的一部分，所述激光光束相对于第二基板的上表面以倾斜角照射。

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