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1. 发明授权

US06989102B1 Alginate gel based adsorbents for heavy metal removal 失效
标题翻译：用于重金属去除的藻酸盐凝胶基吸附剂
公开(公告)号：US06989102B1
公开(公告)日：2006-01-24
申请号：US09469818
申请日：1999-12-22
申请人： Hyun Gyu Park , Kyung Hwa Kim , Myeong Yun Chae , Eu Gene Oh , Eun Yeol Lee
发明人： Hyun Gyu Park , Kyung Hwa Kim , Myeong Yun Chae , Eu Gene Oh , Eun Yeol Lee
IPC分类号： C02F1/28
CPC分类号： C08B37/0084 , B01J20/20 , B01J20/26 , B01J20/262 , B01J20/267 , B01J2220/46 , C02F1/283 , C02F1/286 , C02F1/288 , C02F2101/20 , C02F2101/322 , C08J3/075 , C08J2305/04 , C08L3/02 , C08L5/00 , C08L5/04 , C08L97/02 , C08L2205/02 , Y02W10/37 , C08L2666/26
摘要： An alginate gel adsorbent to remove heavy metal ions according to the present invention is prepared by adding dropwisely 0.1-5 wt % alginate solution to a polyvalent cationic solution thereby cross-linking alginic acid with polyvalent cations. An alginate gel adsorbent containing activated carbon capable of simultaneously removing heavy metal ions and organotoxic materials, that is, activated carbon/alginate gel adsorbent, is prepared by adding dropwisely a mixed solution of 0.17-10 wt % of alginate and 0.1-10 wt % of activated carbon powder to a polyvalent cationic solution thereby cross-linking alginic acid with polyvalent cations in order to immobilize polyvalent cation to alginic acid containing activated carbon. The polyvalent cationic solution is selected from the group consisting of calcium chloride (CaCl2), strontium chloride (SrCl2), barium chloride (BaCl2) and aluminium chloride (AlCl3). A flat board or a thin membrane coated alginate gel adsorbent can be prepared by coating alginate gels onto a supporter such as paper, wood plate and textile fabrics. The alginate gel adsorbent for water purification can be applied to a water purifier as well as a process of wastewater treatment. The alginate gel coated onto a supporter is prepared by immersing a supporter in 0.05-5 wt % alginate solution so that the supporter may uniformly adsorb the alginate solution, immersing the supporter in a polyvalent cationic solution thereby forming alginate gel on the surface of the supporter, and drying the supporter formed with alginate gel thereon.
摘要翻译：通过将0.1-5重量％的藻酸盐溶液滴加到多价阳离子溶液中，由此将藻酸与多价阳离子交联，制备了根据本发明的用于去除重金属离子的藻酸盐凝胶吸附剂。通过滴加0.17-10重量％的藻酸盐和0.1-10重量％的藻酸盐的混合溶液，制备含有能够同时除去重金属离子和有机毒物质的活性炭的藻酸盐凝胶吸附剂，即活性炭/藻酸盐凝胶吸附剂，的活性炭粉末与多价阳离子溶液反应，从而将藻酸与多价阳离子交联，以便将多价阳离子固定在含藻酸的活性炭中。多价阳离子溶液选自氯化钙（CaCl 2 Cl 2），氯化锶（SrCl 2 Cl 2），氯化钡（BaCl 2 N 2） >）和氯化铝（AlCl 3 3）。可以通过将藻酸盐凝胶涂布在诸如纸，木板和纺织品的支撑物上来制备平板或薄膜包衣藻酸盐凝胶吸附剂。用于水净化的藻酸盐凝胶吸附剂可以应用于净水器以及废水处理过程。通过将支持体浸渍在0.05-5重量％的藻酸盐溶液中来制备涂覆在支持体上的藻酸盐凝胶，使得载体可以均匀地吸附藻酸盐溶液，将载体浸入多价阳离子溶液中，从而在支持物的表面上形成藻酸盐凝胶，并将其上形成有藻酸盐凝胶的载体干燥。

