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1. 发明授权

US07755181B2 IC package and method of manufacturing the same 有权
标题翻译： IC封装及其制造方法
公开(公告)号：US07755181B2
公开(公告)日：2010-07-13
申请号：US11872810
申请日：2007-10-16
申请人： Hyun Joo Han , Tae Sang Park , Se Yeong Jang , Young Jun Moon , Jung Hyeon Kim , Sung Wook Kang
发明人： Hyun Joo Han , Tae Sang Park , Se Yeong Jang , Young Jun Moon , Jung Hyeon Kim , Sung Wook Kang
IPC分类号： H01L23/538
CPC分类号： H05K3/3436 , H01L23/3128 , H01L24/73 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1023 , H01L2225/107 , H01L2924/14 , H01L2924/15311 , H05K2201/10378 , H05K2201/10424 , H05K2201/10515 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
摘要翻译：一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到第一个BGA IC封装。

2. 发明申请

US20080157326A1 IC PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： IC封装及其制造方法
公开(公告)号：US20080157326A1
公开(公告)日：2008-07-03
申请号：US11872810
申请日：2007-10-16
申请人： Hyun Joo HAN , Tao Sang Park , Se Yeong Jang , Young Jun Moon , Jung Hyeon Kim , Sung Wook Kang
发明人： Hyun Joo HAN , Tao Sang Park , Se Yeong Jang , Young Jun Moon , Jung Hyeon Kim , Sung Wook Kang
IPC分类号： H01L23/538 , H01L21/60
CPC分类号： H05K3/3436 , H01L23/3128 , H01L24/73 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/1023 , H01L2225/107 , H01L2924/14 , H01L2924/15311 , H05K2201/10378 , H05K2201/10424 , H05K2201/10515 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
摘要翻译：一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到第一个BGA IC封装。

3. 发明申请

US20090139758A1 Printed circuit board assembly and manufacturing method for the same 审中-公开
标题翻译：印刷电路板组装及制造方法相同
公开(公告)号：US20090139758A1
公开(公告)日：2009-06-04
申请号：US12155401
申请日：2008-06-03
申请人： Hyo Young Shin , Seung Boo Jung , Young Jun Moon , Soon Min Hong , Chang Yong Lee , Ja Myeong Koo , Hyun Tae Kim , Jong Bum Lee , Hyun Joo Han
发明人： Hyo Young Shin , Seung Boo Jung , Young Jun Moon , Soon Min Hong , Chang Yong Lee , Ja Myeong Koo , Hyun Tae Kim , Jong Bum Lee , Hyun Joo Han
IPC分类号： H05K3/36 , H01R12/04
CPC分类号： H05K3/361 , H05K3/328 , H05K3/3452 , H05K3/363 , H05K2201/09881 , H05K2201/0989 , H05K2203/0285 , H05K2203/167 , Y10T29/49126
摘要： A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.
摘要翻译：公开了一种印刷电路板（PCB）组件，其包括第一PCB，多个第一电极端子彼此间隔布置在该第一PCB上; 分别与第一电极端子分别连接的多个第二电极端子彼此间隔布置的第二PCB; 以及防止第一和第二电极端子在第一和第二电极端子彼此超声波焊接时偏离其正确位置的防分离部件。因此，由于分离防止部件，第一和第二PCB的相对于彼此的横向运动受到限制，所以多个第一电极端子和第二电极端子可以彼此接合而不偏离其正确的位置。

4. 发明授权

US08327534B2 Method of fabricating printed circuit board assembly 有权
标题翻译：制造印刷电路板组件的方法
公开(公告)号：US08327534B2
公开(公告)日：2012-12-11
申请号：US12926923
申请日：2010-12-17
申请人： Min Young Park , Young Jun Moon , Hyun Joo Han , Gyun Heo , Kyung Woon Jang , Sang il Hong , Dong Seok Baek
发明人： Min Young Park , Young Jun Moon , Hyun Joo Han , Gyun Heo , Kyung Woon Jang , Sang il Hong , Dong Seok Baek
IPC分类号： H01K3/10
CPC分类号： H05K3/321 , H05K3/125 , H05K3/4664 , H05K2201/09436 , H05K2201/09881 , Y10T29/49126 , Y10T29/49128 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.
摘要翻译：本文公开了一种通过将元件粘附到印刷电路板而不使用任何焊料来制造印刷电路板组件的方法。印刷电路板可以通过喷墨打印依次将含有导体的第一油墨和含绝缘体的第二油墨施加到基底基板上来制造，以形成印刷电路板，将元件安装在印刷电路板上，使得元件的电极接触导电层并在高温下固化导电层。

5. 发明申请

US20110154661A1 Method of fabricating printed circuit board assembly 有权
标题翻译：制造印刷电路板组件的方法
公开(公告)号：US20110154661A1
公开(公告)日：2011-06-30
申请号：US12926923
申请日：2010-12-17
申请人： Min Young Park , Young Jun Moon , Hyun Joo Han , Gyun Heo , Kyung Woon Jang , Sang il Hong , Dong Seok Baek
发明人： Min Young Park , Young Jun Moon , Hyun Joo Han , Gyun Heo , Kyung Woon Jang , Sang il Hong , Dong Seok Baek
IPC分类号： H05K3/10
CPC分类号： H05K3/321 , H05K3/125 , H05K3/4664 , H05K2201/09436 , H05K2201/09881 , Y10T29/49126 , Y10T29/49128 , Y10T29/49133 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed herein is a method for fabricating a printed circuit board assembly by adhering an element to a printed circuit board without using any solder. The printed circuit board may be fabricated by sequentially applying a conductor-containing first ink and an insulator-containing second ink onto a base substrate by ink-jet printing to form a printed circuit board, mounting an element on the printed circuit board such that an electrode of the element contacts a conductive layer and curing the conductive layer at a high temperature.
摘要翻译：本文公开了一种通过将元件粘附到印刷电路板而不使用任何焊料来制造印刷电路板组件的方法。印刷电路板可以通过喷墨打印依次施加含有导体的第一油墨和含绝缘体的第二油墨到基底基板上以形成印刷电路板，将元件安装在印刷电路板上，从而使印刷电路板元件的电极接触导电层并在高温下固化导电层。

