会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Semiconductor optical device having current-confined structure
    • 具有限流结构的半导体光学器件
    • US07394104B2
    • 2008-07-01
    • US11698418
    • 2007-01-25
    • Hyun Woo SongO Kyun KwonWon Seok HanSang Hee ParkJong Hee KimJae Heon ShinYoung Gu Ju
    • Hyun Woo SongO Kyun KwonWon Seok HanSang Hee ParkJong Hee KimJae Heon ShinYoung Gu Ju
    • H01L27/15
    • H01L33/145H01S5/18308H01S5/18316H01S5/18347H01S5/3095H01S2301/176
    • Provided is a semiconductor optical device having a current-confined structure. The device includes a first semiconductor layer of a first conductivity type which is formed on a semiconductor substrate and includes one or more material layers, a second semiconductor layer which is formed on the first semiconductor layer and includes one or more material layers, and a third semiconductor layer of a second conductivity type which is formed on the second semiconductor layer and includes one or more material layers. One or more layers among the first semiconductor layer, the second semiconductor, and the third semiconductor layer have a mesa structure. A lateral portion of at least one of the material layers constituting the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer is recessed, and the recess is partially or wholly filled with an oxide layer, a nitride layer or a combination of them. The semiconductor optical device having the current-confined region is mechanically reliable, highly thermally conductive, and commercially preferable and can be used in a wavelength range for optical communications.
    • 提供了具有限流结构的半导体光学器件。 该器件包括:第一导电类型的第一半导体层,其形成在半导体衬底上并且包括一个或多个材料层;第二半导体层,形成在第一半导体层上并包括一个或多个材料层;第三半导体层, 第二导电类型的半导体层,其形成在第二半导体层上并且包括一个或多个材料层。 第一半导体层,第二半导体和第三半导体层中的一层或多层具有台面结构。 构成第一半导体层,第二半导体层和第三半导体层的至少一个材料层的侧面部分被凹入,并且凹部被部分地或全部地填充有氧化物层,氮化物层或者 他们。 具有电流限制区域的半导体光学器件是机械可靠的,高导热性的,并且是商业上优选的,并且可以用于光通信的波长范围。
    • 7. 发明申请
    • Multi-chip package LED lighting device
    • 多芯片封装LED照明装置
    • US20110037390A1
    • 2011-02-17
    • US12805419
    • 2010-07-30
    • Young Kook KoSang Hee Park
    • Young Kook KoSang Hee Park
    • H01J61/52
    • F21V29/67F21V13/04F21V23/04F21V29/51F21V29/58F21V29/59F21Y2105/10F21Y2105/12F21Y2113/13F21Y2115/10
    • A lighting device for providing mixtures of color temperature and intensity of light. The device comprises a case that contains: a multi-chip of light emitting diode (LED) to output mixtures of color temperature and intensity of light, having a plurality of blocks of LEDs each having a predetermined color temperature, the multi-chip LED being mounted on a printed circuit board (PCB); a cooling system attached on the back of the metal PCB, the cooling system using a fluid coolant for radiating heat generated by the multi-chip LED; and a control system electrically connected with the PCB of each block and the cooling system, the control system is adapted to supply power to the multi-chip LED, select the blocks of LEDs to be adjusted, adjust the color temperature and intensity of light of the selected block of LEDs to obtain mixtures of color temperatures and intensity of light.
    • 一种用于提供色温和光强的混合物的照明装置。 该装置包括:一个壳体,包括:多个发光二极管(LED)的多芯片,用于输出色温和光强度的混合物,具有多个具有预定色温的LED块,多芯片LED是 安装在印刷电路板(PCB)上; 安装在金属PCB背面的冷却系统,冷却系统使用流体冷却剂来散发由多芯片LED产生的热量; 以及与各个块的PCB和冷却系统电连接的控制系统,所述控制系统适于向所述多芯片LED供电,选择要调节的LED块,调节所述LED的色温和亮度 所选择的LED块以获得色温和光强度的混合。