2. 发明授权

US09451695B2 Epoxy resin compound and radiant heat circuit board using the same 有权
标题翻译：环氧树脂复合物和使用其的辐射热电路板
公开(公告)号：US09451695B2
公开(公告)日：2016-09-20
申请号：US14119122
申请日：2012-05-21
申请人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
发明人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
IPC分类号： C08L63/00 , C08K3/10 , C08K3/22 , C08K3/36 , C08K3/38 , H05K1/05 , C08G59/62 , C08G59/68 , C09K5/14 , C08K3/28 , C08K3/00
CPC分类号： H05K1/05 , C08G59/621 , C08G59/686 , C08K3/013 , C08K3/36 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08L63/00 , C09K5/14 , H05K1/056 , H05K2201/0209 , H05K2201/10106
摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译：提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。环氧树脂包括化学式的环氧树脂。因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。此外，可以通过使用上述环氧树脂作为印刷电路板的绝缘材料来提供高辐射热板。

3. 发明授权

US08759021B2 Microorganism for quantifying homocysteine, and use thereof 有权
标题翻译：用于定量同型半胱氨酸的微生物及其用途
公开(公告)号：US08759021B2
公开(公告)日：2014-06-24
申请号：US13698924
申请日：2010-05-20
申请人： Hyun Gyu Park , Min-Ah Woo , Moon Il Kim , Sang-Joon Hwang , Dae-Yeon Cho
发明人： Hyun Gyu Park , Min-Ah Woo , Moon Il Kim , Sang-Joon Hwang , Dae-Yeon Cho
IPC分类号： C12Q1/02 , C12Q1/04 , C12P1/00 , C12N1/00 , C12N1/12 , C12N1/20
CPC分类号： C12Q1/6897 , C12Q1/02 , G01N33/6815 , G01N2333/245
摘要： Provided are a microorganism for use in quantification of homocysteine and methionine and a method of quantifying homocysteine and methionine in a sample by using the microorganism.
摘要翻译：提供用于定量同型半胱氨酸和甲硫氨酸的微生物以及通过使用微生物定量样品中同型半胱氨酸和甲硫氨酸的方法。

4. 发明授权

US09549458B2 Radiant heat circuit board, heat generating device package having the same, and backlight unit 有权
标题翻译：辐射热电路板，具有相同的发热装置封装和背光单元
公开(公告)号：US09549458B2
公开(公告)日：2017-01-17
申请号：US13878319
申请日：2011-10-05
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K1/02 , H01L25/075 , H05K1/05 , H01L23/367 , H01L23/498 , H01L33/64
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供一种用于安装多个发热装置的辐射热电路板。辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。因此，可以在发热装置之间设置辐射突起以改善热辐射。

5. 发明申请

US20140336082A1 DNA CHIP FOR DIAGNOSIS OF GENITOURINARY INFECTIONS 有权
标题翻译：用于诊断遗传性感染的DNA芯片
公开(公告)号：US20140336082A1
公开(公告)日：2014-11-13
申请号：US14361678
申请日：2011-11-29
申请人： Hyun Gyu Park , Ye Lim Jung , Won-Young Chung , Ki Soo Park , Cheulhee Jung , Sung Chul Shin , Dae-Yeon Cho , Sangjoon Hwang , Hyo Won Park
发明人： Hyun Gyu Park , Ye Lim Jung , Won-Young Chung , Ki Soo Park , Cheulhee Jung , Sung Chul Shin , Dae-Yeon Cho , Sangjoon Hwang , Hyo Won Park
IPC分类号： C12Q1/68 , C12Q1/70
CPC分类号： C12Q1/689 , C12Q1/6837 , C12Q1/6883 , C12Q1/6895 , C12Q1/705 , C12Q2600/112 , C12Q2600/16
摘要： A DNA chip for diagnosis of genitourinary infection, and in particular, a DNA chip for diagnosis of genitourinary infection on which oligonucleotide probes for detecting fourteen genitourinary infection pathogens are immobilized is provided. The DNA chip for diagnosis of genitourinary infections may accurately and rapidly analyze infections of fourteen genitourinary infections including multiple infections in various samples with high sensitivity, high specificity, and high reproducibility. Accordingly, the DNA chip may be used for diagnosis and treatment of genitourinary infections in primary health care institutions.
摘要翻译：提供用于诊断泌尿生殖感染的DNA芯片，特别是用于诊断泌尿生殖感染的DNA芯片，其中用于检测14种泌尿生殖感染病原体的寡核苷酸探针是固定的。用于诊断泌尿生殖感染的DNA芯片可以准确和快速地分析14种生殖泌尿感染，包括多种感染，多种感染，高灵敏度，高特异性和高重现性的感染。因此，DNA芯片可用于诊断和治疗初级卫生保健机构的泌尿生殖感染。

