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1. 发明授权

US08658471B2 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof 有权
公开(公告)号：US08658471B2
公开(公告)日：2014-02-25
申请号：US13142172
申请日：2009-12-23
申请人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
发明人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
IPC分类号： H01L21/00 , H01L23/495
摘要： The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

2. 发明授权

US08956919B2 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof 有权
标题翻译：多行引线框及其半导体封装的结构及其制造方法
公开(公告)号：US08956919B2
公开(公告)日：2015-02-17
申请号：US13142172
申请日：2009-12-23
申请人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
发明人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L23/00
CPC分类号： H01L21/4832 , H01L23/49582 , H01L24/29 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
摘要翻译：本发明涉及一种用于半导体封装的多列引线框，其特征在于：在引线框架材料上形成电镀图案（第一步骤）; 在电镀图案上形成保护图案（第二工序）; 并且通过使用保护图案作为掩模形成纳米图案（第三步骤），由此在电镀图案的上表面上形成保护图案，以通过防止由蚀刻溶液导致的镀层损伤而提高产品的可靠性引线框架的图案形成，从而解决了使用镀层作为蚀刻掩模的问题。

3. 发明申请

US20120038036A1 Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof 有权
标题翻译：多行引线框和半导体封装结构及其制造方法
公开(公告)号：US20120038036A1
公开(公告)日：2012-02-16
申请号：US13142172
申请日：2009-12-23
申请人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
发明人： Hyun A. Chun , Jae Bong Choi , Sung Won Lee , Sung Wuk Ryu , Hyuk Soo Lee , Sai Ran Eom
IPC分类号： H01L23/495 , G03F7/20 , H01L21/60
CPC分类号： H01L21/4832 , H01L23/49582 , H01L24/29 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
摘要翻译：本发明涉及一种用于半导体封装的多列引线框，其特征在于：在引线框架材料上形成电镀图案（第一步骤）; 在电镀图案上形成保护图案（第二工序）; 并且通过使用保护图案作为掩模形成纳米图案（第三步骤），由此在电镀图案的上表面上形成保护图案，以通过防止由蚀刻溶液导致的镀层损伤而提高产品的可靠性引线框架的图案形成，从而解决了使用镀层作为蚀刻掩模的问题。

4. 发明授权

US06451348B1 Method of manufacturing porous matrix-type controlled release systems using emulsion technique 失效
标题翻译：使用乳液技术制造多孔基质型控释系统的方法
公开(公告)号：US06451348B1
公开(公告)日：2002-09-17
申请号：US09331991
申请日：2000-01-03
申请人： Seo Young Jeong , Kuiwon Choi , Ick-Chan Kwon , Yong-Hee Kim , Jae Bong Choi , Kyu Back Lee
发明人： Seo Young Jeong , Kuiwon Choi , Ick-Chan Kwon , Yong-Hee Kim , Jae Bong Choi , Kyu Back Lee
IPC分类号： A61K900
CPC分类号： A61K9/7007 , Y10S514/953 , Y10S514/964 , Y10S514/975
摘要： A method of manufacturing a porous matrix-type drug delivery system is provided. It comprises the steps of: dispersing, stirring, and emulsifying an aqueous solution of a drug in an organic solvent having a polymer compound and a surface active agent solved therein; thereafter forming it into a desirable matrix shape; lyophilizing or drying it at a low temperature or room temperature until the matrix surface is hardened; and drying it again in order to remove the water and the organic solvent.
摘要翻译：提供一种制造多孔基质型药物递送系统的方法。它包括以下步骤：将药物的水溶液分散，搅拌和乳化在溶解有高分子化合物和表面活性剂的有机溶剂中; 然后将其形成为期望的矩阵形状; 在低温或室温下冻干或干燥，直到基质表面硬化; 并再次干燥以除去水和有机溶剂。

5. 发明授权

US09057854B2 Optical printed circuit board and method of manufacturing the same 有权
标题翻译：光学印刷电路板及其制造方法
公开(公告)号：US09057854B2
公开(公告)日：2015-06-16
申请号：US13060313
申请日：2009-11-05
申请人： Jae Bong Choi , Joon Wook Han
发明人： Jae Bong Choi , Joon Wook Han
IPC分类号： G02B6/12 , G02B6/43 , G02B6/36 , G02B6/42
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/3644 , G02B6/4214
摘要： An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.
摘要翻译：提供了一种光学印刷电路板。光学印刷电路板包括绝缘构件，设置在绝缘构件中并且具有暴露于绝缘构件的侧面的相对端部的光纤，以及至少一个支撑构件，该支撑构件设置有引导部分，该引导部分连接到绝缘构件的相对端部光纤和光纤的引导弯曲。