6. 发明申请

US20120043116A1 Interconnection Structure Of Interposer With Low CTE And Packaging Component Having The Same 审中-公开
标题翻译：具有低CTE和包装组件的插入器的互连结构
公开(公告)号：US20120043116A1
公开(公告)日：2012-02-23
申请号：US13211596
申请日：2011-08-17
申请人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong
发明人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H01L23/49833 , H01L23/147 , H01L23/15 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L2224/48227 , H01L2924/09701 , H01L2924/15311 , H01L2924/19107
摘要： Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB.
摘要翻译：这里公开了由诸如硅，玻璃或陶瓷的脆性材料制成的印刷电路板组件，并且设置有将其与外部连接构件电连接的连接器，以及用于模制印刷电路板组件的方法，其中印刷电路板通过向其上施加聚合物树脂来模塑组装以赋予印刷电路板组件的硬度，并且将其连接到外部连接构件的电极端子暴露于外部。这里公开的是内插器的互连结构，通过焊接点电连接到主印刷电路板（PCB）的互连结构插入在插入件和焊点之间，以防止或减少焊点上的应力集中，引起通过插入器和主PCB之间的系数热膨胀差异。

7. 发明申请

US20120018186A1 CASE STRUCTURE HAVING FILM TYPE ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：具有薄膜型电子电路的壳体结构及其制造方法
公开(公告)号：US20120018186A1
公开(公告)日：2012-01-26
申请号：US13177199
申请日：2011-07-06
申请人： Ja Myeong Koo , Soon Min Hong , Tae Sang Park , Young Jun Moon , Gyun Heo , Sun Gu Yi
发明人： Ja Myeong Koo , Soon Min Hong , Tae Sang Park , Young Jun Moon , Gyun Heo , Sun Gu Yi
IPC分类号： H05K5/02 , H01B13/00 , B32B37/00
CPC分类号： H05K3/0058 , B32B37/1207 , B32B37/185 , B32B38/145 , B32B2037/1223 , B32B2038/0092 , B32B2309/105 , B32B2457/14 , H05K2201/0999 , H05K2201/10098
摘要： Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.
摘要翻译：这里公开了附着有薄膜式电子电路的电子产品的壳体结构。壳体结构可以包括电子产品和粘附到壳体上的第一膜的壳体。壳体结构还可以包括粘附到第一膜的第二膜，使得第二膜的一个表面接触第一膜，以及粘附到第一膜的电子电路层。电子电路层可以布置在第一膜和第二膜之间，其中第一膜热粘附到壳体上。第一膜可以具有低于壳体的耐热温度的熔点。

8. 发明授权

US09197026B2 Molding method of printed circuit board assembly 有权
标题翻译：印刷电路板组装成型方法
公开(公告)号：US09197026B2
公开(公告)日：2015-11-24
申请号：US13211652
申请日：2011-08-17
申请人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong
发明人： Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong
IPC分类号： H01R43/00 , H05K13/00 , H01R43/24
CPC分类号： H01R43/24 , Y10T29/49147
摘要： Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.
摘要翻译：公开了一种印刷电路板组件PBA，其上安装有用于与外部连接元件电连接的连接器。这种组件可以用PBA的模制方法形成，其包括将聚合物树脂施加到PBA以模制PBA以便提供刚度。根据本公开的上述PBA成型方法是包括PCB和连接在PCB上以将其与外部连接元件电连接的连接器的PBA的成型方法。该方法包括将连接器与连接器盖组合，将树脂施加到与连接器盖结合的PBA上，以执行PBA的成型，以及将连接器盖与模制的PBA分离，以露出用于外部连接元件的电极端子。

9. 发明授权

US08971047B2 Printed circuit board assembly 有权
标题翻译：印刷电路板组装
公开(公告)号：US08971047B2
公开(公告)日：2015-03-03
申请号：US13610145
申请日：2012-09-11
申请人： Yong Won Lee , Tae Sang Park , Hyo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
发明人： Yong Won Lee , Tae Sang Park , Hyo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
IPC分类号： H05K1/00 , H05K1/14 , H05K3/28 , H05K3/36 , H05K5/06 , H05K1/18 , H05K3/32
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.
摘要翻译：一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板包括形成有晶片的晶片印刷电路板。

10. 发明申请

US20130077265A1 PRINTED CIRCUIT BOARD ASSEMBLY 有权
标题翻译：印刷电路板组装
公开(公告)号：US20130077265A1
公开(公告)日：2013-03-28
申请号：US13610145
申请日：2012-09-11
申请人： Yong Won Lee , Tae Sang Park , Hvo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
发明人： Yong Won Lee , Tae Sang Park , Hvo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
IPC分类号： H05K1/18
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.
摘要翻译：一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板包括形成有晶片的晶片印刷电路板。

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