6. 发明申请

US20130188359A1 RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 有权
标题翻译：辐射热电路板，其制造方法，具有该发光装置的发热装置包和背光
公开(公告)号：US20130188359A1
公开(公告)日：2013-07-25
申请号：US13878637
申请日：2011-10-10
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K7/20 , H05K13/00 , H05K3/30 , F21V29/00
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供一种用于安装多个发热装置的辐射热电路板。辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。因此，可以在发热装置之间设置辐射突起以改善热辐射。

7. 发明申请

US20130118782A1 RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：辐射热电路板及其制造方法
公开(公告)号：US20130118782A1
公开(公告)日：2013-05-16
申请号：US13811365
申请日：2011-07-15
申请人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
发明人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
IPC分类号： H05K1/18 , H05K1/03 , H05K1/09
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
摘要翻译：公开了一种辐射热电路板及其制造方法。用于在其上安装发热装置的辐射热电路板包括金属板，该金属板包括金属突起，该金属突起具有焊料，发光装置附着到该金属突起上，金属突起上的接合层，金属板以暴露金属突起，以及绝缘层上的电路图案。通过在安装垫下方设置包括散热突起的金属板，将从发热装置发出的热量直接传递到金属板，从而提高散热效率。热辐射突起的表面镀有包含铜的合金，从而提高相对于焊料的粘合性，从而降低了故障率。

8. 发明申请

US20130059656A1 METHOD, APPARATUS, AND RECORDING MEDIUM FOR PLAYING GAME WITH SERVER TRANSFERRING IN ONLINE GAME ENVIRONMENT 有权
标题翻译：在线游戏环境中使用服务器播放游戏的方法，装置和记录媒体
公开(公告)号：US20130059656A1
公开(公告)日：2013-03-07
申请号：US13698482
申请日：2011-05-17
申请人： Jung Han Kim , Hyun Chul Kim , Hyun Gyu Park
发明人： Jung Han Kim , Hyun Chul Kim , Hyun Gyu Park
IPC分类号： A63F9/24
CPC分类号： A63F13/352 , A63F13/12 , A63F13/335 , A63F13/49 , A63F13/71 , A63F2300/513 , A63F2300/531 , A63F2300/554 , A63F2300/807 , H04L67/38
摘要： Disclosed are a method, an apparatus, and a recording medium for playing a game with server transferring in an online game environment. The method includes: receiving identification information for login from a first client; transmitting online game environment information to the first client; performing an advance operation of the server transferring for a server transferring of a second client with an outside server; receiving data for playing the game transmitted from the outside server or the second client; transmitting a resulting data of game play, in which the received data is applied to the online game environment, to the outside server or the second client, which has transmitted the data for playing the game; and storing a result of an interaction generated between the first client and the second client in a game history of the first client.
摘要翻译：公开了一种用于在在线游戏环境中玩服务器传送的游戏的方法，装置和记录介质。该方法包括：从第一客户端接收用于登录的识别信息; 将网络游戏环境信息传送给第一客户端; 执行所述服务器的传送的前进操作，用于服务器与外部服务器传送第二客户端; 从外部服务器或第二客户端接收用于播放游戏的数据; 将接收到的数据应用于在线游戏环境的游戏结果数据发送到已经发送用于玩游戏的数据的外部服务器或第二客户端; 以及将在所述第一客户端和所述第二客户端之间生成的交互的结果存储在所述第一客户端的游戏历史中。

9. 发明授权

US09844142B2 Radiant heat circuit board and method for manufacturing the same 有权
公开(公告)号：US09844142B2
公开(公告)日：2017-12-12
申请号：US13811365
申请日：2011-07-15
申请人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
发明人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
IPC分类号： H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K1/03 , H05K1/09 , H01L23/367
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

10. 发明授权

US09307675B2 Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight 有权
标题翻译：辐射热电路板，其制造方法，具有该发热装置的发热装置封装以及背光源
公开(公告)号：US09307675B2
公开(公告)日：2016-04-05
申请号：US13878637
申请日：2011-10-10
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： F21V29/00 , H05K7/20 , H01L23/367 , H01L25/075 , H01L33/64 , H05K3/30 , H05K13/00 , G02F1/1335 , H05K1/02 , H05K3/46 , F21V29/70 , H05K1/05 , H05K1/11
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供一种用于安装多个发热装置的辐射热电路板。辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。因此，可以在发热装置之间设置辐射突起以改善热辐射。

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