6. 发明申请

US20120263412A1 Optical Printed Circuit Board and Method of Fabricating the Same 有权
标题翻译：光学印刷电路板及其制造方法
公开(公告)号：US20120263412A1
公开(公告)日：2012-10-18
申请号：US13500779
申请日：2010-03-24
申请人： Jae Bong Choi
发明人： Jae Bong Choi
IPC分类号： G02B6/12 , H05K3/06 , H05K3/10
CPC分类号： G02B6/43 , H01L24/24 , H01L2224/04105 , H01L2224/24227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/15192 , H05K1/0274 , H05K1/185 , H05K3/4602 , Y10T29/49155 , Y10T29/49156 , H01L2924/00
摘要： Provided are a photovoltaic apparatus and a manufacturing method thereof. The photovoltaic apparatus includes: substrate; a back electrode layer disposed on the substrate; a plurality of first intermediate layers disposed on the back electrode layer; a plurality of second intermediate layers disposed on the back electrode layer and each disposed between the first intermediate layers; light absorbing layers disposed on the first intermediate layers and the second intermediate layers; and a front electrode layer disposed on the light absorbing layer.
摘要翻译：提供一种光电装置及其制造方法。光电装置包括：基板; 设置在基板上的背面电极层; 设置在背面电极层上的多个第一中间层; 多个第二中间层，设置在所述背面电极层上，并且各自设置在所述第一中间层之间; 设置在第一中间层和第二中间层上的光吸收层; 以及设置在光吸收层上的前电极层。

7. 发明申请

US20120002916A1 Optical Module, and Optical Printed Circuit Board and Method of Manufacturing the Same 有权
标题翻译：光学模块和光学印刷电路板及其制造方法
公开(公告)号：US20120002916A1
公开(公告)日：2012-01-05
申请号：US13144960
申请日：2009-11-26
申请人： Jae Bong Choi , Joon Wook Han
发明人： Jae Bong Choi , Joon Wook Han
IPC分类号： G02B6/122 , G02B6/13 , G02B6/36
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/4214 , G02B6/4292
摘要： Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.
摘要翻译：提供了一种光学模块和光学印刷电路板及其制造方法。光学模块包括光纤，耦合到光纤的一端的第一套圈和耦合到光纤的另一端的第二套圈。光学印刷电路板包括第一板，光发射模块和光接收模块，它们设置在第一板上，通过第一板的光纤，光纤从光发送器的下侧整体延伸模块到光接收器模块的下侧，第一和第二套圈分别耦合到光纤的一端和另一端，第一和第二套圈分别由第一板支撑，第二板通过该第二板通过光学光纤通过，第二板设置在第一板下方。

8. 发明申请

US20110216999A1 OPTICAL PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：光学印刷电路板及其制造方法
公开(公告)号：US20110216999A1
公开(公告)日：2011-09-08
申请号：US13060313
申请日：2009-11-05
申请人： Jae Bong Choi , Joon Wook Han
发明人： Jae Bong Choi , Joon Wook Han
IPC分类号： G02B6/122 , G02B6/13
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/3644 , G02B6/4214
摘要： An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.
摘要翻译：提供了一种光学印刷电路板。光学印刷电路板包括绝缘构件，设置在绝缘构件中并且具有暴露于绝缘构件的侧面的相对端部的光纤，以及至少一个支撑构件，该支撑构件设置有引导部分，该引导部分连接到绝缘构件的相对端部光纤和光纤的引导弯曲。

9. 发明授权

US09323017B2 Optical module, and optical printed circuit board and method of manufacturing the same 有权
标题翻译：光模块和光印刷电路板及其制造方法
公开(公告)号：US09323017B2
公开(公告)日：2016-04-26
申请号：US13144960
申请日：2009-11-26
申请人： Jae Bong Choi , Joon Wook Han
发明人： Jae Bong Choi , Joon Wook Han
IPC分类号： G02B6/12 , G02B6/43 , G02B6/36 , G02B6/42
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/4214 , G02B6/4292
摘要： Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.
摘要翻译：提供了一种光学模块和光学印刷电路板及其制造方法。光学模块包括光纤，耦合到光纤的一端的第一套圈和耦合到光纤的另一端的第二套圈。光学印刷电路板包括第一板，光发射模块和光接收模块，它们设置在第一板上，通过第一板的光纤，光纤从光发送器的下侧整体延伸模块到光接收器模块的下侧，第一和第二套圈分别耦合到光纤的一端和另一端，第一和第二套圈分别由第一板支撑，第二板通过该第二板通过光学光纤通过，第二板设置在第一板下方。

10. 发明授权

US08590144B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US08590144B2
公开(公告)日：2013-11-26
申请号：US12919914
申请日：2009-03-02
申请人： Hye Sun Yoon , Jae Bong Choi , Eun Jung Lee , Jung Ho Hwang , Joon Wook Han
发明人： Hye Sun Yoon , Jae Bong Choi , Eun Jung Lee , Jung Ho Hwang , Joon Wook Han
IPC分类号： H05K1/03 , H05K3/00
CPC分类号： H05K3/0097 , H05K1/036 , H05K1/0366 , H05K3/0052 , H05K3/06 , H05K3/107 , H05K3/244 , H05K3/3452 , H05K2201/0209 , H05K2201/0355 , H05K2201/068 , H05K2203/0278 , H05K2203/0315 , H05K2203/1536
摘要： Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.
摘要翻译：提供一种制造印刷电路板的方法，包括：在分离部件的两侧设置第一绝缘部件和第二绝缘部件以及第一导电膜和第二导电膜，对第一绝缘部件和第二绝缘部件进行热压接，在所述分离构件的两侧上形成膜，以将所述第一构件与所述分隔构件连接在所述第二构件上，并将所述第一绝缘构件附接到所述第一导电膜，并且将所述第二绝缘构件附接到所述第二导电膜，去除第一和第二导电膜以形成第一和第二电路图案，以及切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案与分离构件分离。

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