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1. 发明授权

US06970345B2 Solid electrolytic capacitor and manufacturing method 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US06970345B2
公开(公告)日：2005-11-29
申请号：US10852436
申请日：2004-05-25
申请人： Hyun Sub Oh , Jae Kwang Kim , Jae Jun Park
发明人： Hyun Sub Oh , Jae Kwang Kim , Jae Jun Park
IPC分类号： H01G9/08 , H01G2/06 , H01G4/228 , H01G9/00 , H01G9/012 , H01G9/042 , H01G9/10 , H01G9/145 , H01G9/15 , H01G13/00
CPC分类号： H01G9/012 , H01G2/065 , H01G9/042 , H01G9/15 , Y10T29/417
摘要： Disclosed is a solid electrolytic capacitor, wherein a capacitor element has a front surface from which an anode lead wire is protruded. A cathode layer is formed on an outer surface of the capacitor element. A flat-shaped cathode lead frame is surface-contacted with an entire rear surface of the capacitor element. A flat-shaped anode lead frame has a concave portion formed at a central end portion thereof, in which the anode lead wire of the capacitor element is seated and electrically connected to the concave portion. A mold is formed to surround the capacitor element, to partially surround the anode lead frame, and to contact a face of the cathode lead frame which is surface-contacted with the capacitor element.
摘要翻译：公开了一种固体电解电容器，其中电容器元件具有突出阳极引线的前表面。阴极层形成在电容器元件的外表面上。扁平形阴极引线框架与电容器元件的整个背面表面接触。平面状的阳极引线框架具有形成在其中央端部的凹部，电容器元件的阳极引线被安置并与凹部电连接。模具形成为围绕电容器元件，以部分地围绕阳极引线框架，并且与阴极引线框架的与电容器元件表面接触的面接触。

2. 发明授权

US06512668B1 Tantalum chip capacitor with cut-grooved lead frame 有权
标题翻译：钽片电容器带有切槽引线框架
公开(公告)号：US06512668B1
公开(公告)日：2003-01-28
申请号：US10076309
申请日：2002-02-19
申请人： Jae Kwang Kim , Hyun Sub Oh
发明人： Jae Kwang Kim , Hyun Sub Oh
IPC分类号： H01G9042
CPC分类号： H01G9/012
摘要： A tantalum chip capacitor with a cut-grooved anode lead frame is disclosed. The cut-grooved lead frame is designed to allow the tantalum element set in the small-sized epoxy mold package of the capacitor to have a desired size, thus restricting an increase in impedance of the tantalum chip capacitor regardless of a reduction in the size of the package according to the recent trend of smallness of the tantalum chip capacitors. This tantalum chip capacitor has a tantalum element, a anode lead wire extending from the tantalum element, and a cathode lead frame attached at its inside end to the tantalum element and forming a mounting terminal at its outside end. The cut-grooved anode lead frame is welded at its inside end to the lead wire while overlapping a part of the lead wire at the inside end having the cut groove. This anode lead frame also forms a mounting terminal at its outside end. A mold package encloses the tantalum element, the lead wire, a part of the cathode lead frame attached to the tantalum element, and a part of the anode lead frame welded to the lead wire.
摘要翻译：公开了一种具有切槽阳极引线框架的钽片式电容器。切槽引线框架被设计成允许设置在电容器的小尺寸环氧树脂模具封装中的钽元件具有期望的尺寸，从而限制了钽片式电容器的阻抗的增加，而不管其尺寸的减小该封装根据近期钽片电容器的小型化趋势。该钽片电容器具有钽元件，从钽元件延伸的阳极引线和在其内端附接到钽元件的阴极引线框架，并在其外端形成安装端子。切槽阳极引线框架在其内端焊接到引线，同时在具有切割槽的内端处与导线的一部分重叠。该阳极引线框架也在其外端形成安装端子。模具包装件包围钽元件，引线，连接到钽元件的阴极引线框架的一部分，以及焊接到引线的阳极引线框架的一部分。

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